DK10198A - Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant - Google Patents

Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant

Info

Publication number
DK10198A
DK10198A DK199800101A DK10198A DK10198A DK 10198 A DK10198 A DK 10198A DK 199800101 A DK199800101 A DK 199800101A DK 10198 A DK10198 A DK 10198A DK 10198 A DK10198 A DK 10198A
Authority
DK
Denmark
Prior art keywords
making
electrical connector
connector
electrical
Prior art date
Application number
DK199800101A
Other languages
English (en)
Other versions
DK174111B1 (da
Inventor
Jesper Noerregaard
Niels Vagn Pedersen
Original Assignee
Giga A S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giga A S filed Critical Giga A S
Priority to DK199800101A priority Critical patent/DK174111B1/da
Priority to EP99901583A priority patent/EP1051749A1/en
Priority to JP2000530944A priority patent/JP2002503033A/ja
Priority to AU21502/99A priority patent/AU2150299A/en
Priority to PCT/DK1999/000036 priority patent/WO1999040627A1/da
Priority to US09/600,797 priority patent/US7212088B1/en
Publication of DK10198A publication Critical patent/DK10198A/da
Application granted granted Critical
Publication of DK174111B1 publication Critical patent/DK174111B1/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6611—Wire connections
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    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
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    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
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    • H01L2223/66—High-frequency adaptations
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    • H01L2223/6638—Differential pair signal lines
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01018—Argon [Ar]
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    • H01L2924/01019—Potassium [K]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/1903—Structure including wave guides
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    • H01L2924/19041—Component type being a capacitor
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Waveguides (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DK199800101A 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant DK174111B1 (da)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DK199800101A DK174111B1 (da) 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant
EP99901583A EP1051749A1 (en) 1998-01-26 1999-01-25 An electrical connecting element and a method of making such an element
JP2000530944A JP2002503033A (ja) 1998-01-26 1999-01-25 電気的接続要素および電気的接続要素を作る方法
AU21502/99A AU2150299A (en) 1998-01-26 1999-01-25 An electrical connecting element and a method of making such an element
PCT/DK1999/000036 WO1999040627A1 (da) 1998-01-26 1999-01-25 An electrical connecting element and a method of making such an element
US09/600,797 US7212088B1 (en) 1998-01-26 1999-01-25 Electrical connecting element and a method of making such an element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DK10198 1998-01-26
DK199800101A DK174111B1 (da) 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant

Publications (2)

Publication Number Publication Date
DK10198A true DK10198A (da) 1999-07-27
DK174111B1 DK174111B1 (da) 2002-06-24

Family

ID=8089750

Family Applications (1)

Application Number Title Priority Date Filing Date
DK199800101A DK174111B1 (da) 1998-01-26 1998-01-26 Elektrisk forbindelseselement samt fremgangsmåde til fremstilling af et sådant

Country Status (6)

Country Link
US (1) US7212088B1 (da)
EP (1) EP1051749A1 (da)
JP (1) JP2002503033A (da)
AU (1) AU2150299A (da)
DK (1) DK174111B1 (da)
WO (1) WO1999040627A1 (da)

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US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
US9601530B2 (en) 2008-12-02 2017-03-21 Arizona Board Of Regents, A Body Corporated Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
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JP5287390B2 (ja) * 2009-03-16 2013-09-11 ソニー株式会社 半導体装置、伝送システム、半導体装置の製造方法及び伝送システムの製造方法
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WO2012021197A2 (en) 2010-05-21 2012-02-16 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof
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US8772920B2 (en) 2011-07-13 2014-07-08 Oracle International Corporation Interconnection and assembly of three-dimensional chip packages
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US9082632B2 (en) 2012-05-10 2015-07-14 Oracle International Corporation Ramp-stack chip package with variable chip spacing
US9590288B2 (en) 2013-04-09 2017-03-07 Taiyo Yuden Co., Ltd. Multilayer circuit substrate
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WO2015175353A1 (en) 2014-05-13 2015-11-19 Arizona Board Of Regents, For And On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
WO2015156891A2 (en) 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Method of providing a flexible semiconductor device and flexible semiconductor device thereof
WO2017034645A2 (en) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS, a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Method of providing an electronic device and electronic device thereof
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device
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WO1999040627A1 (da) 1999-08-12
US7212088B1 (en) 2007-05-01
DK174111B1 (da) 2002-06-24
AU2150299A (en) 1999-08-23
JP2002503033A (ja) 2002-01-29
EP1051749A1 (en) 2000-11-15

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