FR2285049A1 - Procede de fabrication d'une plaque a circuits imprimes multicouche - Google Patents

Procede de fabrication d'une plaque a circuits imprimes multicouche

Info

Publication number
FR2285049A1
FR2285049A1 FR7528373A FR7528373A FR2285049A1 FR 2285049 A1 FR2285049 A1 FR 2285049A1 FR 7528373 A FR7528373 A FR 7528373A FR 7528373 A FR7528373 A FR 7528373A FR 2285049 A1 FR2285049 A1 FR 2285049A1
Authority
FR
France
Prior art keywords
manufacturing
circuit board
printed circuit
layer printed
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7528373A
Other languages
English (en)
Other versions
FR2285049B1 (fr
Inventor
David Samuel Goodman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
ITT Inc
Original Assignee
Deutsche ITT Industries GmbH
ITT Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH, ITT Industries Inc filed Critical Deutsche ITT Industries GmbH
Publication of FR2285049A1 publication Critical patent/FR2285049A1/fr
Application granted granted Critical
Publication of FR2285049B1 publication Critical patent/FR2285049B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR7528373A 1974-09-16 1975-09-16 Procede de fabrication d'une plaque a circuits imprimes multicouche Granted FR2285049A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/506,058 US3932932A (en) 1974-09-16 1974-09-16 Method of making multilayer printed circuit board

Publications (2)

Publication Number Publication Date
FR2285049A1 true FR2285049A1 (fr) 1976-04-09
FR2285049B1 FR2285049B1 (fr) 1978-12-08

Family

ID=24013001

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7528373A Granted FR2285049A1 (fr) 1974-09-16 1975-09-16 Procede de fabrication d'une plaque a circuits imprimes multicouche

Country Status (5)

Country Link
US (1) US3932932A (fr)
JP (1) JPS5527478B2 (fr)
DE (1) DE2539925A1 (fr)
FR (1) FR2285049A1 (fr)
IT (1) IT1042448B (fr)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
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US4054939A (en) * 1975-06-06 1977-10-18 Elfab Corporation Multi-layer backpanel including metal plate ground and voltage planes
US4208080A (en) * 1976-08-18 1980-06-17 Amp Incorporated Junction boxes
US4327247A (en) * 1978-10-02 1982-04-27 Shin-Kobe Electric Machinery Co., Ltd. Printed wiring board
US4250616A (en) * 1979-03-23 1981-02-17 Methode Electronics, Inc. Method of producing multilayer backplane
IT1209218B (it) * 1980-05-09 1989-07-16 Sits Soc It Telecom Siemens Piastra a circuito stampato adoppia faccia.
EP0052738A1 (fr) * 1980-11-25 1982-06-02 Contraves Ag Plaquette à circuit imprimé
JPS57120398A (en) * 1981-01-19 1982-07-27 Sanyo Electric Co Method of connecting both-side printed foil of both-side printed circuit board
US4577214A (en) * 1981-05-06 1986-03-18 At&T Bell Laboratories Low-inductance power/ground distribution in a package for a semiconductor chip
US4494172A (en) * 1982-01-28 1985-01-15 Mupac Corporation High-speed wire wrap board
US4649497A (en) * 1983-06-03 1987-03-10 John Fluke Mfg. Co., Inc. Computer-produced circuit board
FR2560731B1 (fr) * 1984-03-05 1989-05-12 Telecommunications Sa Carte imprimee multicouche thermoconductrice
US4729061A (en) * 1985-04-29 1988-03-01 Advanced Micro Devices, Inc. Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom
US4817280A (en) * 1985-06-10 1989-04-04 O. Key Printed Wiring Co., Ltd. Method of manufacturing printed circuit boards
US5672062A (en) * 1991-01-30 1997-09-30 Labinal Components And Systems, Inc. Electrical connectors
US5597313A (en) * 1986-06-19 1997-01-28 Labinal Components And Systems, Inc. Electrical connectors
US5114518A (en) * 1986-10-23 1992-05-19 International Business Machines Corporation Method of making multilayer circuit boards having conformal Insulating layers
US4918574A (en) * 1986-10-23 1990-04-17 International Business Machines Corporation Multilayer circuit board with reduced susceptability to shorts caused by trapped impurities
US5704794A (en) * 1986-12-29 1998-01-06 Labinal Components And Systems, Inc. Electrical connectors
US4791248A (en) * 1987-01-22 1988-12-13 The Boeing Company Printed wire circuit board and its method of manufacture
US4775573A (en) * 1987-04-03 1988-10-04 West-Tronics, Inc. Multilayer PC board using polymer thick films
US4854040A (en) * 1987-04-03 1989-08-08 Poly Circuits, Inc. Method of making multilayer pc board using polymer thick films
US4924590A (en) * 1988-01-08 1990-05-15 Siemens Aktiengesellschaft Method for making metal core printed circuit board
US5159536A (en) * 1988-05-13 1992-10-27 Mupac Corporation Panel board
US5354695A (en) * 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
USRE35064E (en) * 1988-08-01 1995-10-17 Circuit Components, Incorporated Multilayer printed wiring board
US5065284A (en) * 1988-08-01 1991-11-12 Rogers Corporation Multilayer printed wiring board
US5155655A (en) * 1989-08-23 1992-10-13 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US5079069A (en) * 1989-08-23 1992-01-07 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
JPH0574532A (ja) * 1990-01-18 1993-03-26 Kel Corp 電気コネクタ
US5106308A (en) * 1991-03-04 1992-04-21 Allied-Signal Inc. Planar contact grid array connector
WO1993003591A1 (fr) * 1991-07-31 1993-02-18 Cambridge Management Corporation Collecteurs a grande densite de connexions et impedance controlee
US5800575A (en) * 1992-04-06 1998-09-01 Zycon Corporation In situ method of forming a bypass capacitor element internally within a capacitive PCB
US5261153A (en) * 1992-04-06 1993-11-16 Zycon Corporation In situ method for forming a capacitive PCB
US6714625B1 (en) * 1992-04-08 2004-03-30 Elm Technology Corporation Lithography device for semiconductor circuit pattern generation
USH1471H (en) * 1993-04-26 1995-08-01 Braun David J Metal substrate double sided circuit board
DE9403108U1 (de) * 1994-02-24 1994-04-14 Siemens AG, 80333 München Niederinduktive Hochstromverschienung für Stromrichtermodule
US5773195A (en) 1994-12-01 1998-06-30 International Business Machines Corporation Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap
US5929375A (en) * 1996-05-10 1999-07-27 Ford Motor Company EMI protection and CTE control of three-dimensional circuitized substrates
US6551857B2 (en) * 1997-04-04 2003-04-22 Elm Technology Corporation Three dimensional structure integrated circuits
US5915167A (en) * 1997-04-04 1999-06-22 Elm Technology Corporation Three dimensional structure memory
US6281451B1 (en) * 1998-09-24 2001-08-28 International Business Machines Corporation Electrical cable device
JP3206561B2 (ja) * 1998-10-01 2001-09-10 日本電気株式会社 多層配線基板
US6400570B2 (en) * 1999-09-10 2002-06-04 Lockheed Martin Corporation Plated through-holes for signal interconnections in an electronic component assembly
JP2001267747A (ja) * 2000-03-22 2001-09-28 Nitto Denko Corp 多層回路基板の製造方法
US6426470B1 (en) * 2001-01-17 2002-07-30 International Business Machines Corporation Formation of multisegmented plated through holes
US6714308B2 (en) * 2001-09-04 2004-03-30 Zygo Corporation Rapid in-situ mastering of an aspheric fizeau
JP4197234B2 (ja) * 2001-12-28 2008-12-17 三菱電機株式会社 光通信器
JP3843027B2 (ja) * 2002-03-12 2006-11-08 日東電工株式会社 プリント配線板の製造方法
US7402897B2 (en) * 2002-08-08 2008-07-22 Elm Technology Corporation Vertical system integration
US7271349B2 (en) * 2002-09-04 2007-09-18 Intel Corporation Via shielding for power/ground layers on printed circuit board
TW566796U (en) * 2003-03-12 2003-12-11 Unimicron Technology Corp Standard printed circuit board core
JP2008159820A (ja) * 2006-12-22 2008-07-10 Tdk Corp 電子部品の一括実装方法、及び電子部品内蔵基板の製造方法
CN102300909B (zh) * 2009-01-28 2014-06-18 日立化成工业株式会社 预浸料坯、带有树脂的膜、带有树脂的金属箔、覆金属箔层叠板及印制电路板
US11056825B2 (en) * 2019-11-05 2021-07-06 Hamilton Sundstrand Corporation High voltage bus connection insulator

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519959A (en) * 1966-03-24 1970-07-07 Burroughs Corp Integral electrical power distribution network and component mounting plane
FR2165978A1 (fr) * 1971-12-27 1973-08-10 Ibm

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Publication number Priority date Publication date Assignee Title
US3563819A (en) * 1967-08-31 1971-02-16 Alumet Mfg Corp Mechanochemical sheet metal blanking system
US3617613A (en) * 1968-10-17 1971-11-02 Spaulding Fibre Co Punchable printed circuit board base
GB1310880A (en) * 1969-06-13 1973-03-21 Microponent Dev Ltd Multi-layer printed circuit board assemblies
US3719536A (en) * 1971-02-12 1973-03-06 Alumet Corp Mechanochemical sheet metal blanking system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3519959A (en) * 1966-03-24 1970-07-07 Burroughs Corp Integral electrical power distribution network and component mounting plane
FR2165978A1 (fr) * 1971-12-27 1973-08-10 Ibm

Also Published As

Publication number Publication date
FR2285049B1 (fr) 1978-12-08
JPS5527478B2 (fr) 1980-07-21
IT1042448B (it) 1980-01-30
US3932932A (en) 1976-01-20
DE2539925A1 (de) 1976-04-01
JPS5156968A (fr) 1976-05-19

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Legal Events

Date Code Title Description
ST Notification of lapse