IN2014CN04906A - - Google Patents

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Publication number
IN2014CN04906A
IN2014CN04906A IN4906CHN2014A IN2014CN04906A IN 2014CN04906 A IN2014CN04906 A IN 2014CN04906A IN 4906CHN2014 A IN4906CHN2014 A IN 4906CHN2014A IN 2014CN04906 A IN2014CN04906 A IN 2014CN04906A
Authority
IN
India
Application number
Other languages
English (en)
Inventor
Qing Wu
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of IN2014CN04906A publication Critical patent/IN2014CN04906A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1452—Polymer derived only from ethylenically unsaturated monomer
    • Y10T428/1457—Silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
IN4906CHN2014 2011-12-27 2014-06-27 IN2014CN04906A (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110444884.6A CN102690611B (zh) 2011-12-27 2011-12-27 胶带组合物以及由其制备的胶带
PCT/US2012/071123 WO2013101693A1 (en) 2011-12-27 2012-12-21 Adhesive tape composition and adhesive tape prepared from same

Publications (1)

Publication Number Publication Date
IN2014CN04906A true IN2014CN04906A (enrdf_load_stackoverflow) 2015-09-18

Family

ID=46856353

Family Applications (1)

Application Number Title Priority Date Filing Date
IN4906CHN2014 IN2014CN04906A (enrdf_load_stackoverflow) 2011-12-27 2014-06-27

Country Status (7)

Country Link
US (1) US10273384B2 (enrdf_load_stackoverflow)
EP (1) EP2797973B1 (enrdf_load_stackoverflow)
JP (1) JP6188716B2 (enrdf_load_stackoverflow)
KR (1) KR20140116444A (enrdf_load_stackoverflow)
CN (1) CN102690611B (enrdf_load_stackoverflow)
IN (1) IN2014CN04906A (enrdf_load_stackoverflow)
WO (1) WO2013101693A1 (enrdf_load_stackoverflow)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103590280B (zh) * 2013-10-21 2016-11-02 惠州市长润发涂料有限公司 一种uv光固化的弹性手感纸品光油及其施工方法
US10927276B2 (en) 2015-06-04 2021-02-23 3M Innovative Properties Company Methods of bonding hardware to vehicular glass
US10350861B2 (en) 2015-07-31 2019-07-16 Corning Incorporated Laminate structures with enhanced damping properties
CN105441001A (zh) * 2015-12-24 2016-03-30 深圳市浩力新材料技术有限公司 一种高性能光通讯器件用接着剂及其制备方法
DE102016207540A1 (de) 2016-05-02 2017-11-02 Tesa Se Wasserdampfsperrende Klebemasse mit hochfunktionalisiertem Poly(meth)acrylat
DE102016207548A1 (de) 2016-05-02 2017-11-02 Tesa Se Härtbare Klebemasse und darauf basierende Reaktivklebebänder
DE102016207550A1 (de) 2016-05-02 2017-11-02 Tesa Se Funktionalisierte (Co)Polymere für Klebesysteme und Klebebänder
JPWO2018020939A1 (ja) * 2016-07-25 2019-05-09 セメダイン株式会社 感圧接着剤
DE102016220237A1 (de) 2016-10-17 2018-04-19 Tesa Se Verfahren zur Herstellung einer versiegelten Falzverbindung
CN107163478B (zh) * 2017-06-27 2022-03-08 江门盈骅光电科技有限公司 可先热固化、再光照射固化的不饱和树脂组合物及其制备方法和用途
JP6709943B2 (ja) 2017-12-13 2020-06-17 ナミックス株式会社 導電性ペースト
CN108676513A (zh) * 2018-06-06 2018-10-19 芜湖夏鑫新型材料科技有限公司 一种手机玻璃保护膜及其制备方法
DE102018213824A1 (de) 2018-08-16 2020-02-20 Tesa Se Verfahren zur Herstellung einer versiegelten Falzverbindung
CN109666428A (zh) * 2018-12-28 2019-04-23 福建友谊胶粘带集团有限公司 一种手机屏幕遮光胶水、胶带及其制备方法
CN109694676A (zh) * 2018-12-28 2019-04-30 福建友谊胶粘带集团有限公司 一种反射片保护胶水、胶带及其制备方法
WO2020172417A1 (en) 2019-02-20 2020-08-27 Adhesives Research, Inc. Uv light curable adhesive and device with uv light curable adhesive
CN111234713A (zh) * 2019-05-29 2020-06-05 深圳市鑫东邦科技有限公司 一种底部填充胶及其制备方法
CN113853413B (zh) * 2019-05-31 2024-02-13 积水化学工业株式会社 粘接剂组合物、光学部件、电子部件及电子模块
CN110467890B (zh) * 2019-07-16 2021-09-17 广州慧谷工程材料有限公司 压敏胶带及其制备方法、用于制备压敏胶带的树脂组合物
CN110396374B (zh) * 2019-09-11 2021-09-28 苏州赛伍应用技术股份有限公司 一种锂电池壳保护胶带及其制备方法和使用方法
DE102019215890A1 (de) 2019-10-16 2021-04-22 Tesa Se Härtbare Klebemasse und darauf basierende Reaktivklebebänder
WO2021153487A1 (ja) * 2020-01-30 2021-08-05 東レ株式会社 塗布剤、シート状中間基材、光硬化性の樹脂フィルム、繊維強化複合材料中間体、繊維強化複合材料ならびに繊維強化複合材料中間体および繊維強化複合材料の製造方法
DE102022113506A1 (de) 2022-05-30 2023-11-30 Tesa Se Verfahren zum Verbinden, Ablösen und Wiederverbinden von Substraten

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4677137A (en) * 1985-05-31 1987-06-30 Minnesota Mining And Manufacturing Company Supported photoinitiator
JPH0794587B2 (ja) * 1990-11-14 1995-10-11 日本ペイント株式会社 新規常温硬化性樹脂組成物及び塗料組成物
US5262232A (en) * 1992-01-22 1993-11-16 Minnesota Mining And Manufacturing Company Vibration damping constructions using acrylate-containing damping materials
US5427638A (en) 1992-06-04 1995-06-27 Alliedsignal Inc. Low temperature reaction bonding
US5453450A (en) 1993-06-16 1995-09-26 Minnesota Mining And Manufacturing Company Stabilized curable adhesives
WO1996009352A1 (en) 1994-09-19 1996-03-28 Minnesota Mining And Manufacturing Company Epoxy adhesive composition
US5721289A (en) * 1994-11-04 1998-02-24 Minnesota Mining And Manufacturing Company Stable, low cure-temperature semi-structural pressure sensitive adhesive
US6057382A (en) 1998-05-01 2000-05-02 3M Innovative Properties Company Epoxy/thermoplastic photocurable adhesive composition
JP4573373B2 (ja) 1999-05-20 2010-11-04 スリーエム イノベイティブ プロパティズ カンパニー 接着構造体
US6949297B2 (en) 2001-11-02 2005-09-27 3M Innovative Properties Company Hybrid adhesives, articles, and methods
US7569634B2 (en) * 2002-02-14 2009-08-04 The Glidden Company Curable adhesive composition, adhesive kit and method of adhering substrates
JP4201519B2 (ja) 2002-04-01 2008-12-24 スリーエム イノベイティブ プロパティズ カンパニー カチオン重合性接着剤組成物及び異方導電性接着剤組成物
WO2006064431A2 (en) * 2004-12-14 2006-06-22 Dutch Polymer Institute Porous holographic film
JP2006199894A (ja) 2005-01-24 2006-08-03 Sekisui Chem Co Ltd 接着シート及び半導体装置
US8535473B2 (en) 2005-03-03 2013-09-17 3M Innovative Properties Company Thermosettable adhesive tape, articles and methods
US20070213429A1 (en) * 2006-03-10 2007-09-13 Chih-Min Cheng Anisotropic conductive adhesive
US20090104448A1 (en) * 2007-10-17 2009-04-23 Henkel Ag & Co. Kgaa Preformed adhesive bodies useful for joining substrates
JP2011513995A (ja) * 2008-03-07 2011-04-28 スリーエム イノベイティブ プロパティズ カンパニー 模様付き裏材を備えるダイシングテープ及びダイアタッチ接着剤
DE102008028638A1 (de) * 2008-06-18 2009-12-24 Henkel Ag & Co. Kgaa Kleb- und Dichtstoff oder Strukturschaum auf Epoxidbasis enthaltend anorganische Nanopartikel mit Acrylsäureester-haltiger Hülle

Also Published As

Publication number Publication date
CN102690611A (zh) 2012-09-26
KR20140116444A (ko) 2014-10-02
JP2015507680A (ja) 2015-03-12
WO2013101693A1 (en) 2013-07-04
EP2797973B1 (en) 2018-06-06
EP2797973A1 (en) 2014-11-05
JP6188716B2 (ja) 2017-08-30
US20140349054A1 (en) 2014-11-27
US10273384B2 (en) 2019-04-30
CN102690611B (zh) 2015-06-24

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