JPS5416792A - Cutting apparatus - Google Patents
Cutting apparatusInfo
- Publication number
- JPS5416792A JPS5416792A JP8098777A JP8098777A JPS5416792A JP S5416792 A JPS5416792 A JP S5416792A JP 8098777 A JP8098777 A JP 8098777A JP 8098777 A JP8098777 A JP 8098777A JP S5416792 A JPS5416792 A JP S5416792A
- Authority
- JP
- Japan
- Prior art keywords
- cutting apparatus
- cutting
- abrasive
- contact type
- semiconductor crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D47/00—Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts
- B23D47/005—Vibration-damping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE:In apparatus to produce wafer by cutting from semiconductor crystal, to reduce blade flex and to increase working accuracy, by rotating blade having abrasive and working layer with non contact type vibration stop.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8098777A JPS5416792A (en) | 1977-07-08 | 1977-07-08 | Cutting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8098777A JPS5416792A (en) | 1977-07-08 | 1977-07-08 | Cutting apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5416792A true JPS5416792A (en) | 1979-02-07 |
Family
ID=13733841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8098777A Pending JPS5416792A (en) | 1977-07-08 | 1977-07-08 | Cutting apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5416792A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56118814A (en) * | 1980-02-23 | 1981-09-18 | Masuhiro Mitsuyama | Manufacture of laminated plastic sheet or film with gore |
JPH0235763U (en) * | 1988-08-30 | 1990-03-08 | ||
US5025593A (en) * | 1988-01-18 | 1991-06-25 | Mazda Motor Corporation | Slicing machine and control method thereof |
US5383444A (en) * | 1991-09-30 | 1995-01-24 | Mitsubishi Materials Corporation | Slicing machine |
-
1977
- 1977-07-08 JP JP8098777A patent/JPS5416792A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56118814A (en) * | 1980-02-23 | 1981-09-18 | Masuhiro Mitsuyama | Manufacture of laminated plastic sheet or film with gore |
US5025593A (en) * | 1988-01-18 | 1991-06-25 | Mazda Motor Corporation | Slicing machine and control method thereof |
JPH0235763U (en) * | 1988-08-30 | 1990-03-08 | ||
US5383444A (en) * | 1991-09-30 | 1995-01-24 | Mitsubishi Materials Corporation | Slicing machine |
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