DE69506585T2 - Verfahren und gerät zur prüfung von halbleiterplatten - Google Patents

Verfahren und gerät zur prüfung von halbleiterplatten

Info

Publication number
DE69506585T2
DE69506585T2 DE69506585T DE69506585T DE69506585T2 DE 69506585 T2 DE69506585 T2 DE 69506585T2 DE 69506585 T DE69506585 T DE 69506585T DE 69506585 T DE69506585 T DE 69506585T DE 69506585 T2 DE69506585 T2 DE 69506585T2
Authority
DE
Germany
Prior art keywords
testing semiconductor
semiconductor boards
boards
testing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69506585T
Other languages
English (en)
Other versions
DE69506585D1 (de
Inventor
Bethany Walles
Cuong Pham
Lawrence Kneisel
Brian Hayden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ford Motor Co Ltd
Ford Motor Co
Original Assignee
Ford Motor Co Ltd
Ford Motor Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ford Motor Co Ltd, Ford Motor Co filed Critical Ford Motor Co Ltd
Publication of DE69506585D1 publication Critical patent/DE69506585D1/de
Application granted granted Critical
Publication of DE69506585T2 publication Critical patent/DE69506585T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
DE69506585T 1994-12-19 1995-11-01 Verfahren und gerät zur prüfung von halbleiterplatten Expired - Fee Related DE69506585T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/358,297 US5510721A (en) 1994-12-19 1994-12-19 Method and adjustment for known good die testing using resilient conductive straps
PCT/GB1995/002557 WO1996019734A1 (en) 1994-12-19 1995-11-01 Method and apparatus for semiconductor die testing

Publications (2)

Publication Number Publication Date
DE69506585D1 DE69506585D1 (de) 1999-01-21
DE69506585T2 true DE69506585T2 (de) 1999-04-29

Family

ID=23409107

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69506585T Expired - Fee Related DE69506585T2 (de) 1994-12-19 1995-11-01 Verfahren und gerät zur prüfung von halbleiterplatten

Country Status (6)

Country Link
US (1) US5510721A (de)
EP (1) EP0799424B1 (de)
JP (1) JPH10510923A (de)
CN (1) CN1170461A (de)
DE (1) DE69506585T2 (de)
WO (1) WO1996019734A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5642054A (en) * 1995-08-08 1997-06-24 Hughes Aircraft Company Active circuit multi-port membrane probe for full wafer testing
US6245444B1 (en) 1997-10-02 2001-06-12 New Jersey Institute Of Technology Micromachined element and method of fabrication thereof
US6140827A (en) * 1997-12-18 2000-10-31 Micron Technology, Inc. Method and apparatus for testing bumped die
JP2002523756A (ja) * 1998-08-18 2002-07-30 インフィネオン テクノロジース アクチエンゲゼルシャフト 電気的な構成素子を検査する場合に使用するためのプリント配線板および該プリント配線板を製造する方法
US6183267B1 (en) 1999-03-11 2001-02-06 Murray Hill Devices Ultra-miniature electrical contacts and method of manufacture
CN100419452C (zh) * 2006-07-11 2008-09-17 中国船舶重工集团公司第七○九研究所 微电子标准物质制备技术
JP5943742B2 (ja) 2012-07-04 2016-07-05 三菱電機株式会社 半導体試験治具およびそれを用いた半導体試験方法
JP6843759B2 (ja) 2015-03-31 2021-03-17 フィッシャー アンド ペイケル ヘルスケア リミテッド ガスを気道に供給するためのユーザインタフェース及びシステム
US11324908B2 (en) 2016-08-11 2022-05-10 Fisher & Paykel Healthcare Limited Collapsible conduit, patient interface and headgear connector
CN115552259A (zh) * 2020-05-13 2022-12-30 三菱电机株式会社 电子器件检查装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3588618A (en) * 1970-03-02 1971-06-28 Raychem Corp Unsoldering method and apparatus using heat-recoverable materials
US3670409A (en) * 1970-11-19 1972-06-20 Gte Automatic Electric Lab Inc Planar receptacle
US4099991A (en) * 1974-10-10 1978-07-11 Essex Group Method for effecting reverse shape memory phenomena in Cu-Zn-Si brass alloy
US4487465A (en) * 1981-12-07 1984-12-11 Raychem Corporation Heat recoverable connecting device
JPS59230741A (ja) * 1983-06-15 1984-12-25 株式会社日立製作所 形状記憶複合材料
US4830622A (en) * 1987-08-19 1989-05-16 George Erickson Integrated circuit socket and board
JPH01235857A (ja) * 1988-03-15 1989-09-20 Seiko Instr & Electron Ltd プロービング装置
US5012187A (en) * 1989-11-03 1991-04-30 Motorola, Inc. Method for parallel testing of semiconductor devices
US5187020A (en) * 1990-07-31 1993-02-16 Texas Instruments Incorporated Compliant contact pad
US5172050A (en) * 1991-02-15 1992-12-15 Motorola, Inc. Micromachined semiconductor probe card
US5264787A (en) * 1991-08-30 1993-11-23 Hughes Aircraft Company Rigid-flex circuits with raised features as IC test probes

Also Published As

Publication number Publication date
EP0799424A1 (de) 1997-10-08
EP0799424B1 (de) 1998-12-09
CN1170461A (zh) 1998-01-14
US5510721A (en) 1996-04-23
DE69506585D1 (de) 1999-01-21
WO1996019734A1 (en) 1996-06-27
JPH10510923A (ja) 1998-10-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee