ES8500700A1 - Perfeccionamientos en placas de circuitos impresos - Google Patents

Perfeccionamientos en placas de circuitos impresos

Info

Publication number
ES8500700A1
ES8500700A1 ES529758A ES529758A ES8500700A1 ES 8500700 A1 ES8500700 A1 ES 8500700A1 ES 529758 A ES529758 A ES 529758A ES 529758 A ES529758 A ES 529758A ES 8500700 A1 ES8500700 A1 ES 8500700A1
Authority
ES
Spain
Prior art keywords
copper
patterned
circuit board
pattern
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES529758A
Other languages
English (en)
Other versions
ES529758A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of ES529758A0 publication Critical patent/ES529758A0/es
Publication of ES8500700A1 publication Critical patent/ES8500700A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PERFECCIONAMIENTOS EN PLACAS DE CIRCUITOS IMPRESOS.CONSISTENTES EN QUE LA VIA CONDUCTIVA Y EL MATERIAL AISLANTE SE FORMAN SOMETIDNEO UN MATERIAL SENSIBLE A LA ENERGIA A RADIACION ELECTROMAGNETICA, REVELANDO EL MATERIAL SENSIBLE A LA ENERGIA PARA FORMAR LA VIA Y PARA PRODUCIR EL MATERIAL AISLANTE, DONDE EL MATERIAL SENSIBLE A LA ENERGIA COMPRENDE UN CAUCHO ACRILATADO, O UNA RESINA EPOXI MODIFICADA CON CAUCHO ACRILATADO, UNA RESINA EPOXI ACRILATADA QUE TIENE UNA TEMPERATURA DE TRANSICION CRISTALINA DE 50JC Y UN MODIFICADOR DE LA VISCOSIDAD TAL COMO UN MONOMERO, CAPAZ DE REACCIONAR CON EL CAUCHO ACRILATADO BAJO LA INFLUENCIA DE LA RADIACION ELECTROMAGNETICA Y UN MODIFICADOR DE LA VISCOSIDAD.
ES529758A 1981-12-11 1984-02-15 Perfeccionamientos en placas de circuitos impresos Expired ES8500700A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US33001181A 1981-12-11 1981-12-11

Publications (2)

Publication Number Publication Date
ES529758A0 ES529758A0 (es) 1984-11-01
ES8500700A1 true ES8500700A1 (es) 1984-11-01

Family

ID=23287944

Family Applications (2)

Application Number Title Priority Date Filing Date
ES518093A Granted ES518093A0 (es) 1981-12-11 1982-12-10 Procedimiento de fabricacion de placas de circuitos impresos.
ES529758A Expired ES8500700A1 (es) 1981-12-11 1984-02-15 Perfeccionamientos en placas de circuitos impresos

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES518093A Granted ES518093A0 (es) 1981-12-11 1982-12-10 Procedimiento de fabricacion de placas de circuitos impresos.

Country Status (8)

Country Link
EP (1) EP0096701B1 (es)
JP (1) JPS58502079A (es)
CA (1) CA1189630A (es)
DE (1) DE3279915D1 (es)
ES (2) ES518093A0 (es)
GB (1) GB2111313B (es)
IT (1) IT1195963B (es)
WO (1) WO1983002172A1 (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4566186A (en) * 1984-06-29 1986-01-28 Tektronix, Inc. Multilayer interconnect circuitry using photoimageable dielectric
US4613560A (en) * 1984-12-28 1986-09-23 E. I. Du Pont De Nemours And Company Photosensitive ceramic coating composition
US4915983A (en) * 1985-06-10 1990-04-10 The Foxboro Company Multilayer circuit board fabrication process
EP0211180A3 (en) * 1985-08-02 1989-08-09 Shipley Company Inc. Method for manufacture of multilayer circuit board
JPS6233135A (ja) * 1985-08-06 1987-02-13 Sanyo Kokusaku Pulp Co Ltd 新規（メタ）アクリレート化合物
EP0259784A3 (en) * 1986-09-11 1988-10-12 General Electric Company Photo-imaged dielectric layer
DE3688255T2 (de) * 1986-12-17 1993-07-22 Foxboro Co Verfahren zur herstellung von mehrschichtleiterplatten.
ATE91062T1 (de) * 1987-03-09 1993-07-15 Siemens Nixdorf Inf Syst Aufbautechnik fuer mehrlagige verdrahtungen.
EP0292219A3 (en) * 1987-05-21 1989-10-11 AT&T Corp. Printed circuit board fabrication
DE3840207A1 (de) * 1988-11-29 1990-05-31 Draegerwerk Ag Verfahren zur herstellung einer leiterplatte mit mehreren leiterbahnebenen und entsprechende multilayer-leiterplatte
US5362534A (en) * 1993-08-23 1994-11-08 Parlex Corporation Multiple layer printed circuit boards and method of manufacture
US5804256A (en) * 1994-06-23 1998-09-08 Schaefer; Hans-Jorgen Method and device for coating printed-circuit boards
TW277204B (es) * 1994-12-02 1996-06-01 Nippon Paint Co Ltd
JP2000156564A (ja) * 1998-11-20 2000-06-06 Nec Corp プリント配線板及びその製造方法
CN107620388B (zh) * 2017-09-21 2022-11-15 南京工业大学 木龙骨与面板的叠合橡胶连接结构

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3269861A (en) * 1963-06-21 1966-08-30 Day Company Method for electroless copper plating
US3615469A (en) * 1969-06-02 1971-10-26 Goodrich Co B F Polymeric printing plates
US3649274A (en) * 1969-09-18 1972-03-14 Bunker Ramo Coaxial circuit construction method
US3922479A (en) * 1971-09-15 1975-11-25 Bunker Ramo Coaxial circuit construction and method of making
BE793030A (fr) * 1971-12-20 1973-04-16 Goodrich Co B F Procede pour la realisation de matieres plastiques de resine epoxy
US3980483A (en) * 1972-04-24 1976-09-14 Nippon Oil Seal Industry Co., Ltd. Photocurable composition
US3816281A (en) * 1973-04-30 1974-06-11 American Can Co Poly(vinyl pyrrolidone)stabilized polymerized epoxy compositions and process for irradiating same
US3934335A (en) * 1974-10-16 1976-01-27 Texas Instruments Incorporated Multilayer printed circuit board
GB2049972B (en) * 1977-07-12 1982-06-23 Asahi Chemical Ind Photosensitive element for producing a printed circuit board
JPS5426471A (en) * 1977-07-30 1979-02-28 Matsushita Electric Works Ltd Method of manufacturing multiilayer printed wiring board
US4157407A (en) * 1978-02-13 1979-06-05 E. I. Du Pont De Nemours And Company Toning and solvent washout process for making conductive interconnections
US4225661A (en) * 1978-05-10 1980-09-30 The Richardson Company Photoreactive coating compositions and photomechanical plates produced therewith
JPS5783094A (en) * 1980-11-11 1982-05-24 Nippon Telegraph & Telephone Method of producing multilayer printed circuit board

Also Published As

Publication number Publication date
JPS58502079A (ja) 1983-12-01
EP0096701A4 (en) 1987-04-28
ES8404132A1 (es) 1984-04-16
ES518093A0 (es) 1984-04-16
EP0096701B1 (en) 1989-08-30
DE3279915D1 (en) 1989-10-05
EP0096701A1 (en) 1983-12-28
IT8224690A0 (it) 1982-12-10
ES529758A0 (es) 1984-11-01
IT1195963B (it) 1988-11-03
GB2111313A (en) 1983-06-29
WO1983002172A1 (en) 1983-06-23
CA1189630A (en) 1985-06-25
GB2111313B (en) 1986-04-23

Similar Documents

Publication Publication Date Title
ES8500700A1 (es) Perfeccionamientos en placas de circuitos impresos
EP0337465A3 (en) Process for producing printed circuit board
FR2285049A1 (fr) Procede de fabrication d'une plaque a circuits imprimes multicouche
EP0329313A3 (en) Laser patterning using a novel resist
ES413450A1 (es) Mejoras introducidas en tableros de circuito electrico.
SG68893G (en) Circuit board for printed circuits,and method of making such a board
SE8101360L (sv) Forfarande for framstellning av tryckta ledarplattor med perforeringar, vars veggar er metalliserade
EP0238929A3 (en) Process for providing circuit lines on a substrate
EP0350876A3 (en) Process for the production of dielectric layers in planar circuits on ceramic substrates
SE7907298L (sv) Forfarande for framstellning av tryckta kretskort med flera skikt
EP0402811A3 (en) Method of manufacturing printed circuit boards
JPS5520520A (en) Data input unit
JPS56137633A (en) Pattern forming
JPS5224084A (en) Semiconductor manufacturing rpocess
JPS6464292A (en) Manufacture of printed board
JPS53142337A (en) Manufacture of copper through hole plate
SU642887A1 (ru) Способ изготовлени оригинала печатной платы на фольгированном диэлектрике
EP0136534A3 (en) Method of forming a large surface area integrated circuit
JPS5335475A (en) Production of semiconductor unit
JPS5526613A (en) Manufacturing of carrier tape useful for ic
JPS53120386A (en) Semiconductor logic circuit device
SU798995A1 (ru) Трафарет дл ориентации ферритовыхСЕРдЕчНиКОВ
JPS5557933A (en) Manufacture of keyboard for electronic desk-top calculator
JPS54105349A (en) Door of high-frequency heating device
JPS54104564A (en) Method of producing printed circuit board having electronic component elements on internal layer