ID24661A - METHOD OF MAKING CIRCUIT BOARD RACING WIRE AND CIRCUIT BOARD RACING WIRE - Google Patents
METHOD OF MAKING CIRCUIT BOARD RACING WIRE AND CIRCUIT BOARD RACING WIREInfo
- Publication number
- ID24661A ID24661A IDW20001076A ID20001076A ID24661A ID 24661 A ID24661 A ID 24661A ID W20001076 A IDW20001076 A ID W20001076A ID 20001076 A ID20001076 A ID 20001076A ID 24661 A ID24661 A ID 24661A
- Authority
- ID
- Indonesia
- Prior art keywords
- circuit board
- racing wire
- board racing
- wire
- making
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10285246A JP2000114691A (en) | 1998-10-07 | 1998-10-07 | Manufacture of wiring circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ID24661A true ID24661A (en) | 2000-07-27 |
Family
ID=17689016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IDW20001076A ID24661A (en) | 1998-10-07 | 1999-10-07 | METHOD OF MAKING CIRCUIT BOARD RACING WIRE AND CIRCUIT BOARD RACING WIRE |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1038418A1 (en) |
| JP (1) | JP2000114691A (en) |
| KR (1) | KR20010032727A (en) |
| CN (1) | CN1287771A (en) |
| ID (1) | ID24661A (en) |
| TW (1) | TW443082B (en) |
| WO (1) | WO2000021345A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1542518A4 (en) | 2002-06-04 | 2009-08-26 | Sumitomo Electric Industries | Board for printed wiring, printed wiring board, and method for manufacturing them |
| KR100593946B1 (en) * | 2004-12-22 | 2006-06-30 | 전자부품연구원 | Method for fabricating stacked ceramic device |
| CN102271456B (en) * | 2011-07-13 | 2013-05-01 | 东北大学 | Heat-conduction ceramic-based printed circuit board (PCB) and manufacture method thereof |
| WO2014157581A1 (en) | 2013-03-29 | 2014-10-02 | トッパン・フォームズ株式会社 | Laminate and circuit board |
| CN103325675A (en) * | 2013-05-30 | 2013-09-25 | 深圳顺络电子股份有限公司 | Method for manufacturing electronic element of narrow-line-width electrode |
| CN110896590A (en) * | 2018-09-13 | 2020-03-20 | 欣兴电子股份有限公司 | Circuit substrate and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3982941A (en) * | 1973-05-07 | 1976-09-28 | E. I. Du Pont De Nemours & Company | Photopolymerizable paste compositions and their use |
| JPS63308803A (en) * | 1987-01-09 | 1988-12-16 | Hitachi Ltd | Conductive paste and electronic circuit parts using it and its manufacture |
| US4963701A (en) * | 1988-01-25 | 1990-10-16 | Kabushiki Kaisha Toshiba | Circuit board |
-
1998
- 1998-10-07 JP JP10285246A patent/JP2000114691A/en active Pending
-
1999
- 1999-09-27 TW TW088116532A patent/TW443082B/en not_active IP Right Cessation
- 1999-10-07 CN CN99801769A patent/CN1287771A/en active Pending
- 1999-10-07 ID IDW20001076A patent/ID24661A/en unknown
- 1999-10-07 WO PCT/JP1999/005531 patent/WO2000021345A1/en not_active Application Discontinuation
- 1999-10-07 EP EP99970262A patent/EP1038418A1/en not_active Withdrawn
- 1999-10-07 KR KR1020007006016A patent/KR20010032727A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1287771A (en) | 2001-03-14 |
| EP1038418A1 (en) | 2000-09-27 |
| KR20010032727A (en) | 2001-04-25 |
| TW443082B (en) | 2001-06-23 |
| JP2000114691A (en) | 2000-04-21 |
| WO2000021345A1 (en) | 2000-04-13 |
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