JPS57120398A - Method of connecting both-side printed foil of both-side printed circuit board - Google Patents
Method of connecting both-side printed foil of both-side printed circuit boardInfo
- Publication number
- JPS57120398A JPS57120398A JP706981A JP706981A JPS57120398A JP S57120398 A JPS57120398 A JP S57120398A JP 706981 A JP706981 A JP 706981A JP 706981 A JP706981 A JP 706981A JP S57120398 A JPS57120398 A JP S57120398A
- Authority
- JP
- Japan
- Prior art keywords
- side printed
- circuit board
- foil
- printed circuit
- printed foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP706981A JPS57120398A (en) | 1981-01-19 | 1981-01-19 | Method of connecting both-side printed foil of both-side printed circuit board |
GB8200313A GB2093401B (en) | 1981-01-17 | 1982-01-06 | Composite film |
DE3201133A DE3201133A1 (en) | 1981-01-17 | 1982-01-15 | COMPOSITE LAYER ARRANGEMENT, IN PARTICULAR FOR USE IN A SEMICONDUCTOR ARRANGEMENT, AND METHOD FOR THE PRODUCTION THEREOF |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP706981A JPS57120398A (en) | 1981-01-19 | 1981-01-19 | Method of connecting both-side printed foil of both-side printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57120398A true JPS57120398A (en) | 1982-07-27 |
JPS6347157B2 JPS6347157B2 (en) | 1988-09-20 |
Family
ID=11655781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP706981A Granted JPS57120398A (en) | 1981-01-17 | 1981-01-19 | Method of connecting both-side printed foil of both-side printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57120398A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60208894A (en) * | 1984-04-03 | 1985-10-21 | カシオ計算機株式会社 | Method of producing flexible substrate |
JPS60208888A (en) * | 1984-04-03 | 1985-10-21 | カシオ計算機株式会社 | Method of producing flexible substrate |
JP2002353615A (en) * | 2001-05-22 | 2002-12-06 | Shin Etsu Polymer Co Ltd | Method of establishing continuity between wiring patterns on both faces of flexible printed wiring board, and flexible printed wiring board using the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02139270A (en) * | 1988-11-21 | 1990-05-29 | Matsushita Electric Ind Co Ltd | Printer |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4950459A (en) * | 1972-09-20 | 1974-05-16 | ||
JPS5026067A (en) * | 1973-03-06 | 1975-03-18 | ||
JPS5156968A (en) * | 1974-09-16 | 1976-05-19 | Itt | |
JPS5351468A (en) * | 1976-10-20 | 1978-05-10 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
JPS5376366A (en) * | 1976-12-18 | 1978-07-06 | Fujitsu Ltd | Method of producing ceramic circuit board |
JPS55102291A (en) * | 1979-01-29 | 1980-08-05 | Nippon Mektron Kk | Structure for and method of conducting through hole of flexible circuit substrate |
-
1981
- 1981-01-19 JP JP706981A patent/JPS57120398A/en active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4950459A (en) * | 1972-09-20 | 1974-05-16 | ||
JPS5026067A (en) * | 1973-03-06 | 1975-03-18 | ||
JPS5156968A (en) * | 1974-09-16 | 1976-05-19 | Itt | |
JPS5351468A (en) * | 1976-10-20 | 1978-05-10 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
JPS5376366A (en) * | 1976-12-18 | 1978-07-06 | Fujitsu Ltd | Method of producing ceramic circuit board |
JPS55102291A (en) * | 1979-01-29 | 1980-08-05 | Nippon Mektron Kk | Structure for and method of conducting through hole of flexible circuit substrate |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60208894A (en) * | 1984-04-03 | 1985-10-21 | カシオ計算機株式会社 | Method of producing flexible substrate |
JPS60208888A (en) * | 1984-04-03 | 1985-10-21 | カシオ計算機株式会社 | Method of producing flexible substrate |
JPH0434320B2 (en) * | 1984-04-03 | 1992-06-05 | Casio Computer Co Ltd | |
JPH0434319B2 (en) * | 1984-04-03 | 1992-06-05 | Casio Computer Co Ltd | |
JP2002353615A (en) * | 2001-05-22 | 2002-12-06 | Shin Etsu Polymer Co Ltd | Method of establishing continuity between wiring patterns on both faces of flexible printed wiring board, and flexible printed wiring board using the same |
Also Published As
Publication number | Publication date |
---|---|
JPS6347157B2 (en) | 1988-09-20 |
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