BE814271A - Boitier de platines de circuits imprimes - Google Patents

Boitier de platines de circuits imprimes

Info

Publication number
BE814271A
BE814271A BE143691A BE143691A BE814271A BE 814271 A BE814271 A BE 814271A BE 143691 A BE143691 A BE 143691A BE 143691 A BE143691 A BE 143691A BE 814271 A BE814271 A BE 814271A
Authority
BE
Belgium
Prior art keywords
box
printed circuit
circuit boards
boards
printed
Prior art date
Application number
BE143691A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE814271A publication Critical patent/BE814271A/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1435—Expandable constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Vibration Prevention Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
BE143691A 1973-06-18 1974-04-26 Boitier de platines de circuits imprimes BE814271A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00370901A US3833836A (en) 1973-06-18 1973-06-18 Printed circuit board package with cooling and vibration damping means

Publications (1)

Publication Number Publication Date
BE814271A true BE814271A (fr) 1974-08-16

Family

ID=23461648

Family Applications (1)

Application Number Title Priority Date Filing Date
BE143691A BE814271A (fr) 1973-06-18 1974-04-26 Boitier de platines de circuits imprimes

Country Status (12)

Country Link
US (1) US3833836A (fr)
JP (1) JPS5032475A (fr)
BE (1) BE814271A (fr)
CA (1) CA998159A (fr)
CH (1) CH585499A5 (fr)
DE (1) DE2420739A1 (fr)
FR (1) FR2233789A1 (fr)
GB (1) GB1471309A (fr)
IL (1) IL44527A (fr)
IT (1) IT1014774B (fr)
NL (1) NL7405530A (fr)
SE (1) SE7407696L (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538602Y2 (fr) * 1977-04-07 1980-09-09
DE2744341A1 (de) * 1977-10-01 1979-04-12 Teldix Gmbh Vorrichtung zur aufnahme von elektronik-leiterplatten
JPS5538603Y2 (fr) * 1977-12-20 1980-09-09
US4184539A (en) * 1978-07-10 1980-01-22 The United States Of America As Represented By The Secretary Of The Navy Electronic card mount and heat transfer assembly for underwater vehicles
DE3310109A1 (de) * 1983-03-21 1984-09-27 Siemens AG, 1000 Berlin und 8000 München Isolierender abstandshalter fuer leiterplatten
US4823952A (en) * 1983-07-29 1989-04-25 Termiflex Corporation Modular packaging system, particularly for electronics
GB2186431B (en) * 1986-02-07 1989-11-01 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
CA2072014C (fr) * 1989-12-22 2001-10-23 Ronald N. Garner Ensemble de cartes de circuit hermetique et leger
US5208729A (en) * 1992-02-14 1993-05-04 International Business Machines Corporation Multi-chip module
US5552209A (en) * 1994-07-29 1996-09-03 Minnesota Mining And Manufacturing Company Internally damped circuit articles
US5812374A (en) * 1996-10-28 1998-09-22 Shuff; Gregg Douglas Electrical circuit cooling device
DE19712099A1 (de) * 1997-03-22 1998-05-14 Bosch Gmbh Robert Gehäuse für ein elektrisches Gerät
KR101434239B1 (ko) * 2008-01-31 2014-08-26 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 모듈식 데이터 처리 컴포넌트 및 시스템
US8098492B2 (en) * 2008-03-31 2012-01-17 Hewlett-Packard Development Company, L.P. Data processing modules and systems
DE102010063158A1 (de) * 2010-12-15 2012-06-21 Robert Bosch Gmbh Steuergerät und Verfahren zum Herstellen eines Steuergeräts
US8462510B2 (en) * 2011-05-11 2013-06-11 Taiwan Semiconductor Manufacturing Company, Ltd. Board-level package with tuned mass damping structure

Also Published As

Publication number Publication date
NL7405530A (fr) 1974-12-20
IL44527A0 (en) 1974-06-30
CH585499A5 (fr) 1977-02-28
SE7407696L (fr) 1974-12-19
IL44527A (en) 1976-09-30
CA998159A (en) 1976-10-05
AU6978874A (en) 1975-12-11
GB1471309A (en) 1977-04-21
US3833836A (en) 1974-09-03
FR2233789A1 (fr) 1975-01-10
IT1014774B (it) 1977-04-30
JPS5032475A (fr) 1975-03-29
DE2420739A1 (de) 1975-01-09

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