IL52187A - Flux composition for soft soldering and its use in electrical and electronic industries - Google Patents

Flux composition for soft soldering and its use in electrical and electronic industries

Info

Publication number
IL52187A
IL52187A IL52187A IL5218777A IL52187A IL 52187 A IL52187 A IL 52187A IL 52187 A IL52187 A IL 52187A IL 5218777 A IL5218777 A IL 5218777A IL 52187 A IL52187 A IL 52187A
Authority
IL
Israel
Prior art keywords
electrical
flux composition
electronic industries
soft soldering
soldering
Prior art date
Application number
IL52187A
Other languages
English (en)
Inventor
Gordon Francis Arbib
Wallace Rubin
Original Assignee
Multicore Solders Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multicore Solders Ltd filed Critical Multicore Solders Ltd
Publication of IL52187A publication Critical patent/IL52187A/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618Carboxylic acids or salts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IL52187A 1976-06-11 1977-05-29 Flux composition for soft soldering and its use in electrical and electronic industries IL52187A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB24410/76A GB1550648A (en) 1976-06-11 1976-06-11 Soft soldering

Publications (1)

Publication Number Publication Date
IL52187A true IL52187A (en) 1982-07-30

Family

ID=10211310

Family Applications (1)

Application Number Title Priority Date Filing Date
IL52187A IL52187A (en) 1976-06-11 1977-05-29 Flux composition for soft soldering and its use in electrical and electronic industries

Country Status (29)

Country Link
US (2) US4092182A (de)
JP (1) JPS52152846A (de)
AR (1) AR211186A1 (de)
AU (1) AU502483B2 (de)
BE (1) BE855242A (de)
BR (1) BR7703776A (de)
CA (1) CA1085275A (de)
CH (2) CH621277A5 (de)
DE (2) DE2759915C1 (de)
DK (1) DK257877A (de)
ES (2) ES459662A1 (de)
FI (1) FI63683C (de)
FR (1) FR2354172A1 (de)
GB (1) GB1550648A (de)
HK (1) HK20980A (de)
HU (2) HU180180B (de)
IE (1) IE45280B1 (de)
IL (1) IL52187A (de)
IN (1) IN146478B (de)
IT (1) IT1083506B (de)
LU (1) LU77523A1 (de)
MY (1) MY8100032A (de)
NL (1) NL175705C (de)
NZ (1) NZ184109A (de)
PT (1) PT66649B (de)
SE (2) SE7706771L (de)
SU (1) SU1042607A3 (de)
TR (1) TR19703A (de)
ZA (1) ZA772799B (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1594804A (en) * 1978-05-23 1981-08-05 Multicore Solders Ltd Soft soldering
JPS56141997A (en) * 1980-03-17 1981-11-05 Multicore Solders Ltd Solder material for forming solder bath
US4298407A (en) * 1980-08-04 1981-11-03 E. I. Du Pont De Nemours And Company Flux treated solder powder composition
US4342607A (en) * 1981-01-05 1982-08-03 Western Electric Company, Inc. Solder flux
EP0079135A3 (de) * 1981-11-06 1984-05-30 Multicore Solders Limited Verfahren zur Herstellung von Lötformteilen zum Löten elektronischen Bauelementen
US4380518A (en) * 1982-01-04 1983-04-19 Western Electric Company, Inc. Method of producing solder spheres
JPS60133998A (ja) * 1983-12-22 1985-07-17 Nippon Genma:Kk はんだ付用フラツクス
US4561913A (en) * 1984-03-12 1985-12-31 At&T Technologies, Inc. Soldering flux additive
US4601763A (en) * 1984-10-11 1986-07-22 Lgz Landis & Gyr Zug Ag Method for the mechanical soft-soldering of heavy metals utilizing a fluxing agent
US4568395A (en) * 1985-05-10 1986-02-04 Nabhani Abdol R Precleaner system and soldering flux
JPS6388085A (ja) * 1986-10-02 1988-04-19 Toyo Kohan Co Ltd めつき鋼板の後処理方法
US4795508A (en) * 1987-02-05 1989-01-03 Shell Internationale Research Maatschappij B.V. Soldering compositions
US5639515A (en) * 1987-11-10 1997-06-17 Toyo Kohan Co., Ltd. Method for post-treatment of plated steel sheet for soldering
GB8900381D0 (en) * 1989-01-09 1989-03-08 Cookson Group Plc Flux composition
JPH07121468B2 (ja) * 1990-10-03 1995-12-25 メック株式会社 はんだ付け用フラックス
DE4033430A1 (de) * 1990-10-20 1992-04-23 Licentia Gmbh Verfahren zum herstellen eines lotmittelauftrags
JPH04351288A (ja) * 1991-05-27 1992-12-07 Metsuku Kk はんだ付け用フラックス及びクリームはんだ
US5118364A (en) * 1991-08-08 1992-06-02 International Business Machines Corporation Solder flux/paste compositions
DE4235575C2 (de) * 1992-10-22 1994-11-10 Degussa Weichlotpaste zum Löten von elektronischen Schaltungen
AU1811601A (en) 1999-12-03 2001-06-12 Fry's Metals, Inc. Soldering flux
US7108755B2 (en) * 2002-07-30 2006-09-19 Motorola, Inc. Simplification of ball attach method using super-saturated fine crystal flux
US7182241B2 (en) * 2002-08-09 2007-02-27 Micron Technology, Inc. Multi-functional solder and articles made therewith, such as microelectronic components
US7285173B2 (en) 2003-11-21 2007-10-23 Illinois Tool Works, Inc. Desoldering systems and processes
US7861915B2 (en) * 2004-04-16 2011-01-04 Ms2 Technologies, Llc Soldering process
CN1972779A (zh) * 2004-05-28 2007-05-30 P·凯金属公司 焊膏和方法
TW200610122A (en) * 2004-09-14 2006-03-16 P Kay Metal Inc Soldering process
TW200633810A (en) * 2004-12-28 2006-10-01 Arakawa Chem Ind Lead-free solder flux and solder paste
RU2463144C2 (ru) * 2010-12-15 2012-10-10 Открытое акционерное общество "Авангард" Флюс для низкотемпературной пайки
US8784696B2 (en) * 2012-05-09 2014-07-22 Xerox Corporation Intermediate transfer members containing internal release additives
DE102012220159B4 (de) * 2012-11-06 2019-06-27 Ersa Gmbh Verfahren und Reinigungssystem zur Reinigung des Prozessgases in Lötanlagen und Lötabsaugsystemen
WO2020004543A1 (ja) * 2018-06-29 2020-01-02 千住金属工業株式会社 やに入りはんだ用のフラックス、やに入りはんだ、フラックスコートはんだ用のフラックス、フラックスコートはんだ及びはんだ付け方法
JP6604452B1 (ja) * 2019-04-12 2019-11-13 千住金属工業株式会社 フラックス、やに入りはんだ、フラックスコートはんだ及びはんだ付け方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2700628A (en) * 1951-12-07 1955-01-25 Rosa John A De Soldering flux
DE1690265U (de) 1954-08-19 1954-12-30 Herbert R W Hartmann Vorrichtung zum andruekken und anrollen von kapseln am hals von flaschen.
US2829998A (en) * 1955-03-23 1958-04-08 Whiffen And Sons Ltd Soldering fluxes
US3235414A (en) * 1962-01-11 1966-02-15 Continental Can Co Organic flux for soldering
US3301688A (en) * 1965-10-11 1967-01-31 Modine Mfg Co Bonding compositions
US3436278A (en) * 1966-08-08 1969-04-01 Ibm Glycol soldering fluxes
DE1690265B2 (de) * 1967-05-23 1975-10-30 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zur Erzeugung von gedruckten Leitungszügen
US3675307A (en) * 1969-08-08 1972-07-11 Frys Metals Ltd Soldering fluxes
JPS4834490B1 (de) * 1970-12-07 1973-10-22
CS152769B1 (de) * 1971-05-20 1974-02-22
DE2312482C3 (de) * 1973-03-13 1981-08-20 Rohde & Schwarz GmbH & Co KG, 8000 München Gedruckte Schaltungsplatte und Verfahren zu deren Herstellung
JPS5234015B2 (de) * 1973-04-10 1977-09-01
US3975216A (en) * 1975-01-31 1976-08-17 Chevron Research Company Wax-flux composition containing a diester of sulfomalic acid for soldering

Also Published As

Publication number Publication date
SE8105378L (sv) 1981-09-10
JPS5718998B2 (de) 1982-04-20
HU177241B (en) 1981-08-28
DE2725701A1 (de) 1977-12-22
MY8100032A (en) 1981-12-31
FI63683B (fi) 1983-04-29
FR2354172B1 (de) 1982-10-22
ES459662A1 (es) 1978-11-16
PT66649A (en) 1977-07-01
HU180180B (en) 1983-02-28
GB1550648A (en) 1979-08-15
FR2354172A1 (fr) 1978-01-06
ES470622A1 (es) 1979-02-01
DE2759915C1 (de) 1982-07-15
NL175705C (nl) 1984-12-17
BR7703776A (pt) 1978-02-28
DE2725701C2 (de) 1982-06-24
NZ184109A (en) 1979-10-25
JPS52152846A (en) 1977-12-19
BE855242A (fr) 1977-09-16
SE7706771L (sv) 1977-12-12
IE45280B1 (en) 1982-07-28
PT66649B (en) 1978-11-10
IN146478B (de) 1979-06-16
TR19703A (tr) 1979-10-11
CH621277A5 (de) 1981-01-30
AU502483B2 (en) 1979-07-26
HK20980A (en) 1980-04-25
ZA772799B (en) 1978-04-26
DK257877A (da) 1977-12-12
NL175705B (nl) 1984-07-16
FI63683C (fi) 1983-08-10
LU77523A1 (de) 1977-09-26
NL7706297A (nl) 1977-12-13
AR211186A1 (es) 1977-10-31
FI771674A (de) 1977-12-12
AU2604077A (en) 1978-12-14
US4092182A (en) 1978-05-30
IT1083506B (it) 1985-05-21
USRE30696E (en) 1981-08-04
CA1085275A (en) 1980-09-09
CH622659A5 (de) 1981-04-15
IE45280L (en) 1977-12-11
SU1042607A3 (ru) 1983-09-15

Similar Documents

Publication Publication Date Title
IL52187A (en) Flux composition for soft soldering and its use in electrical and electronic industries
JPS52128861A (en) Soldering method and device
GB8421389D0 (en) Electronic type memo device
JPS5345646A (en) Soldering device
NZ183175A (en) N-phenyl-n-benzylamines and hypolipidemic compositions conaining such amines
JPS57167662A (en) Capsuled electronic device and capsuled composition
JPS55117559A (en) Soldering method and its device
GB2069205B (en) Device for use in an electrical circuit and comprising two separabel parts
JPS5388644A (en) Soldering method and flux composition
JPS52107569A (en) Device for bending and cutting electronic parts
AU3179377A (en) Electronic circuit
JPS5331547A (en) Soldering method and device
JPS5365241A (en) Soldering method and apparatus
JPS5332854A (en) Soldering device
JPS532552A (en) Polyamide* polyolefin* polyacrylate or epoxy compositions having flame resistance and selffextinguishment in some cases and process for manufacture
JPS52123850A (en) Electronic circuit
JPS5353552A (en) Soldering device
JPS5383947A (en) Soldering device
JPS54128459A (en) Phosphorrcontaining solder alloy and additive alloy therefor
JPS5319563A (en) Method and device for soldering integrated circuit
JPS5325878A (en) Switch device in electronic watch
JPS56109156A (en) Vaporrphase soldering method and its device
JPS52128859A (en) Activator for soldering flux
JPS5376147A (en) Flux for soldering
GB1547132A (en) Copperbased alloys in thin strips for electrical and electronic uses