DE3279915D1 - Circuit board fabrication leading to increased capacity - Google Patents

Circuit board fabrication leading to increased capacity

Info

Publication number
DE3279915D1
DE3279915D1 DE8383900226T DE3279915T DE3279915D1 DE 3279915 D1 DE3279915 D1 DE 3279915D1 DE 8383900226 T DE8383900226 T DE 8383900226T DE 3279915 T DE3279915 T DE 3279915T DE 3279915 D1 DE3279915 D1 DE 3279915D1
Authority
DE
Germany
Prior art keywords
circuit board
increased capacity
board fabrication
leading
fabrication leading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383900226T
Other languages
English (en)
Inventor
David Jacob Lando
Frederick Wight
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of DE3279915D1 publication Critical patent/DE3279915D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE8383900226T 1981-12-11 1982-11-22 Circuit board fabrication leading to increased capacity Expired DE3279915D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33001181A 1981-12-11 1981-12-11
PCT/US1982/001638 WO1983002172A1 (en) 1981-12-11 1982-11-22 Circuit board fabrication leading to increased capacity

Publications (1)

Publication Number Publication Date
DE3279915D1 true DE3279915D1 (en) 1989-10-05

Family

ID=23287944

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383900226T Expired DE3279915D1 (en) 1981-12-11 1982-11-22 Circuit board fabrication leading to increased capacity

Country Status (8)

Country Link
EP (1) EP0096701B1 (de)
JP (1) JPS58502079A (de)
CA (1) CA1189630A (de)
DE (1) DE3279915D1 (de)
ES (2) ES518093A0 (de)
GB (1) GB2111313B (de)
IT (1) IT1195963B (de)
WO (1) WO1983002172A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4566186A (en) * 1984-06-29 1986-01-28 Tektronix, Inc. Multilayer interconnect circuitry using photoimageable dielectric
US4613560A (en) * 1984-12-28 1986-09-23 E. I. Du Pont De Nemours And Company Photosensitive ceramic coating composition
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
EP0211180A3 (de) * 1985-08-02 1989-08-09 Shipley Company Inc. Herstellungsverfahren für mehrschichtige Leiterplatten
JPS6233135A (ja) * 1985-08-06 1987-02-13 Sanyo Kokusaku Pulp Co Ltd 新規（メタ）アクリレート化合物
EP0259784A3 (de) * 1986-09-11 1988-10-12 General Electric Company Photogemusterte dielektrische Schicht
DE3688255T2 (de) * 1986-12-17 1993-07-22 Foxboro Co Verfahren zur herstellung von mehrschichtleiterplatten.
ATE91062T1 (de) * 1987-03-09 1993-07-15 Siemens Nixdorf Inf Syst Aufbautechnik fuer mehrlagige verdrahtungen.
EP0292219A3 (de) * 1987-05-21 1989-10-11 AT&T Corp. Verfahren zur Herstellung von Grundplatten für gedruckte Schaltungen
DE3840207A1 (de) * 1988-11-29 1990-05-31 Draegerwerk Ag Verfahren zur herstellung einer leiterplatte mit mehreren leiterbahnebenen und entsprechende multilayer-leiterplatte
US5362534A (en) * 1993-08-23 1994-11-08 Parlex Corporation Multiple layer printed circuit boards and method of manufacture
US5804256A (en) * 1994-06-23 1998-09-08 Schaefer; Hans-Jorgen Method and device for coating printed-circuit boards
TW277204B (de) * 1994-12-02 1996-06-01 Nippon Paint Co Ltd
JP2000156564A (ja) * 1998-11-20 2000-06-06 Nec Corp プリント配線板及びその製造方法
CN107620388B (zh) * 2017-09-21 2022-11-15 南京工业大学 木龙骨与面板的叠合橡胶连接结构

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3269861A (en) * 1963-06-21 1966-08-30 Day Company Method for electroless copper plating
US3615469A (en) * 1969-06-02 1971-10-26 Goodrich Co B F Polymeric printing plates
US3649274A (en) * 1969-09-18 1972-03-14 Bunker Ramo Coaxial circuit construction method
US3922479A (en) * 1971-09-15 1975-11-25 Bunker Ramo Coaxial circuit construction and method of making
BE793030A (fr) * 1971-12-20 1973-04-16 Goodrich Co B F Procede pour la realisation de matieres plastiques de resine epoxy
US3980483A (en) * 1972-04-24 1976-09-14 Nippon Oil Seal Industry Co., Ltd. Photocurable composition
US3816281A (en) * 1973-04-30 1974-06-11 American Can Co Poly(vinyl pyrrolidone)stabilized polymerized epoxy compositions and process for irradiating same
US3934335A (en) * 1974-10-16 1976-01-27 Texas Instruments Incorporated Multilayer printed circuit board
GB2049972B (en) * 1977-07-12 1982-06-23 Asahi Chemical Ind Photosensitive element for producing a printed circuit board
JPS5426471A (en) * 1977-07-30 1979-02-28 Matsushita Electric Works Ltd Method of manufacturing multiilayer printed wiring board
US4157407A (en) * 1978-02-13 1979-06-05 E. I. Du Pont De Nemours And Company Toning and solvent washout process for making conductive interconnections
US4225661A (en) * 1978-05-10 1980-09-30 The Richardson Company Photoreactive coating compositions and photomechanical plates produced therewith
JPS5783094A (en) * 1980-11-11 1982-05-24 Nippon Telegraph & Telephone Method of producing multilayer printed circuit board

Also Published As

Publication number Publication date
JPS58502079A (ja) 1983-12-01
EP0096701A4 (de) 1987-04-28
ES8404132A1 (es) 1984-04-16
ES518093A0 (es) 1984-04-16
EP0096701B1 (de) 1989-08-30
EP0096701A1 (de) 1983-12-28
IT8224690A0 (it) 1982-12-10
ES529758A0 (es) 1984-11-01
IT1195963B (it) 1988-11-03
GB2111313A (en) 1983-06-29
WO1983002172A1 (en) 1983-06-23
CA1189630A (en) 1985-06-25
GB2111313B (en) 1986-04-23
ES8500700A1 (es) 1984-11-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: BLUMBACH, KRAMER & PARTNER, 65193 WIESBADEN

8339 Ceased/non-payment of the annual fee