IT1195963B - Procedimento di fabbricazione di circuiti stampati - Google Patents
Procedimento di fabbricazione di circuiti stampatiInfo
- Publication number
- IT1195963B IT1195963B IT24690/82A IT2469082A IT1195963B IT 1195963 B IT1195963 B IT 1195963B IT 24690/82 A IT24690/82 A IT 24690/82A IT 2469082 A IT2469082 A IT 2469082A IT 1195963 B IT1195963 B IT 1195963B
- Authority
- IT
- Italy
- Prior art keywords
- manufacturing procedure
- printed circuits
- circuits manufacturing
- printed
- procedure
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33001181A | 1981-12-11 | 1981-12-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8224690A0 IT8224690A0 (it) | 1982-12-10 |
IT1195963B true IT1195963B (it) | 1988-11-03 |
Family
ID=23287944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT24690/82A IT1195963B (it) | 1981-12-11 | 1982-12-10 | Procedimento di fabbricazione di circuiti stampati |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0096701B1 (it) |
JP (1) | JPS58502079A (it) |
CA (1) | CA1189630A (it) |
DE (1) | DE3279915D1 (it) |
ES (2) | ES518093A0 (it) |
GB (1) | GB2111313B (it) |
IT (1) | IT1195963B (it) |
WO (1) | WO1983002172A1 (it) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4566186A (en) * | 1984-06-29 | 1986-01-28 | Tektronix, Inc. | Multilayer interconnect circuitry using photoimageable dielectric |
US4613560A (en) * | 1984-12-28 | 1986-09-23 | E. I. Du Pont De Nemours And Company | Photosensitive ceramic coating composition |
US4915983A (en) * | 1985-06-10 | 1990-04-10 | The Foxboro Company | Multilayer circuit board fabrication process |
EP0211180A3 (en) * | 1985-08-02 | 1989-08-09 | Shipley Company Inc. | Method for manufacture of multilayer circuit board |
JPS6233135A (ja) * | 1985-08-06 | 1987-02-13 | Sanyo Kokusaku Pulp Co Ltd | 新規(メタ)アクリレート化合物 |
EP0259784A3 (en) * | 1986-09-11 | 1988-10-12 | General Electric Company | Photo-imaged dielectric layer |
KR950003244B1 (ko) * | 1986-12-17 | 1995-04-06 | 더 폭스보로 컴패니 | 다층 회로판 제조공정 |
DE3881911D1 (de) * | 1987-03-09 | 1993-07-29 | Siemens Nixdorf Inf Syst | Aufbautechnik fuer mehrlagige verdrahtungen. |
EP0292219A3 (en) * | 1987-05-21 | 1989-10-11 | AT&T Corp. | Printed circuit board fabrication |
DE3840207A1 (de) * | 1988-11-29 | 1990-05-31 | Draegerwerk Ag | Verfahren zur herstellung einer leiterplatte mit mehreren leiterbahnebenen und entsprechende multilayer-leiterplatte |
US5362534A (en) * | 1993-08-23 | 1994-11-08 | Parlex Corporation | Multiple layer printed circuit boards and method of manufacture |
EP0766908B1 (de) * | 1994-06-23 | 1998-12-16 | Hans-Jürgen Dipl.-Ing. Schäfer | Verfahren und vorrichtung zum beschichten von leiterplatten, insbesondere zur herstellung von multi-chip-modulen |
TW277204B (it) * | 1994-12-02 | 1996-06-01 | Nippon Paint Co Ltd | |
JP2000156564A (ja) * | 1998-11-20 | 2000-06-06 | Nec Corp | プリント配線板及びその製造方法 |
CN107620388B (zh) * | 2017-09-21 | 2022-11-15 | 南京工业大学 | 木龙骨与面板的叠合橡胶连接结构 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3269861A (en) * | 1963-06-21 | 1966-08-30 | Day Company | Method for electroless copper plating |
US3615469A (en) * | 1969-06-02 | 1971-10-26 | Goodrich Co B F | Polymeric printing plates |
US3649274A (en) * | 1969-09-18 | 1972-03-14 | Bunker Ramo | Coaxial circuit construction method |
US3922479A (en) * | 1971-09-15 | 1975-11-25 | Bunker Ramo | Coaxial circuit construction and method of making |
BE793030A (fr) * | 1971-12-20 | 1973-04-16 | Goodrich Co B F | Procede pour la realisation de matieres plastiques de resine epoxy |
US3980483A (en) * | 1972-04-24 | 1976-09-14 | Nippon Oil Seal Industry Co., Ltd. | Photocurable composition |
US3816281A (en) * | 1973-04-30 | 1974-06-11 | American Can Co | Poly(vinyl pyrrolidone)stabilized polymerized epoxy compositions and process for irradiating same |
US3934335A (en) * | 1974-10-16 | 1976-01-27 | Texas Instruments Incorporated | Multilayer printed circuit board |
GB2049972B (en) * | 1977-07-12 | 1982-06-23 | Asahi Chemical Ind | Photosensitive element for producing a printed circuit board |
JPS5426471A (en) * | 1977-07-30 | 1979-02-28 | Matsushita Electric Works Ltd | Method of manufacturing multiilayer printed wiring board |
US4157407A (en) * | 1978-02-13 | 1979-06-05 | E. I. Du Pont De Nemours And Company | Toning and solvent washout process for making conductive interconnections |
US4225661A (en) * | 1978-05-10 | 1980-09-30 | The Richardson Company | Photoreactive coating compositions and photomechanical plates produced therewith |
JPS5783094A (en) * | 1980-11-11 | 1982-05-24 | Nippon Telegraph & Telephone | Method of producing multilayer printed circuit board |
-
1982
- 1982-11-22 JP JP83500238A patent/JPS58502079A/ja active Pending
- 1982-11-22 EP EP83900226A patent/EP0096701B1/en not_active Expired
- 1982-11-22 WO PCT/US1982/001638 patent/WO1983002172A1/en active IP Right Grant
- 1982-11-22 DE DE8383900226T patent/DE3279915D1/de not_active Expired
- 1982-12-03 GB GB08234589A patent/GB2111313B/en not_active Expired
- 1982-12-06 CA CA000417101A patent/CA1189630A/en not_active Expired
- 1982-12-10 ES ES518093A patent/ES518093A0/es active Granted
- 1982-12-10 IT IT24690/82A patent/IT1195963B/it active
-
1984
- 1984-02-15 ES ES529758A patent/ES529758A0/es active Granted
Also Published As
Publication number | Publication date |
---|---|
DE3279915D1 (en) | 1989-10-05 |
CA1189630A (en) | 1985-06-25 |
ES8500700A1 (es) | 1984-11-01 |
ES8404132A1 (es) | 1984-04-16 |
ES529758A0 (es) | 1984-11-01 |
EP0096701A1 (en) | 1983-12-28 |
EP0096701B1 (en) | 1989-08-30 |
GB2111313B (en) | 1986-04-23 |
IT8224690A0 (it) | 1982-12-10 |
ES518093A0 (es) | 1984-04-16 |
JPS58502079A (ja) | 1983-12-01 |
GB2111313A (en) | 1983-06-29 |
WO1983002172A1 (en) | 1983-06-23 |
EP0096701A4 (en) | 1987-04-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT8322493A0 (it) | Elemento circuitale elettrico. | |
IT1152039B (it) | Procedimento per la fabbricazione di circuiti integrati | |
DE3481880D1 (de) | Schaltkreis. | |
DK564082A (da) | Fremgangsmaade til fremstilling af trykte kredsloeb | |
DK300683A (da) | Fikseringskredsloeb | |
IT1195963B (it) | Procedimento di fabbricazione di circuiti stampati | |
IT1221754B (it) | Armadietto per circuiti stampati | |
DE3485292D1 (de) | Lade-entladekreis. | |
FI823709A0 (fi) | Kopplingsanordning | |
AT383903B (de) | Schaltungsanordnung | |
IT8422489A0 (it) | Dispositivo per intercollegare circuiti stampati. | |
BE895402A (fr) | Circuit comparateur | |
FI830659L (fi) | Kopplingsanordning | |
BE891254A (fr) | Circuit comparateur | |
IT1137014B (it) | Procedimento di fabbricazione di circuiti stampati | |
KR840000815U (ko) | 전자개폐장치 | |
IT1131716B (it) | Procedimento di fabbricazione di circuiti stampati | |
FR2503955B1 (fr) | Circuit demodulateur | |
FI833024A (fi) | Kopplingsanordning | |
KR830003364U (ko) | 회로 차단기 | |
FI822593A0 (fi) | Elektroniska byggdelar | |
FI830771L (fi) | Elektronisk vaog | |
IT1151782B (it) | Circuiti di controllo | |
DE3380321D1 (de) | Priority resolver circuit | |
SE8100840L (sv) | Integrerad krets |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19961223 |