NL7405530A - - Google Patents

Info

Publication number
NL7405530A
NL7405530A NL7405530A NL7405530A NL7405530A NL 7405530 A NL7405530 A NL 7405530A NL 7405530 A NL7405530 A NL 7405530A NL 7405530 A NL7405530 A NL 7405530A NL 7405530 A NL7405530 A NL 7405530A
Authority
NL
Netherlands
Application number
NL7405530A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7405530A publication Critical patent/NL7405530A/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1435Expandable constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Vibration Prevention Devices (AREA)
  • Combinations Of Printed Boards (AREA)
NL7405530A 1973-06-18 1974-04-24 NL7405530A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00370901A US3833836A (en) 1973-06-18 1973-06-18 Printed circuit board package with cooling and vibration damping means

Publications (1)

Publication Number Publication Date
NL7405530A true NL7405530A (xx) 1974-12-20

Family

ID=23461648

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7405530A NL7405530A (xx) 1973-06-18 1974-04-24

Country Status (12)

Country Link
US (1) US3833836A (xx)
JP (1) JPS5032475A (xx)
BE (1) BE814271A (xx)
CA (1) CA998159A (xx)
CH (1) CH585499A5 (xx)
DE (1) DE2420739A1 (xx)
FR (1) FR2233789A1 (xx)
GB (1) GB1471309A (xx)
IL (1) IL44527A (xx)
IT (1) IT1014774B (xx)
NL (1) NL7405530A (xx)
SE (1) SE7407696L (xx)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538602Y2 (xx) * 1977-04-07 1980-09-09
DE2744341A1 (de) * 1977-10-01 1979-04-12 Teldix Gmbh Vorrichtung zur aufnahme von elektronik-leiterplatten
JPS5538603Y2 (xx) * 1977-12-20 1980-09-09
US4184539A (en) * 1978-07-10 1980-01-22 The United States Of America As Represented By The Secretary Of The Navy Electronic card mount and heat transfer assembly for underwater vehicles
DE3310109A1 (de) * 1983-03-21 1984-09-27 Siemens AG, 1000 Berlin und 8000 München Isolierender abstandshalter fuer leiterplatten
US4823952A (en) * 1983-07-29 1989-04-25 Termiflex Corporation Modular packaging system, particularly for electronics
GB2186431B (en) * 1986-02-07 1989-11-01 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
WO1991010345A2 (en) * 1989-12-22 1991-07-11 The Foxboro Company Lightweight sealed circuit board assembly
US5208729A (en) * 1992-02-14 1993-05-04 International Business Machines Corporation Multi-chip module
US5552209A (en) * 1994-07-29 1996-09-03 Minnesota Mining And Manufacturing Company Internally damped circuit articles
US5812374A (en) * 1996-10-28 1998-09-22 Shuff; Gregg Douglas Electrical circuit cooling device
DE19712099A1 (de) * 1997-03-22 1998-05-14 Bosch Gmbh Robert Gehäuse für ein elektrisches Gerät
US8351204B2 (en) * 2008-01-31 2013-01-08 Hewlett-Packard Development Company, L.P. Modular data processing components and systems
US8098492B2 (en) * 2008-03-31 2012-01-17 Hewlett-Packard Development Company, L.P. Data processing modules and systems
DE102010063158A1 (de) * 2010-12-15 2012-06-21 Robert Bosch Gmbh Steuergerät und Verfahren zum Herstellen eines Steuergeräts
US8462510B2 (en) * 2011-05-11 2013-06-11 Taiwan Semiconductor Manufacturing Company, Ltd. Board-level package with tuned mass damping structure

Also Published As

Publication number Publication date
US3833836A (en) 1974-09-03
SE7407696L (xx) 1974-12-19
CA998159A (en) 1976-10-05
CH585499A5 (xx) 1977-02-28
BE814271A (fr) 1974-08-16
IT1014774B (it) 1977-04-30
JPS5032475A (xx) 1975-03-29
IL44527A0 (en) 1974-06-30
IL44527A (en) 1976-09-30
GB1471309A (en) 1977-04-21
DE2420739A1 (de) 1975-01-09
FR2233789A1 (xx) 1975-01-10
AU6978874A (en) 1975-12-11

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