ID24661A - Metoda pembuatan papan sirkuit jalinan kawat dan papan sirkuit jalinan kawat - Google Patents
Metoda pembuatan papan sirkuit jalinan kawat dan papan sirkuit jalinan kawatInfo
- Publication number
- ID24661A ID24661A IDW20001076A ID20001076A ID24661A ID 24661 A ID24661 A ID 24661A ID W20001076 A IDW20001076 A ID W20001076A ID 20001076 A ID20001076 A ID 20001076A ID 24661 A ID24661 A ID 24661A
- Authority
- ID
- Indonesia
- Prior art keywords
- circuit board
- racing wire
- board racing
- wire
- making
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10285246A JP2000114691A (ja) | 1998-10-07 | 1998-10-07 | 配線回路基板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ID24661A true ID24661A (id) | 2000-07-27 |
Family
ID=17689016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IDW20001076A ID24661A (id) | 1998-10-07 | 1999-10-07 | Metoda pembuatan papan sirkuit jalinan kawat dan papan sirkuit jalinan kawat |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1038418A1 (ja) |
| JP (1) | JP2000114691A (ja) |
| KR (1) | KR20010032727A (ja) |
| CN (1) | CN1287771A (ja) |
| ID (1) | ID24661A (ja) |
| TW (1) | TW443082B (ja) |
| WO (1) | WO2000021345A1 (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100512599C (zh) | 2002-06-04 | 2009-07-08 | 住友电气工业株式会社 | 印刷布线用基板及印刷布线板 |
| KR100593946B1 (ko) * | 2004-12-22 | 2006-06-30 | 전자부품연구원 | 적층 세라믹 소자의 제조 방법 |
| CN102271456B (zh) * | 2011-07-13 | 2013-05-01 | 东北大学 | 一种导热陶瓷基印刷电路板及其制备方法 |
| CN105073407B (zh) * | 2013-03-29 | 2017-01-11 | 凸版资讯股份有限公司 | 层叠体及电路基板 |
| CN103325675A (zh) * | 2013-05-30 | 2013-09-25 | 深圳顺络电子股份有限公司 | 一种窄线宽电极的电子元件制造方法 |
| CN110896590A (zh) * | 2018-09-13 | 2020-03-20 | 欣兴电子股份有限公司 | 线路基板及其制作方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3982941A (en) * | 1973-05-07 | 1976-09-28 | E. I. Du Pont De Nemours & Company | Photopolymerizable paste compositions and their use |
| JPS63308803A (ja) * | 1987-01-09 | 1988-12-16 | Hitachi Ltd | 導電ペーストおよびそれを用いた電子回路部品並びにその製法 |
| DE68922118T2 (de) * | 1988-01-25 | 1995-10-12 | Toshiba Kawasaki Kk | Schaltungsplatte. |
-
1998
- 1998-10-07 JP JP10285246A patent/JP2000114691A/ja active Pending
-
1999
- 1999-09-27 TW TW088116532A patent/TW443082B/zh not_active IP Right Cessation
- 1999-10-07 CN CN99801769A patent/CN1287771A/zh active Pending
- 1999-10-07 WO PCT/JP1999/005531 patent/WO2000021345A1/en not_active Application Discontinuation
- 1999-10-07 EP EP99970262A patent/EP1038418A1/en not_active Withdrawn
- 1999-10-07 ID IDW20001076A patent/ID24661A/id unknown
- 1999-10-07 KR KR1020007006016A patent/KR20010032727A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| TW443082B (en) | 2001-06-23 |
| EP1038418A1 (en) | 2000-09-27 |
| KR20010032727A (ko) | 2001-04-25 |
| CN1287771A (zh) | 2001-03-14 |
| WO2000021345A1 (en) | 2000-04-13 |
| JP2000114691A (ja) | 2000-04-21 |
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