DK10198A - Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant - Google Patents

Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant

Info

Publication number
DK10198A
DK10198A DK199800101A DK10198A DK10198A DK 10198 A DK10198 A DK 10198A DK 199800101 A DK199800101 A DK 199800101A DK 10198 A DK10198 A DK 10198A DK 10198 A DK10198 A DK 10198A
Authority
DK
Denmark
Prior art keywords
making
electrical connector
connector
electrical
Prior art date
Application number
DK199800101A
Other languages
English (en)
Other versions
DK174111B1 (da
Inventor
Jesper Noerregaard
Niels Vagn Pedersen
Original Assignee
Giga A S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giga A S filed Critical Giga A S
Priority to DK199800101A priority Critical patent/DK174111B1/da
Priority to US09/600,797 priority patent/US7212088B1/en
Priority to EP99901583A priority patent/EP1051749A1/en
Priority to PCT/DK1999/000036 priority patent/WO1999040627A1/da
Priority to AU21502/99A priority patent/AU2150299A/en
Priority to JP2000530944A priority patent/JP2002503033A/ja
Publication of DK10198A publication Critical patent/DK10198A/da
Application granted granted Critical
Publication of DK174111B1 publication Critical patent/DK174111B1/da

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/206—Wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/216—Waveguides, e.g. strip lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/223—Differential pair signal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
DK199800101A 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant DK174111B1 (da)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DK199800101A DK174111B1 (da) 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant
US09/600,797 US7212088B1 (en) 1998-01-26 1999-01-25 Electrical connecting element and a method of making such an element
EP99901583A EP1051749A1 (en) 1998-01-26 1999-01-25 An electrical connecting element and a method of making such an element
PCT/DK1999/000036 WO1999040627A1 (da) 1998-01-26 1999-01-25 An electrical connecting element and a method of making such an element
AU21502/99A AU2150299A (en) 1998-01-26 1999-01-25 An electrical connecting element and a method of making such an element
JP2000530944A JP2002503033A (ja) 1998-01-26 1999-01-25 電気的接続要素および電気的接続要素を作る方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK199800101A DK174111B1 (da) 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant
DK10198 1998-01-26

Publications (2)

Publication Number Publication Date
DK10198A true DK10198A (da) 1999-07-27
DK174111B1 DK174111B1 (da) 2002-06-24

Family

ID=8089750

Family Applications (1)

Application Number Title Priority Date Filing Date
DK199800101A DK174111B1 (da) 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant

Country Status (6)

Country Link
US (1) US7212088B1 (da)
EP (1) EP1051749A1 (da)
JP (1) JP2002503033A (da)
AU (1) AU2150299A (da)
DK (1) DK174111B1 (da)
WO (1) WO1999040627A1 (da)

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FR2799887A1 (fr) * 1999-10-07 2001-04-20 Cit Alcatel Connexions de modules multi-puces hyperfrequence par transfert automatique sur bande
SE517852C2 (sv) * 1999-12-15 2002-07-23 Ericsson Telefon Ab L M Effekttransistormodul, effektförstärkare samt förfarande vid framställning därav
SE517455C2 (sv) * 1999-12-15 2002-06-11 Ericsson Telefon Ab L M Effekttransistormodul, effektförstärkare samt förfarande för framställning därav
US6677832B1 (en) 2000-10-27 2004-01-13 Lucent Technologies Inc. Connector for differential-mode transmission line providing virtual ground
GB2378045A (en) * 2001-07-25 2003-01-29 Marconi Caswell Ltd Electrical connection with flexible coplanar transmission line
US7336139B2 (en) * 2002-03-18 2008-02-26 Applied Micro Circuits Corporation Flexible interconnect cable with grounded coplanar waveguide
US8847696B2 (en) 2002-03-18 2014-09-30 Qualcomm Incorporated Flexible interconnect cable having signal trace pairs and ground layer pairs disposed on opposite sides of a flexible dielectric
US7888957B2 (en) * 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
JP2010135722A (ja) * 2008-11-05 2010-06-17 Toshiba Corp 半導体装置
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
US9601530B2 (en) 2008-12-02 2017-03-21 Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
KR101495398B1 (ko) * 2008-12-02 2015-02-25 아리조나 보드 오브 리젠츠 온 비하프 오브 아리조나 스테이트 유니버시티 유연성 기판 조립체의 제조 방법 및 그것으로부터의 유연성 기판 조립체
US9721825B2 (en) 2008-12-02 2017-08-01 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
JP5287390B2 (ja) 2009-03-16 2013-09-11 ソニー株式会社 半導体装置、伝送システム、半導体装置の製造方法及び伝送システムの製造方法
JP5521034B2 (ja) 2009-05-29 2014-06-11 アリゾナ・ボード・オブ・リージェンツ，フォー・アンド・オン・ビハーフ・オブ・アリゾナ・ステート・ユニバーシティ フレキシブル半導体デバイスを高温で提供する方法およびそのフレキシブル半導体デバイス
WO2012021196A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method for manufacturing electronic devices and electronic devices thereof
WO2012021197A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof
US8290319B2 (en) * 2010-08-25 2012-10-16 Oracle America, Inc. Optical communication in a ramp-stack chip package
US8373280B2 (en) 2010-09-01 2013-02-12 Oracle America, Inc. Manufacturing fixture for a ramp-stack chip package using solder for coupling a ramp component
US8283766B2 (en) 2010-09-02 2012-10-09 Oracle America, Inc Ramp-stack chip package with static bends
US8772920B2 (en) 2011-07-13 2014-07-08 Oracle International Corporation Interconnection and assembly of three-dimensional chip packages
JP5861868B2 (ja) * 2011-11-04 2016-02-16 ソニー株式会社 電子回路および電子回路の製造方法
US9082632B2 (en) 2012-05-10 2015-07-14 Oracle International Corporation Ramp-stack chip package with variable chip spacing
JP5542231B1 (ja) * 2013-04-09 2014-07-09 太陽誘電株式会社 多層回路基板
US9590288B2 (en) 2013-04-09 2017-03-07 Taiyo Yuden Co., Ltd. Multilayer circuit substrate
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
WO2017034644A2 (en) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Method of providing an electronic device and electronic device thereof
WO2015156891A2 (en) 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
KR102466741B1 (ko) 2014-05-13 2022-11-15 아리조나 보드 오브 리젠츠 온 비하프 오브 아리조나 스테이트 유니버시티 전자 디바이스를 제공하는 방법
US10446582B2 (en) 2014-12-22 2019-10-15 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an imaging system and imaging system thereof
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device
US20170085243A1 (en) * 2015-09-21 2017-03-23 Intel Corporation Impedance matching interconnect
US10784215B2 (en) * 2018-11-15 2020-09-22 Steradian Semiconductors Private Limited Millimeter wave integrated circuit and system with a low loss package transition

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US4600907A (en) 1985-03-07 1986-07-15 Tektronix, Inc. Coplanar microstrap waveguide interconnector and method of interconnection
US5256996A (en) * 1987-10-06 1993-10-26 The Board Of Trustees Of The Leland Stanford, Junior University Integrated coplanar strip nonlinear transmission line
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US4862120A (en) * 1988-02-29 1989-08-29 Canadian Patents And Development Limited/Societe Canadienne Des Brevets Et D'exploitation Limitee Wideband stripline to microstrip transition
US5182631A (en) * 1988-04-15 1993-01-26 Nippon Telegraph And Telephone Corporation Film carrier for RF IC
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JPH06334410A (ja) 1993-05-24 1994-12-02 Japan Aviation Electron Ind Ltd フレキシブル配線基板
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Also Published As

Publication number Publication date
AU2150299A (en) 1999-08-23
WO1999040627A1 (da) 1999-08-12
US7212088B1 (en) 2007-05-01
JP2002503033A (ja) 2002-01-29
DK174111B1 (da) 2002-06-24
EP1051749A1 (en) 2000-11-15

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Legal Events

Date Code Title Description
B1 Patent granted (law 1993)
PBP Patent lapsed