IT1062377B - Procedimento per evitare i difetti dovuti all impilaggio nella fabbricazione di dispositivi semiconduttori di silicio - Google Patents

Procedimento per evitare i difetti dovuti all impilaggio nella fabbricazione di dispositivi semiconduttori di silicio

Info

Publication number
IT1062377B
IT1062377B IT68546/76A IT6854676A IT1062377B IT 1062377 B IT1062377 B IT 1062377B IT 68546/76 A IT68546/76 A IT 68546/76A IT 6854676 A IT6854676 A IT 6854676A IT 1062377 B IT1062377 B IT 1062377B
Authority
IT
Italy
Prior art keywords
stacking
procedure
defects due
avoid defects
semiconductive devices
Prior art date
Application number
IT68546/76A
Other languages
English (en)
Italian (it)
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Application granted granted Critical
Publication of IT1062377B publication Critical patent/IT1062377B/it

Links

Classifications

    • H10P14/69391
    • H10P14/6309
    • H10P14/6322
    • H10P14/6334
    • H10P14/69433
    • H10P36/03
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/003Anneal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/043Dual dielectric
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/06Gettering
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/061Gettering-armorphous layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/097Lattice strain and defects
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/928Front and rear surface processing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/938Lattice strain control or utilization
IT68546/76A 1975-06-24 1976-06-23 Procedimento per evitare i difetti dovuti all impilaggio nella fabbricazione di dispositivi semiconduttori di silicio IT1062377B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/589,945 US3997368A (en) 1975-06-24 1975-06-24 Elimination of stacking faults in silicon devices: a gettering process

Publications (1)

Publication Number Publication Date
IT1062377B true IT1062377B (it) 1984-10-10

Family

ID=24360225

Family Applications (1)

Application Number Title Priority Date Filing Date
IT68546/76A IT1062377B (it) 1975-06-24 1976-06-23 Procedimento per evitare i difetti dovuti all impilaggio nella fabbricazione di dispositivi semiconduttori di silicio

Country Status (11)

Country Link
US (1) US3997368A (cg-RX-API-DMAC10.html)
JP (1) JPS523381A (cg-RX-API-DMAC10.html)
BE (1) BE843164A (cg-RX-API-DMAC10.html)
CA (1) CA1046166A (cg-RX-API-DMAC10.html)
DE (1) DE2628087A1 (cg-RX-API-DMAC10.html)
ES (1) ES449145A1 (cg-RX-API-DMAC10.html)
FR (1) FR2317769A1 (cg-RX-API-DMAC10.html)
GB (1) GB1547897A (cg-RX-API-DMAC10.html)
IT (1) IT1062377B (cg-RX-API-DMAC10.html)
NL (1) NL7606846A (cg-RX-API-DMAC10.html)
SE (1) SE414562B (cg-RX-API-DMAC10.html)

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JPS60133734A (ja) * 1983-12-21 1985-07-16 Mitsubishi Electric Corp 半導体装置の製造方法
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JPH0684925A (ja) * 1992-07-17 1994-03-25 Toshiba Corp 半導体基板およびその処理方法
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US8933223B2 (en) 2010-10-14 2015-01-13 Basf Se Process for preparing a cyclic tertiary amine
US8436169B2 (en) 2010-10-29 2013-05-07 Basf Se Process for preparing 1,4-bishydroxyethylpiperazine
EP2632909B1 (de) 2010-10-29 2015-02-25 Basf Se Verfahren zur herstellung von 1,4-bishydroxyethyl-piperazin
US8884015B2 (en) 2012-06-01 2014-11-11 Basf Se Process for the preparation of a mono-N-alkypiperazine
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Also Published As

Publication number Publication date
CA1046166A (en) 1979-01-09
DE2628087A1 (de) 1977-01-20
SE414562B (sv) 1980-08-04
JPS613088B2 (cg-RX-API-DMAC10.html) 1986-01-30
GB1547897A (en) 1979-06-27
NL7606846A (nl) 1976-12-28
JPS523381A (en) 1977-01-11
BE843164A (fr) 1976-10-18
FR2317769A1 (fr) 1977-02-04
US3997368A (en) 1976-12-14
ES449145A1 (es) 1977-12-01
DE2628087C2 (cg-RX-API-DMAC10.html) 1988-08-04
SE7606869L (sv) 1976-12-25
FR2317769B1 (cg-RX-API-DMAC10.html) 1980-10-24

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