IT1241551B - Procedimento per la lucidatura chimica meccanica bilaterale di fette di semiconduttori, nonche' dispositivo per la sua esecuzione, e fette di semiconduttori ottenibili con questo. - Google Patents

Procedimento per la lucidatura chimica meccanica bilaterale di fette di semiconduttori, nonche' dispositivo per la sua esecuzione, e fette di semiconduttori ottenibili con questo.

Info

Publication number
IT1241551B
IT1241551B IT48246A IT4824690A IT1241551B IT 1241551 B IT1241551 B IT 1241551B IT 48246 A IT48246 A IT 48246A IT 4824690 A IT4824690 A IT 4824690A IT 1241551 B IT1241551 B IT 1241551B
Authority
IT
Italy
Prior art keywords
slices
semiconductors
execution
procedure
well
Prior art date
Application number
IT48246A
Other languages
English (en)
Other versions
IT9048246A0 (it
IT9048246A1 (it
Inventor
Helene Prigge
Josef Lang
Original Assignee
Wacker Chemitronic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemitronic filed Critical Wacker Chemitronic
Publication of IT9048246A0 publication Critical patent/IT9048246A0/it
Publication of IT9048246A1 publication Critical patent/IT9048246A1/it
Application granted granted Critical
Publication of IT1241551B publication Critical patent/IT1241551B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
IT48246A 1989-09-05 1990-09-03 Procedimento per la lucidatura chimica meccanica bilaterale di fette di semiconduttori, nonche' dispositivo per la sua esecuzione, e fette di semiconduttori ottenibili con questo. IT1241551B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3929484A DE3929484A1 (de) 1989-09-05 1989-09-05 Verfahren zum zweiseitigen chemomechanischen polieren von halbleiterscheiben, sowie vorrichtung zu seiner durchfuehrung und dadurch erhaeltliche halbleiterscheiben

Publications (3)

Publication Number Publication Date
IT9048246A0 IT9048246A0 (it) 1990-09-03
IT9048246A1 IT9048246A1 (it) 1992-03-03
IT1241551B true IT1241551B (it) 1994-01-17

Family

ID=6388678

Family Applications (1)

Application Number Title Priority Date Filing Date
IT48246A IT1241551B (it) 1989-09-05 1990-09-03 Procedimento per la lucidatura chimica meccanica bilaterale di fette di semiconduttori, nonche' dispositivo per la sua esecuzione, e fette di semiconduttori ottenibili con questo.

Country Status (4)

Country Link
US (1) US5110428A (it)
JP (1) JPH0397226A (it)
DE (1) DE3929484A1 (it)
IT (1) IT1241551B (it)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366924A (en) * 1992-03-16 1994-11-22 At&T Bell Laboratories Method of manufacturing an integrated circuit including planarizing a wafer
GB2275130B (en) * 1992-05-26 1997-01-08 Toshiba Kk Polishing apparatus and method for planarizing layer on a semiconductor wafer
US5445996A (en) * 1992-05-26 1995-08-29 Kabushiki Kaisha Toshiba Method for planarizing a semiconductor device having a amorphous layer
US5422316A (en) * 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
US5733175A (en) 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
US5607341A (en) 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
EP0880598A4 (en) * 1996-01-23 2005-02-23 Affymetrix Inc RAPID EVALUATION OF NUCLEIC ACID ABUNDANCE DIFFERENCE, WITH A HIGH-DENSITY OLIGONUCLEOTIDE SYSTEM
US5911864A (en) * 1996-11-08 1999-06-15 Northrop Grumman Corporation Method of fabricating a semiconductor structure
KR100304254B1 (ko) * 1998-12-08 2002-03-21 윤종용 모듈외관검사설비
US6214704B1 (en) 1998-12-16 2001-04-10 Memc Electronic Materials, Inc. Method of processing semiconductor wafers to build in back surface damage
DE10196115B4 (de) * 2000-04-24 2011-06-16 Sumitomo Mitsubishi Silicon Corp. Verfahren zum Polieren eines Halbleiterwafers
JP3791302B2 (ja) 2000-05-31 2006-06-28 株式会社Ｓｕｍｃｏ 両面研磨装置を用いた半導体ウェーハの研磨方法
JP2004506314A (ja) * 2000-08-07 2004-02-26 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 両面研磨法を用いて半導体ウェーハを処理する方法
US6709981B2 (en) 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
JP5301802B2 (ja) * 2007-09-25 2013-09-25 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの製造方法
DE102009015878A1 (de) * 2009-04-01 2010-10-07 Peter Wolters Gmbh Verfahren zum materialabtragenden Bearbeiten von flachen Werkstücken
JP5347807B2 (ja) * 2009-07-30 2013-11-20 新日鐵住金株式会社 半導体基板の研磨方法及び研磨装置
CN102241077B (zh) * 2011-06-15 2013-12-18 安阳市凤凰光伏科技有限公司 铸造法生产类似单晶硅锭晶种制作方法
WO2014052130A1 (en) * 2012-09-28 2014-04-03 Saint-Gobain Ceramics & Plastics, Inc. Modified microgrinding process
JP6145596B2 (ja) * 2013-03-15 2017-06-14 秋田県 研磨装置および研磨装置に用いられるアタッチメント
CN104526525B (zh) * 2014-12-15 2016-10-05 福州大学 一种高效电化学电极抛光机及其使用方法
RU2748973C1 (ru) * 2020-11-18 2021-06-02 Акционерное Общество "ФОМОС-МАТЕРИАЛЫ" Способ изготовления монокристаллических чувствительных элементов для высоковольтных оптических измерительных трансформаторов напряжения

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2965556A (en) * 1959-04-15 1960-12-20 Struers Chemiske Lab H Apparatus for the electro-mechanical polishing of surfaces
US3073764A (en) * 1960-04-13 1963-01-15 Bell Telephone Labor Inc Process for electropolishing semiconductor surfaces
USB161573I5 (it) * 1961-12-22
DE1446067A1 (de) * 1962-04-27 1969-01-23 Telefunken Patent Verfahren zum Polieren von Halbleiterscheiben unter gleichzeitiger Anwendung einer elektrolytischen und einer mechanischen Behandlung
DE1216651B (de) * 1963-03-28 1966-05-12 Siemens Ag Verfahren zum polierenden Abtragen von einkristallinen Halbleiterkoerpern, insbesondere Halbleiterscheiben
US3293162A (en) * 1964-06-30 1966-12-20 Bell Telephone Labor Inc Process for electropolishing both sides of a semiconductor simultaneously
US3437543A (en) * 1965-03-09 1969-04-08 Western Electric Co Apparatus for polishing
SU808230A1 (ru) * 1977-07-07 1981-02-28 Предприятие П/Я В-2438 Устройство дл электрохимическогошлифОВАНи
US4256535A (en) * 1979-12-05 1981-03-17 Western Electric Company, Inc. Method of polishing a semiconductor wafer
JPS571278A (en) * 1980-06-05 1982-01-06 Fujitsu Ltd Polishing method of linbo3 wafer
US4547073A (en) * 1981-02-17 1985-10-15 Matsushita Electric Industrial Co., Ltd. Surface examining apparatus and method
JPS5958827A (ja) * 1982-09-28 1984-04-04 Toshiba Corp 半導体ウエ−ハ、半導体ウエ−ハの製造方法及び半導体ウエ−ハの製造装置
JPS5980933A (ja) * 1982-11-01 1984-05-10 Nippon Telegr & Teleph Corp <Ntt> 導電性体の研摩方法
JPS62208868A (ja) * 1986-03-07 1987-09-14 Nec Corp シリコンウエ−ハの加工方法
JPH07964A (ja) * 1993-02-05 1995-01-06 Yukiaki Matsuo 電解生成水とその製造方法

Also Published As

Publication number Publication date
JPH0397226A (ja) 1991-04-23
DE3929484A1 (de) 1991-03-14
US5110428A (en) 1992-05-05
DE3929484C2 (it) 1992-07-30
IT9048246A0 (it) 1990-09-03
IT9048246A1 (it) 1992-03-03

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