HK13395A - Circuit boards - Google Patents

Circuit boards

Info

Publication number
HK13395A
HK13395A HK13395A HK13395A HK13395A HK 13395 A HK13395 A HK 13395A HK 13395 A HK13395 A HK 13395A HK 13395 A HK13395 A HK 13395A HK 13395 A HK13395 A HK 13395A
Authority
HK
Hong Kong
Prior art keywords
circuit boards
boards
circuit
Prior art date
Application number
HK13395A
Other languages
English (en)
Inventor
Bayes Martin
Original Assignee
Enthone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone filed Critical Enthone
Publication of HK13395A publication Critical patent/HK13395A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
HK13395A 1989-05-01 1995-02-06 Circuit boards HK13395A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34580489A 1989-05-01 1989-05-01

Publications (1)

Publication Number Publication Date
HK13395A true HK13395A (en) 1995-02-10

Family

ID=23356553

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13395A HK13395A (en) 1989-05-01 1995-02-06 Circuit boards

Country Status (6)

Country Link
JP (1) JPH0734501B2 (xx)
DE (1) DE4013094A1 (xx)
FR (1) FR2646583B1 (xx)
GB (1) GB2232168B (xx)
HK (1) HK13395A (xx)
IT (1) IT1241204B (xx)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5358602A (en) * 1993-12-06 1994-10-25 Enthone-Omi Inc. Method for manufacture of printed circuit boards
JP3393190B2 (ja) * 1999-02-22 2003-04-07 有限会社関東学院大学表面工学研究所 銅パターンの選択的活性化方法およびこれに用いる活性化剤

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3698944A (en) * 1970-06-15 1972-10-17 Texas Instruments Inc Method of obtaining phased growth of epitaxial layers
US4662944A (en) * 1972-07-11 1987-05-05 Kollmorgen Technologies Corporation Process and composition for sensitizing articles for metallization
US4748056A (en) * 1972-07-11 1988-05-31 Kollmorgen Corporation Process and composition for sensitizing articles for metallization
US3976816A (en) * 1973-10-29 1976-08-24 Enthone, Incorporated Activation of surfaces intended for electroless plating
AR218223A1 (es) * 1975-05-05 1980-05-30 Borg Warner Composicion cataliticamente activa
DE2538571A1 (de) * 1975-08-29 1977-03-03 Siemens Ag Verfahren zur metallisierung von duroplasten, insbesondere phenolharzen
US4150171A (en) * 1976-03-30 1979-04-17 Surface Technology, Inc. Electroless plating
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
US4167596A (en) * 1977-08-01 1979-09-11 Nathan Feldstein Method of preparation and use of electroless plating catalysts
GB2013722A (en) * 1978-01-19 1979-08-15 Canning W Materials Ltd Plating process
US4233344A (en) * 1978-07-20 1980-11-11 Learonal, Inc. Method of improving the adhesion of electroless metal deposits employing colloidal copper activator
US4234628A (en) * 1978-11-28 1980-11-18 The Harshaw Chemical Company Two-step preplate system for polymeric surfaces
US4448811A (en) * 1981-12-30 1984-05-15 Omi International Corporation Oxidizing agent for acidic accelerator in electroless metal plating process
ZA843704B (en) * 1983-07-01 1985-09-25 Macdermid Inc Oxidizing accelerator
JPS6036674A (ja) * 1983-08-08 1985-02-25 Hitachi Chem Co Ltd 無電解銅めつきに対する活性化法
DE3504455A1 (de) * 1984-02-17 1985-08-22 Omi International Corp. (eine Gesellschaft n.d.Ges.d. Staates Delaware), Warren, Mich. Verfahren zur behandlung eines elektrisch nicht leitenden substrats vor der stromlosen metallisierung
US4592852A (en) * 1984-06-07 1986-06-03 Enthone, Incorporated Composition and process for treating plastics with alkaline permanganate solutions
US4684550A (en) * 1986-04-25 1987-08-04 Mine Safety Appliances Company Electroless copper plating and bath therefor
CN87100440B (zh) * 1987-01-27 1988-05-11 中国人民解放军装甲兵工程学院 在不导电材料上刷镀铜的方法
US4873136A (en) * 1988-06-16 1989-10-10 General Electric Company Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom

Also Published As

Publication number Publication date
FR2646583B1 (fr) 1992-01-24
DE4013094A1 (de) 1990-11-15
IT9067307A1 (it) 1991-10-24
FR2646583A1 (fr) 1990-11-02
IT1241204B (it) 1993-12-29
DE4013094C2 (xx) 1993-07-22
GB2232168A (en) 1990-12-05
GB2232168B (en) 1993-06-16
JPH02303181A (ja) 1990-12-17
GB9009796D0 (en) 1990-06-20
IT9067307A0 (it) 1990-04-24
JPH0734501B2 (ja) 1995-04-12

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20050501