GB2275130B - Polishing apparatus and method for planarizing layer on a semiconductor wafer - Google Patents

Polishing apparatus and method for planarizing layer on a semiconductor wafer

Info

Publication number
GB2275130B
GB2275130B GB9326510A GB9326510A GB2275130B GB 2275130 B GB2275130 B GB 2275130B GB 9326510 A GB9326510 A GB 9326510A GB 9326510 A GB9326510 A GB 9326510A GB 2275130 B GB2275130 B GB 2275130B
Authority
GB
United Kingdom
Prior art keywords
semiconductor wafer
polishing apparatus
planarizing layer
planarizing
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9326510A
Other versions
GB9326510D0 (en
GB2275130A (en
Inventor
Masako Kodera
Hiroyuki Yano
Atsushi Shigeta
Riichirou Aoki
Hiromi Yajima
Haruo Okano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13297892A external-priority patent/JP3335667B2/en
Priority claimed from JP25688992A external-priority patent/JP3187554B2/en
Priority claimed from JP4331945A external-priority patent/JPH06181192A/en
Priority to GB9611090A priority Critical patent/GB2298960B/en
Priority to GB9611070A priority patent/GB2299895B/en
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to GB9611104A priority patent/GB2298961B/en
Priority claimed from GB9310909A external-priority patent/GB2267389B/en
Publication of GB9326510D0 publication Critical patent/GB9326510D0/en
Publication of GB2275130A publication Critical patent/GB2275130A/en
Publication of GB2275130B publication Critical patent/GB2275130B/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
GB9326510A 1992-05-26 1993-05-26 Polishing apparatus and method for planarizing layer on a semiconductor wafer Expired - Lifetime GB2275130B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB9611104A GB2298961B (en) 1992-05-26 1993-05-26 Polishing apparatus for planarizing layer on a semiconductor wafer
GB9611090A GB2298960B (en) 1992-05-26 1993-05-26 Polishing apparatus and method for planarizing layer on a semiconductor wafer
GB9611070A GB2299895B (en) 1992-05-26 1993-05-26 polishing apparatus for planarizing layer on a semiconductor wafer

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP13297892A JP3335667B2 (en) 1992-05-26 1992-05-26 Method for manufacturing semiconductor device
JP25688992A JP3187554B2 (en) 1992-09-25 1992-09-25 Method for manufacturing semiconductor device
JP28119492 1992-10-20
JP31917592 1992-11-30
JP4331945A JPH06181192A (en) 1992-12-11 1992-12-11 Fabrication of semiconductor device
GB9310909A GB2267389B (en) 1992-05-26 1993-05-26 Polishing method for planarizing layer on a semiconductor wafer

Publications (3)

Publication Number Publication Date
GB9326510D0 GB9326510D0 (en) 1994-03-02
GB2275130A GB2275130A (en) 1994-08-17
GB2275130B true GB2275130B (en) 1997-01-08

Family

ID=27547198

Family Applications (2)

Application Number Title Priority Date Filing Date
GB9326510A Expired - Lifetime GB2275130B (en) 1992-05-26 1993-05-26 Polishing apparatus and method for planarizing layer on a semiconductor wafer
GB9326509A Expired - Lifetime GB2275129B (en) 1992-05-26 1993-05-26 Method for planarizing a layer on a semiconductor wafer

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB9326509A Expired - Lifetime GB2275129B (en) 1992-05-26 1993-05-26 Method for planarizing a layer on a semiconductor wafer

Country Status (1)

Country Link
GB (2) GB2275130B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3438446B2 (en) * 1995-05-15 2003-08-18 ソニー株式会社 Method for manufacturing semiconductor device
JP3649493B2 (en) * 1995-11-02 2005-05-18 株式会社荏原製作所 Polishing end point determination method and apparatus
WO2001076818A1 (en) * 2000-04-06 2001-10-18 Motorola, Inc. A polishing apparatus and a method of detecting an end point of polishing
US8557649B2 (en) 2011-10-21 2013-10-15 International Business Machines Corporation Method for controlling structure height
US10074721B2 (en) 2016-09-22 2018-09-11 Infineon Technologies Ag Method of fabricating a semiconductor wafer that includes producing a planarised surface having both a mesa surface and an insulating layer surface
US10134603B2 (en) * 2016-09-22 2018-11-20 Infineon Technologies Ag Method of planarising a surface
CN110509178B (en) * 2019-09-17 2021-08-10 清华大学 Chemical mechanical polishing method and device for semiconductor substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0272531A1 (en) * 1986-12-08 1988-06-29 Sumitomo Electric Industries Limited Surface grinding machine
US4940507A (en) * 1989-10-05 1990-07-10 Motorola Inc. Lapping means and method
EP0403287A2 (en) * 1989-06-16 1990-12-19 Shin-Etsu Handotai Company Limited Method of polishing semiconductor wafer
US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
US5110428A (en) * 1989-09-05 1992-05-05 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process and apparatus for double-sided chemomechanical polishing of semiconductor wafers and semiconductor wafers obtainable thereby

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5246884A (en) * 1991-10-30 1993-09-21 International Business Machines Corporation Cvd diamond or diamond-like carbon for chemical-mechanical polish etch stop

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0272531A1 (en) * 1986-12-08 1988-06-29 Sumitomo Electric Industries Limited Surface grinding machine
EP0403287A2 (en) * 1989-06-16 1990-12-19 Shin-Etsu Handotai Company Limited Method of polishing semiconductor wafer
US5110428A (en) * 1989-09-05 1992-05-05 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process and apparatus for double-sided chemomechanical polishing of semiconductor wafers and semiconductor wafers obtainable thereby
US4940507A (en) * 1989-10-05 1990-07-10 Motorola Inc. Lapping means and method
US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers

Also Published As

Publication number Publication date
GB2275129A (en) 1994-08-17
GB9326510D0 (en) 1994-03-02
GB9326509D0 (en) 1994-03-02
GB2275130A (en) 1994-08-17
GB2275129B (en) 1997-01-08

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20130525