IL138483A0 - Chemical mechanical polishing slurry useful for copper substrates - Google Patents

Chemical mechanical polishing slurry useful for copper substrates

Info

Publication number
IL138483A0
IL138483A0 IL13848399A IL13848399A IL138483A0 IL 138483 A0 IL138483 A0 IL 138483A0 IL 13848399 A IL13848399 A IL 13848399A IL 13848399 A IL13848399 A IL 13848399A IL 138483 A0 IL138483 A0 IL 138483A0
Authority
IL
Israel
Prior art keywords
mechanical polishing
chemical mechanical
polishing slurry
copper substrates
slurry useful
Prior art date
Application number
IL13848399A
Other languages
English (en)
Original Assignee
Cabot Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Corp filed Critical Cabot Corp
Publication of IL138483A0 publication Critical patent/IL138483A0/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Weting (AREA)
IL13848399A 1998-03-18 1999-03-18 Chemical mechanical polishing slurry useful for copper substrates IL138483A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/040,630 US6432828B2 (en) 1998-03-18 1998-03-18 Chemical mechanical polishing slurry useful for copper substrates
PCT/US1999/005968 WO1999047618A1 (fr) 1998-03-18 1999-03-18 Pate a polir chimio-mecanique pour substrats de cuivre

Publications (1)

Publication Number Publication Date
IL138483A0 true IL138483A0 (en) 2001-10-31

Family

ID=21912052

Family Applications (1)

Application Number Title Priority Date Filing Date
IL13848399A IL138483A0 (en) 1998-03-18 1999-03-18 Chemical mechanical polishing slurry useful for copper substrates

Country Status (12)

Country Link
US (3) US6432828B2 (fr)
EP (1) EP1064338B1 (fr)
JP (3) JP2002506915A (fr)
KR (1) KR100594561B1 (fr)
CN (1) CN1157450C (fr)
AU (1) AU3100499A (fr)
CA (1) CA2324151A1 (fr)
DE (1) DE69933015T2 (fr)
ID (1) ID27122A (fr)
IL (1) IL138483A0 (fr)
TW (1) TWI256966B (fr)
WO (1) WO1999047618A1 (fr)

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Also Published As

Publication number Publication date
US20040009671A1 (en) 2004-01-15
ID27122A (id) 2001-03-01
DE69933015T2 (de) 2006-12-14
CN1301288A (zh) 2001-06-27
DE69933015D1 (de) 2006-10-12
EP1064338B1 (fr) 2006-08-30
US6620037B2 (en) 2003-09-16
WO1999047618A1 (fr) 1999-09-23
KR20010041962A (ko) 2001-05-25
US20020168923A1 (en) 2002-11-14
US20010049910A1 (en) 2001-12-13
CA2324151A1 (fr) 1999-09-23
CN1157450C (zh) 2004-07-14
TWI256966B (en) 2006-06-21
JP2002506915A (ja) 2002-03-05
US6432828B2 (en) 2002-08-13
US7381648B2 (en) 2008-06-03
JP2012004588A (ja) 2012-01-05
AU3100499A (en) 1999-10-11
JP5539934B2 (ja) 2014-07-02
KR100594561B1 (ko) 2006-06-30
JP2007150341A (ja) 2007-06-14
EP1064338A1 (fr) 2001-01-03

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