IT1211436B - Metodo per asportare l elemento superiore di nastro dal nastro di chip e relativo dispositivo - Google Patents

Metodo per asportare l elemento superiore di nastro dal nastro di chip e relativo dispositivo

Info

Publication number
IT1211436B
IT1211436B IT8767909A IT6790987A IT1211436B IT 1211436 B IT1211436 B IT 1211436B IT 8767909 A IT8767909 A IT 8767909A IT 6790987 A IT6790987 A IT 6790987A IT 1211436 B IT1211436 B IT 1211436B
Authority
IT
Italy
Prior art keywords
tape
chip
top tape
tape element
chip tape
Prior art date
Application number
IT8767909A
Other languages
English (en)
Other versions
IT8767909A0 (it
Inventor
Masahiro Kubo
Original Assignee
Nitto System Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto System Technology Inc filed Critical Nitto System Technology Inc
Publication of IT8767909A0 publication Critical patent/IT8767909A0/it
Application granted granted Critical
Publication of IT1211436B publication Critical patent/IT1211436B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1067—Continuous longitudinal slitting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y10T156/1087—Continuous longitudinal slitting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
IT8767909A 1986-10-30 1987-10-29 Metodo per asportare l elemento superiore di nastro dal nastro di chip e relativo dispositivo IT1211436B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61259558A JP2662948B2 (ja) 1986-10-30 1986-10-30 チップテープのトップテープ除去装置

Publications (2)

Publication Number Publication Date
IT8767909A0 IT8767909A0 (it) 1987-10-29
IT1211436B true IT1211436B (it) 1989-10-26

Family

ID=17335788

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8767909A IT1211436B (it) 1986-10-30 1987-10-29 Metodo per asportare l elemento superiore di nastro dal nastro di chip e relativo dispositivo

Country Status (5)

Country Link
US (1) US4820369A (it)
JP (1) JP2662948B2 (it)
KR (1) KR880005019A (it)
DE (1) DE3736563C2 (it)
IT (1) IT1211436B (it)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4887778A (en) * 1988-06-01 1989-12-19 Universal Instruments Corporation Feeder drive assembly and replaceable section for tape supplying and cover peeling
DE8807239U1 (it) * 1988-06-03 1988-11-03 Fritsch, Adalbert, 8455 Kastl, De
JPH0723994Y2 (ja) * 1989-01-20 1995-05-31 ティーディーケイ株式会社 電子部品連テープの供給装置
US4943342A (en) * 1988-08-29 1990-07-24 Golemon Valia S Component feeding device for circuit board mounting apparatus
DE3829249C2 (de) * 1988-08-29 1997-03-27 Siemens Ag Verfahren und Vorrichtung von mit Bauelementen gefüllten Blister-Verpackungen
JP2669864B2 (ja) * 1988-09-13 1997-10-29 株式会社日立製作所 チップ電子部品供給装置
DE3903865C1 (en) * 1989-02-10 1990-07-12 Zevatech Ag, Bellach, Ch Supply unit for components packed in belts for feeding automatic fitting machines
US5024720A (en) * 1989-11-08 1991-06-18 Zevatech Ag Feeding apparatus for feeding belted components to an automatic assembly apparatus
JP2519589B2 (ja) * 1989-12-12 1996-07-31 ヤマハ発動機株式会社 テ―プフィ―ダのカバ―テ―プ処理装置
US5017078A (en) * 1990-01-24 1991-05-21 Molex Incorporated Method and apparatus for unloading components from tape carrier packaging
JPH0697717B2 (ja) * 1990-05-10 1994-11-30 永田精機株式会社 電子部品供給装置
JP2556816B2 (ja) * 1993-11-29 1996-11-27 ヤマハ発動機株式会社 テープフィーダーのテープ処理装置
US5658416A (en) * 1994-06-17 1997-08-19 Polaroid Corporation Method and apparatus for peeling a laminate
JP3404431B2 (ja) * 1994-07-04 2003-05-06 富士機械製造株式会社 電子部品供給カートリッジおよび電子部品供給取出装置
DE19506881C1 (de) * 1995-02-17 1996-08-08 Siemens Ag Einrichtung zum Herauslösen von Gegenständen, insbesondere elektronischen Bauteilen, aus einer streifenförmigen Verpackungseinheit
DE29617668U1 (de) * 1996-10-10 1996-12-05 Hagn Erwin Vorrichtung zur Herstellung einer Ansaugfläche auf einem Gegenstand und dadurch ausgebildetes elektrisches Bauteil
US6077022A (en) * 1997-02-18 2000-06-20 Zevatech Trading Ag Placement machine and a method to control a placement machine
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
DE59813989D1 (de) 1997-12-07 2007-06-14 Oerlikon Assembly Equipment Ag Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
US6031242A (en) * 1998-01-23 2000-02-29 Zevatech, Inc. Semiconductor die in-flight registration and orientation method and apparatus
SG71189A1 (en) * 1998-01-26 2000-03-21 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
JP4486259B2 (ja) * 1998-12-22 2010-06-23 マイデータ オートメーション アクチボラグ 部品テープ情報を部品取付機に移転する方法および手段
JP4370058B2 (ja) * 1998-12-22 2009-11-25 マイデータ オートメーション アクチボラグ 基板に部品を装着する装置
US6321817B1 (en) 1998-12-25 2001-11-27 Matsushita Electric Industrial Co., Ltd. Electronic component supply device
US6162007A (en) * 1999-01-14 2000-12-19 Witte; Stefan Apparatus for feeding electronic component tape
US6402452B1 (en) 1999-04-26 2002-06-11 Hover-Davis, Inc. Carrier tape feeder with cover tape parting
US6619526B1 (en) * 2000-01-26 2003-09-16 Tyco Electronics Logistics Ag High-speed tape feeder for pick and place machines
US6786266B2 (en) 2000-05-26 2004-09-07 K. K. Mashintex Waste peeling apparatus
US6652706B1 (en) * 2000-12-01 2003-11-25 Delaware Capital Formation, Inc. Tape feeder with improved cover tape disposition path and drive
US6659705B1 (en) 2001-01-10 2003-12-09 Delaware Capital Formation, Inc. Cover tape cutting system using a thermal energy source
SE522521C2 (sv) 2001-09-07 2004-02-10 Mydata Automation Ab Förfarande, system och arrangemang för hantering av komponenttejper
SE521891C2 (sv) 2001-09-07 2003-12-16 Mydata Automation Ab Förfarande och medel för exponering av elektriska komponenter i en komponentbärartejp
ATE464780T1 (de) * 2001-09-19 2010-04-15 Mydata Automation Ab Bandführungsvorrichtung, anordnung und system zur führung von komponentenbändern
ATE360980T1 (de) * 2003-11-07 2007-05-15 Mydata Automation Ab Ein verfahren und eine anlage zur aussetzung elektronischer bauteilen
EP1530415B1 (en) * 2003-11-10 2007-08-15 Mydata Automation AB Exposure member and tape guide at a component mounting machine
US7073696B2 (en) * 2003-11-24 2006-07-11 Tyco Electronics Corporation High repeatability tape feeder for electronic component carrier tapes
US7763145B2 (en) * 2006-03-17 2010-07-27 Stats Chippac Ltd. System for removal of an integrated circuit from a mount material
US8544652B2 (en) * 2007-06-19 2013-10-01 Hover-Davis, Inc. Component tape
JP2009140994A (ja) * 2007-12-04 2009-06-25 Fuji Mach Mfg Co Ltd テープフィーダにおけるトップテープ剥離方法および剥離装置
JP5171511B2 (ja) * 2008-09-26 2013-03-27 株式会社日立ハイテクインスツルメンツ 電子部品供給カセット、電子部品供給カート及び電子部品装着装置
US8353424B2 (en) * 2009-01-27 2013-01-15 Hitachi High-Tech Instruments Co., Ltd. Component feeder
JP5269714B2 (ja) * 2009-07-22 2013-08-21 株式会社日立ハイテクインスツルメンツ 電子部品供給装置及び電子部品装着装置
JP5302846B2 (ja) * 2009-10-19 2013-10-02 株式会社日立ハイテクインスツルメンツ 部品供給装置及び電子部品装着装置
JP2011155181A (ja) * 2010-01-28 2011-08-11 Hitachi High-Tech Instruments Co Ltd フィーダ及び電子部品装着装置
US8678065B2 (en) * 2010-03-30 2014-03-25 Sts Co., Ltd. Carrier tape feeder
JP5650428B2 (ja) * 2010-04-01 2015-01-07 株式会社日立ハイテクインスツルメンツ 電子部品供給装置
JP2011222569A (ja) * 2010-04-02 2011-11-04 Hitachi High-Tech Instruments Co Ltd 電子部品供給装置
JP5761941B2 (ja) * 2010-08-03 2015-08-12 ヤマハ発動機株式会社 フィーダ
JP5459239B2 (ja) * 2011-02-08 2014-04-02 パナソニック株式会社 テープフィーダおよびテープフィーダにおけるテープ装着方法
WO2014016980A1 (ja) * 2012-07-27 2014-01-30 パナソニック株式会社 部品供給装置および部品供給方法
KR102025369B1 (ko) * 2012-09-12 2019-09-25 한화정밀기계 주식회사 부품 장착 장비용 테이프 공급 장치 및 테이프 공급 방법
WO2015025383A1 (ja) 2013-08-21 2015-02-26 富士機械製造株式会社 フィーダ部品種決定方法およびフィーダ部品種決定装置
WO2015029121A1 (ja) 2013-08-26 2015-03-05 富士機械製造株式会社 部品供給装置
JP6271563B2 (ja) * 2013-08-26 2018-01-31 富士機械製造株式会社 フィーダ、および部品実装装置
JP6166624B2 (ja) * 2013-09-05 2017-07-19 ヤマハ発動機株式会社 部品供給装置及びそれを用いた部品実装装置
EP3313161B1 (en) * 2015-06-18 2020-02-05 FUJI Corporation Tape cutting processing device and processing method
US10390469B2 (en) 2015-09-08 2019-08-20 Fuji Corporation Tape feeder
JP6415740B2 (ja) * 2015-10-01 2018-10-31 ヤマハ発動機株式会社 テープ処理方法およびテープ補修部材
US10667447B2 (en) * 2016-03-30 2020-05-26 Yamaha Hatsudoki Kabushiki Kaisha Components feeder
DE102016108668B4 (de) * 2016-05-11 2020-06-04 Asm Assembly Systems Gmbh & Co. Kg Werkzeug und Verfahren zum Verarbeiten einer Deckfolie eines Bauelementgurtes, Bauelement-Zuführvorrichtung
JP6861339B2 (ja) * 2017-03-31 2021-04-21 パナソニックＩｐマネジメント株式会社 テープフィーダ及びテープフィーダにおけるカバーテープ剥離方法
JP6861338B2 (ja) * 2017-03-31 2021-04-21 パナソニックＩｐマネジメント株式会社 テープフィーダ及びテープフィーダにおけるカバーテープ剥離方法
US11388850B2 (en) * 2017-08-01 2022-07-12 Yamaha Hatsudoki Kabushiki Kaisha Processing method for tip end of tape
WO2021155199A1 (en) 2020-01-30 2021-08-05 Automation Technical Service Inc Component feeder mechanism with floating frame

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1323212A (en) * 1919-11-25 Method op producing bias fabric tape ob strip
US3033741A (en) * 1956-07-25 1962-05-08 Amato Raphael A D Stripping machine for use in connection with siding boards
US3518145A (en) * 1967-03-13 1970-06-30 Ferdinand Christensen Pressure sensitive ribbon cover stripping means and method therefor
US3534666A (en) * 1968-08-07 1970-10-20 American Can Co Plastic bag manufacture
US4196040A (en) * 1978-02-21 1980-04-01 Byers Photo Equipment Co., Inc. Apparatus for removing reprint photographic films from a carrier strip
DE3214600A1 (de) * 1982-04-20 1983-10-20 Siemens AG, 1000 Berlin und 8000 München Zufuhreinrichtung fuer gegurtete elektronische bauelemente zu bestueckungsautomaten fuer leiterplatten oder dgl.
JPH0620971B2 (ja) * 1984-07-24 1994-03-23 富士機械製造株式会社 電子部品キヤリヤテ−プのカバ−テ−プ剥がし装置
US4586670A (en) * 1984-12-17 1986-05-06 Usm Corporation Tape stripper for electrical component tape feeder
JPH0725476B2 (ja) * 1985-02-28 1995-03-22 三洋電機株式会社 電子部品の自動装着装置におけるテ−プ移送装置
JPS61217456A (ja) * 1985-03-20 1986-09-27 Matsushita Electric Ind Co Ltd テ−ピングカセツト式電子部品の送り装置
JPS61229774A (ja) * 1985-04-03 1986-10-14 Nec Corp 二枚組連続用紙の自動装填機構

Also Published As

Publication number Publication date
IT8767909A0 (it) 1987-10-29
KR880005019A (ko) 1988-06-27
JP2662948B2 (ja) 1997-10-15
JPS63112366A (ja) 1988-05-17
US4820369A (en) 1989-04-11
DE3736563C2 (de) 1994-08-11
DE3736563A1 (de) 1988-05-11

Similar Documents

Publication Publication Date Title
IT1211436B (it) Metodo per asportare l elemento superiore di nastro dal nastro di chip e relativo dispositivo
KR880701023A (ko) 반도체 장치 제조 방법
KR880004552A (ko) 반도체장치 제조방법
KR890700922A (ko) 반도체 장치와 그 제조방법
KR880013254A (ko) 반도체장치 및 그 제조방법
KR870011686A (ko) 반도체장치 및 그 제조방법
DE3689735T2 (de) Verfahren und Gerät zur Herstellung von Halbleitervorrichtungen.
KR920003832A (ko) 반도체 장치 제조 방법
KR910007164A (ko) 반도체장치 및 그 제조방법
KR910008793A (ko) 반도체장치 및 그 제조방법
KR900008644A (ko) 반도체 장치 제조 방법
KR850006258A (ko) 반도체장치 제조방법
ITMI911952A0 (it) Dispositivo semiconduttore e metodo per la sua fabbricazione
KR870009477A (ko) 반도체장치와 그 제조방법
KR890015368A (ko) 반도체장치 제조방법
KR880701457A (ko) 반도체 장치 제조 방법
KR900012352A (ko) 반도체장치 패키지 및 그 패키지의 제조방법
KR890004403A (ko) 반도체 장치 및 제조방법
KR860000710A (ko) 반도체장치 제조방법
KR890004398A (ko) 반도체장치 및 그의 제조방법
KR870008394A (ko) 반도체장치 및 그 제조방법
KR890004428A (ko) 수지밀폐형소자 및 그 제조방법
KR910001871A (ko) 반도체 소자 제조방법
KR880701968A (ko) 반도체장치 및 그 제조방법
KR900015301A (ko) 반도체장치 및 그 제조방법

Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19951024