GB9326509D0 - Polishing apparatus method for planarizing layer on a semiconductor wafer - Google Patents
Polishing apparatus method for planarizing layer on a semiconductor waferInfo
- Publication number
- GB9326509D0 GB9326509D0 GB9326509A GB9326509A GB9326509D0 GB 9326509 D0 GB9326509 D0 GB 9326509D0 GB 9326509 A GB9326509 A GB 9326509A GB 9326509 A GB9326509 A GB 9326509A GB 9326509 D0 GB9326509 D0 GB 9326509D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor wafer
- polishing apparatus
- planarizing layer
- apparatus method
- planarizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13297892A JP3335667B2 (en) | 1992-05-26 | 1992-05-26 | Method for manufacturing semiconductor device |
JP25688992A JP3187554B2 (en) | 1992-09-25 | 1992-09-25 | Method for manufacturing semiconductor device |
JP28119492 | 1992-10-20 | ||
JP31917592 | 1992-11-30 | ||
JP4331945A JPH06181192A (en) | 1992-12-11 | 1992-12-11 | Fabrication of semiconductor device |
GB9310909A GB2267389B (en) | 1992-05-26 | 1993-05-26 | Polishing method for planarizing layer on a semiconductor wafer |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9326509D0 true GB9326509D0 (en) | 1994-03-02 |
GB2275129A GB2275129A (en) | 1994-08-17 |
GB2275129B GB2275129B (en) | 1997-01-08 |
Family
ID=27547198
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9326510A Expired - Lifetime GB2275130B (en) | 1992-05-26 | 1993-05-26 | Polishing apparatus and method for planarizing layer on a semiconductor wafer |
GB9326509A Expired - Lifetime GB2275129B (en) | 1992-05-26 | 1993-05-26 | Method for planarizing a layer on a semiconductor wafer |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9326510A Expired - Lifetime GB2275130B (en) | 1992-05-26 | 1993-05-26 | Polishing apparatus and method for planarizing layer on a semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
GB (2) | GB2275130B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3438446B2 (en) * | 1995-05-15 | 2003-08-18 | ソニー株式会社 | Method for manufacturing semiconductor device |
JP3649493B2 (en) * | 1995-11-02 | 2005-05-18 | 株式会社荏原製作所 | Polishing end point determination method and apparatus |
WO2001076818A1 (en) * | 2000-04-06 | 2001-10-18 | Motorola, Inc. | A polishing apparatus and a method of detecting an end point of polishing |
US8557649B2 (en) | 2011-10-21 | 2013-10-15 | International Business Machines Corporation | Method for controlling structure height |
US10134603B2 (en) | 2016-09-22 | 2018-11-20 | Infineon Technologies Ag | Method of planarising a surface |
US10074721B2 (en) | 2016-09-22 | 2018-09-11 | Infineon Technologies Ag | Method of fabricating a semiconductor wafer that includes producing a planarised surface having both a mesa surface and an insulating layer surface |
CN110509178B (en) * | 2019-09-17 | 2021-08-10 | 清华大学 | Chemical mechanical polishing method and device for semiconductor substrate |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3771857D1 (en) * | 1986-12-08 | 1991-09-05 | Sumitomo Electric Industries | SURFACE GRINDING MACHINE. |
JPH0319336A (en) * | 1989-06-16 | 1991-01-28 | Shin Etsu Handotai Co Ltd | Polishing of semiconductor wafer |
DE3929484A1 (en) * | 1989-09-05 | 1991-03-14 | Wacker Chemitronic | METHOD FOR THE TWO-SIDED CHEMOMECHANICAL POLISHING OF SEMICONDUCTOR DISC, AS WELL AS DEVICE FOR ITS IMPLEMENTATION AND SAME THEREFORE AVAILABLE SEMICONDUCTOR DISC |
US4940507A (en) * | 1989-10-05 | 1990-07-10 | Motorola Inc. | Lapping means and method |
US5036015A (en) * | 1990-09-24 | 1991-07-30 | Micron Technology, Inc. | Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers |
US5246884A (en) * | 1991-10-30 | 1993-09-21 | International Business Machines Corporation | Cvd diamond or diamond-like carbon for chemical-mechanical polish etch stop |
-
1993
- 1993-05-26 GB GB9326510A patent/GB2275130B/en not_active Expired - Lifetime
- 1993-05-26 GB GB9326509A patent/GB2275129B/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB9326510D0 (en) | 1994-03-02 |
GB2275130A (en) | 1994-08-17 |
GB2275129A (en) | 1994-08-17 |
GB2275130B (en) | 1997-01-08 |
GB2275129B (en) | 1997-01-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE20 | Patent expired after termination of 20 years |
Expiry date: 20130525 |