JPS5416792A - Cutting apparatus - Google Patents

Cutting apparatus

Info

Publication number
JPS5416792A
JPS5416792A JP8098777A JP8098777A JPS5416792A JP S5416792 A JPS5416792 A JP S5416792A JP 8098777 A JP8098777 A JP 8098777A JP 8098777 A JP8098777 A JP 8098777A JP S5416792 A JPS5416792 A JP S5416792A
Authority
JP
Japan
Prior art keywords
cutting apparatus
cutting
abrasive
contact type
semiconductor crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8098777A
Other languages
Japanese (ja)
Inventor
Toshio Morikami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8098777A priority Critical patent/JPS5416792A/en
Publication of JPS5416792A publication Critical patent/JPS5416792A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D47/00Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts
    • B23D47/005Vibration-damping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:In apparatus to produce wafer by cutting from semiconductor crystal, to reduce blade flex and to increase working accuracy, by rotating blade having abrasive and working layer with non contact type vibration stop.
JP8098777A 1977-07-08 1977-07-08 Cutting apparatus Pending JPS5416792A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8098777A JPS5416792A (en) 1977-07-08 1977-07-08 Cutting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8098777A JPS5416792A (en) 1977-07-08 1977-07-08 Cutting apparatus

Publications (1)

Publication Number Publication Date
JPS5416792A true JPS5416792A (en) 1979-02-07

Family

ID=13733841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8098777A Pending JPS5416792A (en) 1977-07-08 1977-07-08 Cutting apparatus

Country Status (1)

Country Link
JP (1) JPS5416792A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56118814A (en) * 1980-02-23 1981-09-18 Masuhiro Mitsuyama Manufacture of laminated plastic sheet or film with gore
JPH0235763U (en) * 1988-08-30 1990-03-08
US5025593A (en) * 1988-01-18 1991-06-25 Mazda Motor Corporation Slicing machine and control method thereof
US5383444A (en) * 1991-09-30 1995-01-24 Mitsubishi Materials Corporation Slicing machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56118814A (en) * 1980-02-23 1981-09-18 Masuhiro Mitsuyama Manufacture of laminated plastic sheet or film with gore
US5025593A (en) * 1988-01-18 1991-06-25 Mazda Motor Corporation Slicing machine and control method thereof
JPH0235763U (en) * 1988-08-30 1990-03-08
US5383444A (en) * 1991-09-30 1995-01-24 Mitsubishi Materials Corporation Slicing machine

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