IT1032591B - Procedimento per la fabbricazione di dispostivi semiconduttori - Google Patents

Procedimento per la fabbricazione di dispostivi semiconduttori

Info

Publication number
IT1032591B
IT1032591B IT7567845A IT6784575A IT1032591B IT 1032591 B IT1032591 B IT 1032591B IT 7567845 A IT7567845 A IT 7567845A IT 6784575 A IT6784575 A IT 6784575A IT 1032591 B IT1032591 B IT 1032591B
Authority
IT
Italy
Prior art keywords
procedure
manufacturing
semiconductive devices
semiconductive
devices
Prior art date
Application number
IT7567845A
Other languages
English (en)
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Application granted granted Critical
Publication of IT1032591B publication Critical patent/IT1032591B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/928—Front and rear surface processing
IT7567845A 1974-06-28 1975-04-01 Procedimento per la fabbricazione di dispostivi semiconduttori IT1032591B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US484084A US3897627A (en) 1974-06-28 1974-06-28 Method for manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
IT1032591B true IT1032591B (it) 1979-06-20

Family

ID=23922675

Family Applications (1)

Application Number Title Priority Date Filing Date
IT7567845A IT1032591B (it) 1974-06-28 1975-04-01 Procedimento per la fabbricazione di dispostivi semiconduttori

Country Status (7)

Country Link
US (1) US3897627A (it)
JP (1) JPS531630B2 (it)
BE (1) BE827022A (it)
DE (1) DE2511925A1 (it)
FR (1) FR2276692A1 (it)
GB (1) GB1476585A (it)
IT (1) IT1032591B (it)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4023260A (en) * 1976-03-05 1977-05-17 Bell Telephone Laboratories, Incorporated Method of manufacturing semiconductor diodes for use in millimeter-wave circuits
US4023258A (en) * 1976-03-05 1977-05-17 Bell Telephone Laboratories, Incorporated Method of manufacturing semiconductor diodes for use in millimeter-wave circuits
US4080722A (en) * 1976-03-22 1978-03-28 Rca Corporation Method of manufacturing semiconductor devices having a copper heat capacitor and/or copper heat sink
FR2420208A1 (fr) * 1978-03-17 1979-10-12 Thomson Csf Procede de realisation collective d'une source d'ondes millimetriques de type preaccorde et source ainsi realisee
US4237600A (en) * 1978-11-16 1980-12-09 Rca Corporation Method for fabricating stacked semiconductor diodes for high power/low loss applications
US4384400A (en) * 1979-12-06 1983-05-24 The United States Of America As Represented By The Secretary Of The Army Method of fabricating monolithically interconnected series-parallel avalanche diodes
US4276098A (en) * 1980-03-31 1981-06-30 Bell Telephone Laboratories, Incorporated Batch processing of semiconductor devices
DE3211391A1 (de) * 1982-03-27 1983-09-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum herstellen einer halbleiteranordnung
US4605919A (en) * 1982-10-04 1986-08-12 Becton, Dickinson And Company Piezoresistive transducer
US4498229A (en) * 1982-10-04 1985-02-12 Becton, Dickinson And Company Piezoresistive transducer
DE3435306A1 (de) * 1984-09-26 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von laserdioden mit jutierter integrierter waermesenke
JPH0215652A (ja) * 1988-07-01 1990-01-19 Mitsubishi Electric Corp 半導体装置及びその製造方法
KR100287919B1 (ko) * 1992-01-06 2001-05-02 사토 게니치로 더미 패턴을 갖는 반도체 칩
JP2836334B2 (ja) * 1992-01-23 1998-12-14 三菱電機株式会社 高出力半導体装置の製造方法
US5580831A (en) * 1993-07-28 1996-12-03 Fujitsu Limited Sawcut method of forming alignment marks on two faces of a substrate
US5413659A (en) * 1993-09-30 1995-05-09 Minnesota Mining And Manufacturing Company Array of conductive pathways
US5882988A (en) * 1995-08-16 1999-03-16 Philips Electronics North America Corporation Semiconductor chip-making without scribing
JPH09172223A (ja) * 1995-12-19 1997-06-30 Sony Corp 半導体装置と半導体装置の製造方法
DE19710375C2 (de) * 1997-03-13 2002-11-07 Micronas Semiconductor Holding Verfahren zum Herstellen von räumlich strukturierten Bauteilen
EP1668688A4 (en) * 2003-09-19 2011-03-02 Tinggi Technologies Private Ltd Fabrication of semiconductor devices
AU2003263726A1 (en) * 2003-09-19 2005-04-11 Xuejun Kang Fabrication of conductive metal layer on semiconductor devices
US20050133891A1 (en) * 2003-12-23 2005-06-23 Tessera, Inc. System and method for increasing the ball pitch of an electronic circuit package
US8039363B2 (en) * 2003-12-23 2011-10-18 Tessera, Inc. Small chips with fan-out leads
JP2007535804A (ja) * 2004-03-15 2007-12-06 ティンギ テクノロジーズ プライベート リミテッド 半導体デバイスの製造
EP1756875A4 (en) * 2004-04-07 2010-12-29 Tinggi Technologies Private Ltd PREPARATION OF A REFLECTION LAYER ON SEMICONDUCTOR LUMINAIRE DIODES
SG130975A1 (en) * 2005-09-29 2007-04-26 Tinggi Tech Private Ltd Fabrication of semiconductor devices for light emission
SG131803A1 (en) * 2005-10-19 2007-05-28 Tinggi Tech Private Ltd Fabrication of transistors
SG133432A1 (en) * 2005-12-20 2007-07-30 Tinggi Tech Private Ltd Localized annealing during semiconductor device fabrication
SG140473A1 (en) 2006-08-16 2008-03-28 Tinggi Tech Private Ltd Improvements in external light efficiency of light emitting diodes
SG140512A1 (en) * 2006-09-04 2008-03-28 Tinggi Tech Private Ltd Electrical current distribution in light emitting devices
US7759201B2 (en) 2007-12-17 2010-07-20 Sandisk 3D Llc Method for fabricating pitch-doubling pillar structures
US7981592B2 (en) 2008-04-11 2011-07-19 Sandisk 3D Llc Double patterning method
US7713818B2 (en) 2008-04-11 2010-05-11 Sandisk 3D, Llc Double patterning method
US7786015B2 (en) 2008-04-28 2010-08-31 Sandisk 3D Llc Method for fabricating self-aligned complementary pillar structures and wiring
US8026178B2 (en) 2010-01-12 2011-09-27 Sandisk 3D Llc Patterning method for high density pillar structures
DE102012111358A1 (de) * 2012-11-23 2014-05-28 Osram Opto Semiconductors Gmbh Verfahren zum Vereinzeln eines Verbundes in Halbleiterchips und Halbleiterchip

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3820236A (en) * 1969-06-20 1974-06-28 Texas Instruments Inc Method of making metal semiconductor diodes having plated heat sink members
FR2100997B1 (it) * 1970-08-04 1973-12-21 Silec Semi Conducteurs
US3720997A (en) * 1971-01-11 1973-03-20 Motorola Inc Eutectic plating and breaking silicon wafers
BE791930A (fr) * 1971-12-02 1973-03-16 Western Electric Co Dispositif electroluminescent et procede pour sa fabrication

Also Published As

Publication number Publication date
JPS531630B2 (it) 1978-01-20
FR2276692A1 (fr) 1976-01-23
JPS50131459A (it) 1975-10-17
BE827022A (fr) 1975-07-16
GB1476585A (en) 1977-06-16
DE2511925A1 (de) 1976-01-15
US3897627A (en) 1975-08-05

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