GB9927232D0 - Printed wiring board and method of manufacturing the same - Google Patents

Printed wiring board and method of manufacturing the same

Info

Publication number
GB9927232D0
GB9927232D0 GBGB9927232.0A GB9927232A GB9927232D0 GB 9927232 D0 GB9927232 D0 GB 9927232D0 GB 9927232 A GB9927232 A GB 9927232A GB 9927232 D0 GB9927232 D0 GB 9927232D0
Authority
GB
United Kingdom
Prior art keywords
manufacturing
same
wiring board
printed wiring
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB9927232.0A
Other versions
GB2343995B (en
GB2343995A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of GB9927232D0 publication Critical patent/GB9927232D0/en
Publication of GB2343995A publication Critical patent/GB2343995A/en
Application granted granted Critical
Publication of GB2343995B publication Critical patent/GB2343995B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB9927232A 1998-11-20 1999-11-17 Printed wiring board Expired - Fee Related GB2343995B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33178798A JP2000156564A (en) 1998-11-20 1998-11-20 Printed wiring board and production thereof

Publications (3)

Publication Number Publication Date
GB9927232D0 true GB9927232D0 (en) 2000-01-12
GB2343995A GB2343995A (en) 2000-05-24
GB2343995B GB2343995B (en) 2002-01-16

Family

ID=18247644

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9927232A Expired - Fee Related GB2343995B (en) 1998-11-20 1999-11-17 Printed wiring board

Country Status (2)

Country Link
JP (1) JP2000156564A (en)
GB (1) GB2343995B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060180344A1 (en) 2003-01-20 2006-08-17 Shoji Ito Multilayer printed wiring board and process for producing the same
JP2006253286A (en) * 2005-03-09 2006-09-21 Kyocera Corp Ceramic circuit board and manufacturing method thereof
JP4705400B2 (en) * 2005-04-01 2011-06-22 日本シイエムケイ株式会社 Manufacturing method of multilayer printed wiring board
JP4730426B2 (en) 2008-11-19 2011-07-20 ソニー株式会社 Mounting substrate and semiconductor module
CN103052279A (en) * 2011-10-11 2013-04-17 欣兴电子股份有限公司 Circuit board and manufacture method thereof.
JP6418757B2 (en) * 2014-03-03 2018-11-07 新光電気工業株式会社 WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE
CN107846789A (en) * 2017-11-24 2018-03-27 郑州云海信息技术有限公司 A kind of design method for solving PCB layout density

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0096701B1 (en) * 1981-12-11 1989-08-30 Western Electric Company, Incorporated Circuit board fabrication leading to increased capacity
EP0602257B1 (en) * 1992-12-12 1997-09-10 International Business Machines Corporation Printed circuits with local higher wiring density and method for manufacturing such printed circuits
JPH0779078A (en) * 1993-09-08 1995-03-20 Shinko Electric Ind Co Ltd Multilayer wiring board and manufacture thereof
JPH08181458A (en) * 1994-12-27 1996-07-12 Sony Corp Multilayer printed circuit board and manufacture thereof
JP2833521B2 (en) * 1995-05-18 1998-12-09 日本電気株式会社 Wiring board
JPH09186510A (en) * 1995-12-27 1997-07-15 Fuji Elelctrochem Co Ltd Composite circuit module

Also Published As

Publication number Publication date
GB2343995B (en) 2002-01-16
JP2000156564A (en) 2000-06-06
GB2343995A (en) 2000-05-24

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20091117