JPS571278A - Polishing method of linbo3 wafer - Google Patents

Polishing method of linbo3 wafer

Info

Publication number
JPS571278A
JPS571278A JP7497080A JP7497080A JPS571278A JP S571278 A JPS571278 A JP S571278A JP 7497080 A JP7497080 A JP 7497080A JP 7497080 A JP7497080 A JP 7497080A JP S571278 A JPS571278 A JP S571278A
Authority
JP
Japan
Prior art keywords
polishing
positive
linbo3
components appear
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7497080A
Other languages
Japanese (ja)
Other versions
JPS6333312B2 (en
Inventor
Masayuki Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7497080A priority Critical patent/JPS571278A/en
Publication of JPS571278A publication Critical patent/JPS571278A/en
Publication of JPS6333312B2 publication Critical patent/JPS6333312B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To improve polishing accuracy when polarized components appear on the surface of a single crystal wafer of LiNbO3, by polishing the surface where positive components appear. CONSTITUTION:Since piezoelectric mother material of LiNbO3 is treated as specified in order to obtain piezoelectric property, polarization 4 has occurred in the cut single crystal 1. After both sides of the wafer 5 have been roughly polished, the polishing is performed to obtain a mirror surface with colloidal silica by using a surface table 7 on which a polishing cloth 6 is applied. In this case, the polishing surface is the surface where positive sides of the polarized components appear. If the polishing is limited to only the positive surface, the dispersion in polishing amount is decreased, the polishing speed becomes quick, and the accuracy is enhanced.
JP7497080A 1980-06-05 1980-06-05 Polishing method of linbo3 wafer Granted JPS571278A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7497080A JPS571278A (en) 1980-06-05 1980-06-05 Polishing method of linbo3 wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7497080A JPS571278A (en) 1980-06-05 1980-06-05 Polishing method of linbo3 wafer

Publications (2)

Publication Number Publication Date
JPS571278A true JPS571278A (en) 1982-01-06
JPS6333312B2 JPS6333312B2 (en) 1988-07-05

Family

ID=13562652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7497080A Granted JPS571278A (en) 1980-06-05 1980-06-05 Polishing method of linbo3 wafer

Country Status (1)

Country Link
JP (1) JPS571278A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3929484A1 (en) * 1989-09-05 1991-03-14 Wacker Chemitronic METHOD FOR THE TWO-SIDED CHEMOMECHANICAL POLISHING OF SEMICONDUCTOR DISC, AS WELL AS DEVICE FOR ITS IMPLEMENTATION AND SAME THEREFORE AVAILABLE SEMICONDUCTOR DISC

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50272A (en) * 1973-03-16 1975-01-06
JPS5057360A (en) * 1973-09-18 1975-05-19

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50272A (en) * 1973-03-16 1975-01-06
JPS5057360A (en) * 1973-09-18 1975-05-19

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3929484A1 (en) * 1989-09-05 1991-03-14 Wacker Chemitronic METHOD FOR THE TWO-SIDED CHEMOMECHANICAL POLISHING OF SEMICONDUCTOR DISC, AS WELL AS DEVICE FOR ITS IMPLEMENTATION AND SAME THEREFORE AVAILABLE SEMICONDUCTOR DISC
DE3929484C2 (en) * 1989-09-05 1992-07-30 Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen, De

Also Published As

Publication number Publication date
JPS6333312B2 (en) 1988-07-05

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