DE69717216T2 - Schaltplatinenprüfvorrichtung und Verfahren dafür - Google Patents

Schaltplatinenprüfvorrichtung und Verfahren dafür

Info

Publication number
DE69717216T2
DE69717216T2 DE69717216T DE69717216T DE69717216T2 DE 69717216 T2 DE69717216 T2 DE 69717216T2 DE 69717216 T DE69717216 T DE 69717216T DE 69717216 T DE69717216 T DE 69717216T DE 69717216 T2 DE69717216 T2 DE 69717216T2
Authority
DE
Germany
Prior art keywords
circuit board
method therefor
board tester
tester
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69717216T
Other languages
English (en)
Other versions
DE69717216D1 (de
Inventor
Hideo Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Read Corp
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Publication of DE69717216D1 publication Critical patent/DE69717216D1/de
Application granted granted Critical
Publication of DE69717216T2 publication Critical patent/DE69717216T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Tests Of Electronic Circuits (AREA)
DE69717216T 1996-08-29 1997-08-29 Schaltplatinenprüfvorrichtung und Verfahren dafür Expired - Fee Related DE69717216T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8228270A JP3011401B2 (ja) 1996-08-29 1996-08-29 上側治具位置決め機構付きプリント基板検査装置および上側治具位置決め方法

Publications (2)

Publication Number Publication Date
DE69717216D1 DE69717216D1 (de) 2003-01-02
DE69717216T2 true DE69717216T2 (de) 2003-07-10

Family

ID=16873849

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69717216T Expired - Fee Related DE69717216T2 (de) 1996-08-29 1997-08-29 Schaltplatinenprüfvorrichtung und Verfahren dafür

Country Status (4)

Country Link
US (1) US6151063A (de)
EP (1) EP0826969B1 (de)
JP (1) JP3011401B2 (de)
DE (1) DE69717216T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100301060B1 (ko) * 1999-07-22 2001-11-01 윤종용 웨이퍼 프로빙 장비 및 이를 이용한 웨이퍼 검사용 니들 교정방법
US7742071B2 (en) * 2003-01-23 2010-06-22 Oracle America, Inc. Methods and apparatus for inspecting centerplane connectors
JP4539685B2 (ja) * 2007-06-22 2010-09-08 セイコーエプソン株式会社 部品搬送装置及びｉｃハンドラ
JP5314328B2 (ja) * 2008-06-06 2013-10-16 日置電機株式会社 アームオフセット取得方法
CN101713635B (zh) * 2008-10-06 2012-03-21 鸿富锦精密工业（深圳）有限公司 印刷电路板及其定位系统和方法
US9494532B2 (en) * 2010-09-24 2016-11-15 Siemens Energy, Inc. System and method for side-by-side inspection of a device
KR102026357B1 (ko) * 2013-04-17 2019-11-04 (주)테크윙 반도체소자 테스트용 핸들러
CN104133147B (zh) * 2014-08-15 2017-04-26 东莞市宏凯光电有限公司 一种ogs功能片测试装置
TWI596426B (zh) * 2015-01-27 2017-08-21 志聖工業股份有限公司 檢測底片誤差的方法及其系統
US10438922B2 (en) * 2016-06-06 2019-10-08 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for mounting components in semiconductor fabrication process
JP6589138B2 (ja) 2016-09-30 2019-10-16 パナソニックＩｐマネジメント株式会社 検査装置
JP6936161B2 (ja) 2018-02-06 2021-09-15 株式会社荏原製作所 位置決めピンの位置調整に使用される治具セット
JP7303543B2 (ja) * 2019-08-30 2023-07-05 ヤマハファインテック株式会社 高周波特性検査装置、及び高周波特性検査方法
CN114147664A (zh) * 2021-12-09 2022-03-08 苏州华星光电技术有限公司 一种治具更换方法以及电子设备的制备方法
TWI815470B (zh) * 2022-05-23 2023-09-11 鴻勁精密股份有限公司 具調位單元之作業裝置及作業機
CN116500424B (zh) * 2023-06-27 2024-03-29 深圳市克洛诺斯科技有限公司 一种pcb检测装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4357575A (en) * 1980-06-17 1982-11-02 Dit-Mco International Corporation Apparatus for use in testing printed circuit process boards having means for positioning such boards in proper juxtaposition with electrical contacting assemblies
US4571542A (en) * 1982-06-30 1986-02-18 Japan Synthetic Rubber Co., Ltd. Method and unit for inspecting printed wiring boards
GB8700754D0 (en) * 1987-01-14 1987-02-18 Int Computers Ltd Test apparatus for printed circuit boards
US5408189A (en) * 1990-05-25 1995-04-18 Everett Charles Technologies, Inc. Test fixture alignment system for printed circuit boards
US5206820A (en) * 1990-08-31 1993-04-27 At&T Bell Laboratories Metrology system for analyzing panel misregistration in a panel manufacturing process and providing appropriate information for adjusting panel manufacturing processes
JP3042035B2 (ja) * 1991-05-31 2000-05-15 ジェイエスアール株式会社 回路基板検査装置
JP2833402B2 (ja) * 1993-03-02 1998-12-09 ジェイエスアール株式会社 被検査電極板の検査方法
US5543726A (en) * 1994-01-03 1996-08-06 International Business Machines Corporation Open frame gantry probing system
US5442299A (en) * 1994-01-06 1995-08-15 International Business Machines Corporation Printed circuit board test fixture and method
US5742701A (en) * 1994-02-15 1998-04-21 Matsushita Electric Industrial Co., Ltd. Alignment detection apparatus

Also Published As

Publication number Publication date
DE69717216D1 (de) 2003-01-02
EP0826969B1 (de) 2002-11-20
JP3011401B2 (ja) 2000-02-21
US6151063A (en) 2000-11-21
EP0826969A2 (de) 1998-03-04
JPH1073636A (ja) 1998-03-17
EP0826969A3 (de) 1999-06-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee