JPH0779078A - Multilayer wiring board and manufacture thereof - Google Patents

Abstract

PURPOSE:To prevent the separation of via sections from an insulating resin layer and the degradation in insulating performance of the insulating resin, by forming a close contact barrier layer on the underside of the via sections in contact with the insulating resin layer to improve the adhesion between the via sections and the insulating resin layer and prevent the diffusion of metal composing the via sections into the insulating resin layer. CONSTITUTION:A close contact barrier layer 22 is formed on the underside of via sections 20 in contact with an insulating resin layer 12. The close contact barrier layer 22 is for improving the adhesion between the insulating resin layer 12 and a metal layer 24 and for preventing metal forming the metal layer 24 from diffusing into the insulating resin layer 12. The close contact barrier layer 22 eliminates the degradation in insulating performance of the insulating resin 12 at the via sections 20. In addition the through holes for the via sections are tapered, and their diameter is smaller with the proximity to the bottom where the land sections 28 of a conductive pattern 17 formed on the underside of the insulating resin layer 12. Therefore, the close contact barrier layer 22, uniform in thickness, can be easily formed by sputtering, for example. When the tapered through holes are filled with metal by plating to form the via sections 22, the conductive pattern is formed simultaneously.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board and a method for manufacturing the same, and more specifically, a plurality of insulating resin layers are laminated on an insulating board, and the insulating board and the insulating resin layer are A conductor pattern formed on each surface side and a metal formed by penetrating the insulating resin layer so as to connect predetermined conductor patterns formed on the surface sides of different insulating resin layers to each other. The present invention relates to a multilayer wiring board having a via part and a method for manufacturing the same.

[0002]

2. Description of the Related Art Electronic devices such as semiconductor devices are required to have high density of conductor patterns for transmitting signals as the devices are highly integrated and complicated. But,
There is a limit to the density of the conductor pattern that can be industrially formed on the surface side of the insulating substrate, although the density has been increasing year by year due to technological progress. Therefore, in order to form a conductor pattern having a higher density on the substrate, a multilayer wiring board in which conductor patterns are multilayered is used. In such a multilayer wiring board, as shown in FIG. 9, an insulating substrate made of ceramic in which a land portion (hereinafter, may be simply referred to as a land portion) 108 is formed at an end portion of the conductor pattern 106. Insulating resin layers 102 and 104 made of a resin such as polyimide are laminated on 100 to form an insulating resin layer 1.
Conductor patterns 106 ... And land portions 108 are formed on the respective surface sides of 02 and 104. Of the conductor patterns 106, ..., The connection with the conductor pattern 106 formed on the surface side of the different insulating resin layer is performed by the land portion 10
8 and is formed by a via portion formed of a metal layer 110 that is formed on the upper surface of the metal layer 110 and that has a substantially cylindrical shape and penetrates the insulating resin layer.

The multilayer wiring board shown in FIG. 9 is conventionally manufactured by the method shown in FIG. That is, after the metallized layer 112 is formed on the entire surface of the ceramic insulating substrate 100 by sputtering or the like, the metallized layer 112 is exposed by forming a resist layer 114 applied on the metallized layer 112 with a predetermined thickness. Substantially cylindrical through hole for via 1
16, a metal layer 110 made of copper metal is formed by electroplating so as to have a height equal to or higher than that of the resist layer 114 [FIGS. 10 (a) and 10 (b)]. Further, after removing the resist layer 114, the metallized layer 112 is patterned,
After forming the conductor pattern 106 and the land portion [FIG. 10 (c)], the insulating resin layer 102 having a predetermined thickness is formed to cover the metal layer 110 formed by applying a resin such as polyimide.
The upper surface of the metal layer 110 is exposed by polishing the surface of the metal layer 110 and the metal layer 110 and the insulating resin layer 102 are planarized (FIGS. 10D and 10E). Then, a resist layer 120 is formed and patterned on the metallized layer 118 formed by sputtering or the like on the entire exposed surface of the metal layer 110 and the flat surface of the insulating resin layer 102, and the upper conductive pattern 106 and the land are formed. To form the portion 108 [FIG.
0 (f) (g) (h)]. Hereinafter, by sequentially performing the steps from FIG. 10A on the insulating resin layer 102 of FIG. 10H, a multilayer wiring board in which a plurality of insulating resin layers are laminated on the insulating substrate 100 is obtained. Can be manufactured.

Further, as shown in FIG. 11, the insulating substrate 10
If the via part 122 is formed in advance in 0,
The multilayer wiring board can be manufactured by a process omitted from the process shown in FIG. In this step, first, a predetermined thickness of resin such as polyimide is formed so as to cover the conductor pattern 106 formed by patterning the metallized layer formed over the entire surface of the insulating substrate 100 and the land portion 108. In the insulating resin layer 102, a through hole 116 for a via portion is formed in which the surface of the land portion 108 is exposed at the bottom surface (FIG. 11A). The metal layer 110 is formed in the through hole 116 for the via portion by electrolytic plating while supplying power through the via portion 122 [FIG. 11 (b)]. This metal layer 11
The height of 0 prevents the tip from protruding from the surface of the insulating resin layer 102. Then, a resist layer 124 is formed on the metallized layer 118 formed by sputtering or the like on the entire surface of the insulating resin layer 102 including the surface of the metal layer 110 and patterned to form the conductor pattern 106 and the land portion 1.
No. 08 is formed [FIG. 11 (c) (d) (e)]. Less than,
As shown in FIG. 11 on the insulating resin layer 102 of FIG.
By sequentially performing the steps from (a), it is possible to manufacture a multilayer wiring board in which a plurality of insulating resin layers are laminated on the insulating substrate 100.

[0005]

10 and 1 described above.
According to the method of manufacturing a multilayer wiring board shown in 1, it is possible to manufacture a multilayer wiring board in which complicated conductor patterns are formed in multiple layers. However, in the method for manufacturing the multilayer wiring board shown in FIG. 10, since the steps are long and complicated, it is required to shorten or simplify the steps. On the other hand, in the method for manufacturing the multilayer wiring board shown in FIG. 11, the steps are simplified as compared with the manufacturing method shown in FIG. 10, but it is necessary to previously form a via portion in the insulating substrate. Moreover, in the multilayer wiring board obtained by the manufacturing method shown in FIG. 11, a slight step portion is likely to be formed in the vicinity of the boundary between the via portion and the insulating resin layer. Therefore, the conductor pattern formed on the step portion is formed. There is also a concern that wire breakage will occur in the land. In addition, since the adhesion between the metal layer 110 of the via part and the insulating resin layer is poor, the via part is separated from the insulating resin layer, or metal such as copper is diffused into the insulating resin layer and the insulating resin layer is formed. There is also a possibility of causing deterioration of the insulation performance. Therefore, the purpose of the present invention is to
Provided is a multilayer wiring board capable of eliminating peeling between a via part made of metal and an insulating resin layer and deterioration of insulation performance of the insulating resin layer, and a multilayer wiring capable of simplifying a manufacturing process of the multilayer wiring board. It is to provide a method for manufacturing a substrate.

[0006]

As a result of repeated studies to achieve the above object, the present inventor has found that when forming a via part by filling a via part through hole with metal by electrolytic plating, the via part is formed. By simultaneously forming the conductor pattern and the conductor pattern,
The process can be shortened or simplified, and the adhesion between the insulating resin layer and the via portion is improved on the back surface side of the via portion that contacts the insulating resin layer, and the metal forming the via portion is also improved. By forming an adhesion barrier layer capable of preventing diffusion to the insulating resin layer, it was found that peeling between the via portion and the insulating resin layer and deterioration of the insulating performance of the insulating resin layer can be solved, The present invention has been reached. That is, according to the present invention, a plurality of insulating resin layers are laminated on an insulating substrate, and the conductive patterns formed on the respective surface sides of the insulating substrate and the insulating resin layer are different from each other. In a multilayer wiring board comprising a via part made of metal formed through the insulating resin layer so as to connect predetermined conductor patterns formed on the surface side of the layer, the via part is A tapered through hole that penetrates an insulating resin layer which is the next layer laminated on the surface of an insulating substrate or an insulating resin layer on which a conductor pattern is formed, and has a smaller diameter toward the bottom surface side where the land portion of the conductor pattern is exposed. A metal layer formed by plating and filling, and a land portion extending from the metal layer and formed on the surface of the insulating resin layer, and at least a via portion in contact with the insulating resin layer. On the contact surface, In the multilayer wiring board, wherein the edge resin layer and the adhesion-improving and adhesion barrier layer prevents diffusion of the metal of the insulating resin layer to form a via portion of the via portion is formed.
In the multilayer wiring board having such a structure, by covering the entire surface of the land portion forming the via portion with a barrier layer for preventing diffusion of the metal forming the via portion into the insulating resin layer, The metal can be prevented from diffusing into the insulating resin layer.

Further, according to the present invention, a plurality of insulating resin layers are laminated on an insulating substrate, and a conductor pattern formed on each surface side of the insulating substrate and the insulating resin layer,
A multi-layer wiring board having a via part made of metal formed through the insulating resin layer so as to connect predetermined conductor patterns formed on the surface sides of different insulating resin layers from each other is manufactured. At this time, the bottom surface side is formed so that the land portion is exposed and forms a bottom surface in the next-layer insulating resin layer that covers the land portion of the conductor pattern formed on the surface of the insulating substrate or the insulating resin layer. After forming a tapered through hole having a smaller diameter, the entire surface of the insulating resin layer including the bottom surface and the wall surface of the tapered through hole is improved in adhesiveness between the insulating resin layer and the via portion, and the via hole is formed. Forming an adhesion barrier layer for preventing diffusion of the metal forming the part to the insulating resin layer,
Next, by patterning the resist layer of a predetermined height formed on the adhesion barrier layer, the exposed portion of the adhesion barrier layer, which is a portion for forming a conductor pattern and a via portion, is plated to form the resist layer. A metal layer having a height or more is formed, and then a barrier layer for preventing diffusion of the metal forming the metal layer into the insulating resin layer is formed on the surface of the metal layer that has been planarized by polishing the metal layer. After that, the exposed portion of the adhesion barrier layer exposed by removing the resist layer is removed to form a conductor pattern and a via portion, which is also a method for manufacturing a multilayer wiring board.

In the method of manufacturing a multilayer wiring board having such a structure, after forming a metal layer having a height higher than that of the resist layer by plating, the metal layer is subjected to a polishing treatment to be planarized, and then the resist layer is removed. A barrier layer for preventing diffusion of the metal forming the conductor pattern and the via portion to the insulating resin layer is formed on the surface of the conductor pattern and the via portion formed by removing the exposed portion of the adhesion barrier layer exposed by By forming, the exposed surface of the conductor pattern and the via portion can be covered with the barrier layer. Further, after patterning the adhesion barrier layer so that the adhesion barrier layer in the part where the conductor pattern and the via part are formed remains, the adhesion barrier layer and the via part in the part where the conductor pattern is formed are formed. A step preventing layer made of an insulating resin and having a predetermined height is formed between the contact barrier layer and a part of the contact barrier layer, and then the step is formed by plating on the part where the contact barrier layer is exposed to form a conductor pattern and a via part. After forming a metal layer having a height equal to or higher than that of the prevention layer, the conductor pattern and the via portion are formed on the surface of the conductor pattern and the via portion formed by polishing the metal layer to flatten it. By forming the barrier layer for preventing the diffusion of the metal into the insulating resin layer, the flatness of the multilayer wiring board can be secured even if the land portion and the conductor pattern are thick.

Further, a bottom surface is formed so that the land portion is exposed and forms a bottom surface in the next layer of the insulating resin layer that covers the land portion of the conductor pattern formed on the surface of the insulating substrate or the insulating resin layer. After forming a tapered through hole having a smaller diameter toward the side, a step height preventing layer made of an insulating resin and having a predetermined height is formed between a portion forming the conductor pattern and a portion forming a via portion, Next, the adhesion between the insulating resin layer and the via portion is improved and the via portion is formed over the entire surface of the insulating resin layer including the bottom surface and the wall surface of the tapered through hole and the step prevention layer. A metal layer having a predetermined thickness is formed by plating on the adhesion barrier layer for preventing the diffusion of the metal to be formed into the insulating resin layer, and then the metal layer is subjected to a polishing treatment to be flattened to expose the step difference. Formed through the prevention layer By forming a barrier layer on the surface of the conductor pattern and the via portion to prevent the metal forming the conductor pattern and the via portion from diffusing into the insulating resin layer, an adhesion barrier layer is formed on the sidewall of the step prevention layer. You can
In addition, the multilayer wiring board can be easily manufactured.

[0010]

According to the present invention, the adhesion between the insulating resin layer and the metal layer is improved and the metal insulating resin layer forming the metal layer is formed on the back surface side of the via portion that contacts the insulating resin layer. The adhesion barrier layer for preventing diffusion into the insulating layer can eliminate the peeling of the via portion from the insulating resin layer and the deterioration of the insulating property of the insulating resin layer. Further, since the through hole for the via portion is a tapered through hole having a smaller diameter on the bottom surface side where the land portion of the conductor pattern formed on the back surface side of the insulating resin layer is exposed,
The adhesion barrier layer having a uniform thickness can be easily formed by sputtering or the like. Furthermore, when forming the via part by filling the tapered through-hole with metal by plating, the conductor pattern can be formed at the same time, and the step of forming the via part and the step of forming the conductor pattern are separate steps. The process can be significantly simplified as compared with a conventional manufacturing method.

[0011]

The present invention will be described in more detail with reference to the drawings.
FIG. 1 is a partial sectional view showing an embodiment of the present invention,
A conductor pattern 16 is formed on the upper surface of a ceramic insulating substrate 10 made of aluminum nitride, and a land portion 18 is formed at an end of the conductor pattern. The conductor pattern 16 and the land portion 18 are formed from the surface of the insulating substrate such that a titanium (Ti) thin film layer, a molybdenum (Mo) thin film layer, and a nickel (Ni) thin film layer.
The thin film layers are sequentially stacked. The titanium (Ti) thin film layer that forms the conductor pattern 16 and the land portion 18 improves the adhesion between the ceramic insulating substrate 10 made of aluminum nitride and the molybdenum (Mo) thin film layer that transmits signals. The (Ni) thin film layer is for preventing diffusion of the molybdenum (Mo) thin film layer into the insulating resin layer. The conductor pattern 16 is covered with an insulating resin layer 12 made of a polyimide resin having a predetermined thickness, but the land portion 18 is connected to the bottom surface of a via portion 20 formed through the insulating resin layer 12. .

The via portion 20 is made of copper metal and has a taper shape having a smaller diameter on the side of the land portion 18 and is formed by plating and filling a tapered through hole formed in the insulating resin layer 12. 24, and a land portion 28 extended from the metal layer 24 and formed on the surface of the insulating resin layer 12 in a larger area than the opening of the tapered through hole. The insulating resin layer 12 and the metal layer 2 are provided at the portions of the metal layer 24 and the land portion 28 that contact the insulating resin layer 12.
4, an adhesion barrier layer 22 is formed to improve the adhesion with 4, and prevent the diffusion of copper metal into the insulating resin layer 12. The adhesion barrier layer 22 is formed by sequentially stacking a chromium (Cr) thin film layer and a copper (Cu) thin film layer from the wall surface side of the tapered through hole. Among these thin film layers, the chromium (Cr) thin film layer improves the adhesion to the insulating resin layer 12 and prevents the diffusion of copper metal, and the copper (Cu) thin film layer reduces the electric resistance value of the adhesion barrier layer 22. This is to plan each. The layer thickness of the copper (Cu) thin film layer forming the adhesion barrier layer 22 may be about 0.2 μm. In addition, a barrier is formed on each upper surface of the conductor pattern 17 and the land portion 28, which are formed on the upper surface of the insulating resin layer 12 and have the same thickness as the land portion 28, in order to prevent diffusion of copper metal into the insulating resin layer. A nickel (Ni) thin film layer is formed as the layer 26. In this example, the adhesion barrier layer 22 is also formed on the lower surface side of the copper layer 25 forming the conductor pattern 17.

In the multilayer wiring board shown in FIG. 1, the insulating resin layer 14 is laminated on the insulating resin layer 12, and the land portion 28 of the via portion 20 formed in the lower insulating resin layer 12 and the upper portion of the insulating resin layer 12 are formed. The conductor pattern 1 is connected to the via portion 20 formed in the insulating resin layer 14 and is formed on the upper surface of the insulating resin layer 14.
7 are formed. Since the via portion 20 and the conductor pattern 17 formed in the upper insulating resin layer 14 have the same structure as the via portion 20 and the conductor pattern 17 formed in the lower insulating resin layer 12, a detailed description will be given. Is omitted. By the way, generally, in a multilayer wiring board, as shown in FIG. 9, the upper end area of the land portion 108 is larger than the lower end area of the metal layer 110 forming the via portion. This is to secure the connection between the metal layer 110 and the land portion 108 even if the center position of the land portion 108 is slightly displaced. In this regard, in this embodiment, since the portion of the metal layer 24 forming the via portion 20 is formed in a tapered shape, the upper end area of the metal layer 24 is the upper end area of the metal layer 110 forming the conventional via portion. Equal to
The lower end area of the metal layer 24 can be made small. Therefore, as shown in FIG. 2, the via portion 2 connected to the center of the land portion 28 is formed.
Even if the center of 0 is slightly deviated, the connection between them can be surely secured.

In the multilayer wiring boards shown in FIGS. 1 and 2, copper metal is exposed on the side surfaces of the land portion 28 and the conductor pattern 17 protruding from the surfaces of the insulating resin layers 12 and 14. Therefore, when the land portion 28 and the conductor pattern 17 are thick, the barrier layer 26 made of a nickel (Ni) thin film layer is provided on the side surface as shown in FIG. 3 in order to prevent diffusion of copper metal into the insulating resin layer. It is preferable to extend to the side. Further, when the land portion 28 and the conductor pattern 17 are thick, a step portion is likely to be formed between the land portion 28 and the conductor pattern 17, so that the land portion 2 is formed as shown in FIG.
By forming the step preventing layers 31 and 33 made of an insulating resin between the wiring pattern 8 and the conductor pattern 17, the flatness of the multilayer wiring board can be maintained.

Among the multilayer wiring boards shown in FIGS. 1 to 4, the multilayer wiring board shown in FIG. 1 can be manufactured by the manufacturing method shown in FIG. In FIG. 1, first, an insulating resin layer 12 made of polyimide resin having a predetermined thickness is formed to cover the conductor pattern 16 and the land portion 18 formed on the ceramic insulating substrate 10 made of aluminum nitride. The insulating resin layer 12 is provided with a tapered through hole 30 which is exposed to form a bottom surface [FIG.
(A)]. The tapered through hole 30 has a taper shape having a smaller diameter on the bottom surface side and can be formed by isotropic etching. Incidentally, the conductor pattern 16 and the land portion 18
Is formed by patterning a metallized layer including a titanium (Ti) thin film layer, a molybdenum (Mo) thin film layer, and a nickel (Ni) thin film layer formed by sputtering over the entire surface of the insulating substrate 10. is there. A metallized layer 32 made of a chromium (Cr) thin film layer and a copper (Cu) thin film layer is formed by sputtering over the entire surface of the insulating resin layer 12 including the wall surface of the tapered through hole 30 and the bottom surface where the land portion 18 is exposed. A resist layer 34 having a predetermined height is formed on the metallization layer 32 so that the metallization layer 32 in the portion where the conductor pattern and the via portion are formed is exposed.
Are formed (FIGS. 5B and 5C). Here, when the tapered through hole 30 is a substantially cylindrical through hole, it is difficult to make the metallized layer 32 formed on the wall surface of the through hole by sputtering to have a uniform thickness.

Next, copper metal is laminated on the exposed portion of the metallized layer 32 by electrolytic plating while supplying power from the metallized layer 32 to form copper metal layers 36 and 37. Electrolytic plating is continued until the lowest portion of the copper metal layers 36, 37 is higher than the surface of the resist layer 34 [FIG.
(D)]. The copper metal layers 36 and 37 are flattened by a polishing process and the thickness thereof is adjusted, and the copper layer 25 forming the conductor pattern 17 (FIG. 1) and the metal layer forming the via portion 20 (FIG. 1). 24 and the land portion 28 [FIG.
(E)]. Further, on the surfaces of the copper layer 25 and the land portion 28 shown in FIG. 5E, a nickel (Ni) thin film layer is formed as a barrier layer 26 by electrolytic plating in order to prevent diffusion of copper metal, and then a resist layer is formed. After removing 34, the exposed portion of the metallized layer 32 is removed by etching or the like to form a via portion connected to the conductor pattern 17 on the insulating resin layer 12 and the land portion 18 formed on the insulating substrate 10. 20 and 20 can be formed at the same time [Fig. 5 (f)]
(G)]. Incidentally, nickel (Ni) as the barrier layer 26
If the thin film layer cannot be formed by electrolytic plating, it may be formed by electroless plating. Below, FIG. 5 (g)
By sequentially performing the process from FIG. 5A on the insulating resin layer 12 of FIG. 5, a multilayer wiring board in which a plurality of insulating resin layers are laminated on the insulating substrate 10 can be manufactured.

When the multilayer wiring board shown in FIG. 3 is to be manufactured, it can be manufactured by the method shown in FIG. In this method, the same steps as those shown in FIG. 5 are performed up to the step of FIG. 5E, so the same substrate as that shown in FIG. 5E is shown in FIG. 6A. On the substrate shown in FIG. 6A, the resist layer 34 is removed and the exposed metallization layer 32 is removed by etching or the like. Therefore, the via portion 20 including the metal layer 24 and the land portion 28 connected to the copper layer 25 forming the conductor pattern 17 on the insulating resin layer 12 and the land portion 18 formed on the insulating substrate 10. And are simultaneously formed (FIGS. 6B and 6C). Then, a nickel (Ni) thin film layer as the barrier layer 26 is formed on the entire surfaces of the copper layer 25 and the land portion 28 by electroless plating [FIG. 6 (d)]. Hereinafter, the steps of FIGS. 5A to 5E and FIG. 6A to FIG. 6D are performed on the insulating resin layer 12.
By sequentially performing the steps of (a) to FIG. 6 (d),
It is possible to manufacture a multilayer wiring board in which a plurality of insulating resin layers are laminated on the insulating substrate 10.

Further, the multilayer wiring board shown in FIG. 4 can be manufactured by the method shown in FIG. This method
Since the same steps as those shown in FIG. 5 are performed up to the step shown in FIG. 5B, the same substrate as that shown in FIG.
It is shown in (a). After forming a resist layer 34 on the portion where the conductor pattern 17 (FIG. 4) and the via portion 20 (FIG. 4) are formed on the substrate shown in FIG. 7A, the metallization layer 32 is formed.
The exposed portions are removed by etching or the like to form the adhesion barrier layers 22 and 22 (FIGS. 7B and 7C). Next, an insulating resin layer having a predetermined thickness is applied to the entire surface of the insulating resin layer 12, and then the insulating resin layer is partially removed so that the adhesion barrier layers 22 and 22 are exposed. The prevention layer 31 is formed [FIG.7 (d)]. This partial removal of the insulating resin layer is performed after forming an insulating resin layer having a predetermined thickness,
It may be performed by forming a patterning resist layer on the insulating resin layer, patterning it, and then performing an etching treatment. Alternatively, the insulating resin layer is formed of a photosensitive resin, and the insulating resin layer itself is exposed and developed. Alternatively, patterning may be performed. Furthermore, the adhesion barrier layer 2
Copper metal is laminated on the adhesion barrier layers 22 and 22 by electrolytic plating while supplying power from 2 and 22 to form copper metal layers 36 and 37.
To form. Electrolytic plating is continued until the lowest part of the copper metal layers 36, 37 is higher than the surface of the step prevention layer 31 [FIG. 7 (e)].

The copper metal layers 36 and 37 are flattened by a polishing process and have their thicknesses adjusted so that the copper layer 25 forming the conductor pattern 17 (FIG. 4) and the via portion 20 (FIG. 4) are formed. The constituent metal layer 24 and the land portion 28 are formed [FIG. 7 (f)]. Further, on the surfaces of the copper layer 25 and the land portion 28 shown in FIG. 7 (f), a nickel (Ni) thin film layer is formed as a barrier layer 26 by electrolytic plating in order to prevent diffusion of copper metal. Resin layer 1
The conductor pattern 17 and the via portion 20 connected to the land portion 18 formed on the insulating substrate 10 can be simultaneously formed on the wiring 2 (FIG. 7G). Although the plating in the method shown in FIG. 7 is electrolytic plating, electroless plating may be used when power cannot be supplied. Below, FIG. 7 (g)
The step of FIG. 5A to FIG. 5B and the step of FIG. 7A to FIG. 7G are sequentially performed on the step prevention layer 31 of FIG. It is possible to manufacture a multilayer wiring board in which a plurality of layers are stacked on the substrate 10.

In the method of manufacturing a multilayer wiring board shown in FIG. 7, after patterning the metallization layer 32,
Since the copper metal layers 36 and 37 are formed by plating, when one conductor pattern to be formed is an independent pattern independent of the other conductor pattern, power can be supplied from the adhesion barrier layer 22 to the portion where the independent pattern is formed. However, electroless plating must be adopted instead of electrolytic plating. In this respect, according to the manufacturing method shown in FIG. 8, even if the conductor pattern to be formed is an independent pattern, the copper metal layer can be formed by electrolytic plating. That is, FIG.
(A) Insulation covering the conductor pattern 16 formed on the ceramic insulating substrate 10 made of aluminum nitride and having a tapered through hole 30 that exposes the land portion 18 and forms the bottom surface. The step prevention layer 31 is formed on the functional resin layer 12 [FIG. 8 (a)]. This step prevention layer 31
After forming the insulating resin layer having a predetermined thickness on the entire surface of the insulating resin layer 12, the insulating resin layer is partially formed so that the conductor pattern 17 and the via portion 20 to be formed are exposed. It is formed by removing. Partial removal of the insulating resin layer may be performed by forming an insulating resin layer having a predetermined thickness, applying a patterning resist layer on the insulating resin layer to perform patterning, and then performing an etching treatment. Alternatively, the insulating resin layer may be formed of a photosensitive resin, and the insulating resin layer itself may be exposed and developed to perform patterning.

Then, over the entire surface of the insulating resin layer 12 including the wall surface of the tapered through hole 30 and the bottom surface where the land portion 18 is exposed and the step prevention layer 31, a chromium (Cr) thin film layer and copper (Cu) are formed. ) A metallized layer 32 composed of a thin film layer is formed [FIG. 8 (b)]. Further, a copper metal layer 38 having a predetermined thickness is formed over the entire surface of the metallized layer 32 by electrolytic plating that supplies power from the metallized layer 32 [FIG. 8].
(C)]. Therefore, even if one of the conductor patterns to be formed is an independent pattern, the copper metal layer 38 can always be formed by electrolytic plating. The formed copper metal layer 38 is subjected to polishing treatment for flattening and thickness adjustment, and the exposed step prevention layer 31 forms a copper layer 25 forming a conductor pattern and a copper layer 24 forming a via portion. And the land part 28 is separated [FIG.8 (d)]. Thereafter, on the surfaces of the copper layer 25 and the land portion 28 shown in FIG. 8D, a nickel (Ni) thin film layer is formed as a barrier layer 26 by electrolytic plating or electroless plating in order to prevent diffusion of copper metal. [FIG.8 (e)]. Hereinafter, the step of FIG. 5A and the steps of FIG. 8A to FIG. 8E are formed on the step prevention layer 31 of FIG.
By sequentially performing the above steps, it is possible to manufacture a multilayer wiring board in which a plurality of insulating resin layers are laminated on the insulating substrate 10.

In the multilayer wiring board obtained by the process shown in FIG. 8, the conductor pattern 17 in which the copper layer 25 is surrounded by the adhesion barrier layer 22 and the barrier layer 26, and the copper layer 24 and the land portion 28 are the adhesion barrier. The via portion 20 surrounded by the layer 22 and the barrier layer 26 can be formed. Therefore, the diffusion of the copper metal forming the copper layers 24 and 25 can be sufficiently prevented. Also in the manufacturing process, the copper metal layer 38 can be formed by electrolytic plating, and the patterning process of the metallized layer 32 can be omitted, so that the multilayer wiring board can be easily manufactured.

[0023]

According to the present invention, it is possible to prevent the metal layer forming the via part from being separated from the insulating resin layer, and to prevent the metal forming the metal layer from diffusing into the insulating resin layer. The reliability of the multilayer wiring board can be improved. Further, since the via portion and the conductor pattern can be formed at the same time, the manufacturing process of the multilayer wiring board can be simplified, and the manufacturing cost of the obtained multilayer wiring board can be reduced.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view showing an embodiment of a multilayer wiring board of the present invention.

FIG. 2 is an explanatory diagram illustrating an effect of a land portion shown in FIG.

FIG. 3 is a partial sectional view showing another embodiment of the present invention.

FIG. 4 is a partial cross-sectional view showing another embodiment of the present invention.

5A to 5C are process diagrams illustrating a manufacturing process of the multilayer wiring board of FIG.

6A to 6C are process diagrams illustrating a manufacturing process of the multilayer wiring board of FIG.

7A to 7C are process diagrams illustrating a manufacturing process of the multilayer wiring board of FIG.

8A to 8D are process diagrams illustrating a method for improving the method for manufacturing the multilayer wiring board shown in FIG.

FIG. 9 is a partial cross-sectional view showing a conventional multilayer wiring board.

FIG. 10 is a process drawing for explaining a manufacturing process of the multilayer wiring board shown in FIG.

FIG. 11 is a process diagram illustrating a manufacturing process of a conventional multilayer wiring board which is more simplified than the manufacturing process of FIG.

[Explanation of symbols]

 10 Insulating Substrate 12, 14 Insulating Resin Layer 16 Conductor Pattern 17 Formed on Insulating Substrate 10 Conductor Pattern 18 Land Part 20 Formed on Insulating Substrate 20 Via Part 22 Adhesion Barrier Layer 24, 25 Metal Layer 26 Barrier layer 28 Land part

Claims (7)

[Claims] 1. An insulating resin layer in which a plurality of insulating resin layers are laminated on an insulating substrate, and conductor patterns formed on respective surface sides of the insulating substrate and the insulating resin layer are different from each other. A multilayer wiring board having a via portion made of a metal formed through the insulating resin layer so as to connect predetermined conductor patterns formed on the front surface side of the conductor layer to the conductor layer. A tapered through hole that penetrates through the insulating resin layer of the next layer laminated on the surface of the insulating substrate or the insulating resin layer on which the pattern is formed, and has a smaller diameter toward the bottom surface side where the land portion of the conductor pattern is exposed. A metal layer formed by plating and filling, and a land portion extending from the metal layer and formed on the surface of the insulating resin layer, at least the contact of the via portion contacting the insulating resin layer Surface, insulating Multi-layer wiring board, wherein a fat layer and the adhesion barrier layer to improve the adhesion and improving the diffusion prevention in the insulating resin layer of the metal forming the via portion of the via portion is formed. 2. The entire surface of the land portion forming the via portion,
The multilayer wiring board according to claim 1, wherein the multilayer wiring board is covered with a barrier layer for preventing diffusion of a metal forming the via portion into the insulating resin layer. 3. The multi-layer according to claim 1, wherein a step prevention layer made of an insulating resin is formed between the conductor pattern formed on the same surface of the insulating resin layer and the land portion forming the via portion. Wiring board. 4. An insulating resin layer in which a plurality of insulating resin layers are laminated on an insulating substrate, and conductor patterns formed on the respective surface sides of the insulating substrate and the insulating resin layer are different from each other. When manufacturing a multilayer wiring board including a via part made of metal formed through the insulating resin layer so as to connect predetermined conductor patterns formed on the front surface side of the A taper shape having a smaller diameter toward the bottom surface side so that the land portion is exposed and forms a bottom surface in the insulating resin layer of the next layer that covers the land portion of the conductor pattern formed on the surface of the substrate or the insulating resin layer. After forming the through hole, on the entire surface of the insulating resin layer including the bottom surface and the wall surface of the tapered through hole, the adhesion between the insulating resin layer and the via portion is improved, and the metal forming the via portion is formed. Dense to prevent diffusion to the insulating resin layer A barrier layer is formed, and then obtained by patterning on a resist layer having a predetermined height formed on the adhesion barrier layer, which is a portion for forming a conductor pattern and a via portion and an exposed portion of the adhesion barrier layer, A metal layer having a height equal to or higher than that of the resist layer is formed by plating, and then the metal layer forming the metal layer is prevented from diffusing into the insulating resin layer on the flattened metal layer surface by polishing the metal layer. After forming a barrier layer for achieving the above, the exposed portion of the adhesion barrier layer exposed by removing the resist layer is removed to form a conductor pattern and a via portion, and a method for manufacturing a multilayer wiring board. . 5. An insulating resin layer in which a plurality of insulating resin layers are laminated on an insulating substrate, and the conductor patterns formed on the respective surface sides of the insulating substrate and the insulating resin layer are different from each other. When manufacturing a multilayer wiring board including a via part made of metal formed through the insulating resin layer so as to connect predetermined conductor patterns formed on the front surface side of the A taper shape having a smaller diameter toward the bottom surface side so that the land portion is exposed and forms a bottom surface in the insulating resin layer of the next layer that covers the land portion of the conductor pattern formed on the surface of the substrate or the insulating resin layer. After forming the through hole, on the entire surface of the insulating resin layer including the bottom surface and the wall surface of the tapered through hole, the adhesion between the insulating resin layer and the via portion is improved, and the metal forming the via portion is formed. Dense to prevent diffusion to the insulating resin layer A barrier layer is formed, and then obtained by patterning on a resist layer having a predetermined height formed on the adhesion barrier layer, which is a portion for forming a conductor pattern and a via portion and an exposed portion of the adhesion barrier layer, A metal layer having a height equal to or higher than that of the resist layer is formed by plating, and then, the metal layer is subjected to polishing treatment to be flattened,
Diffusion of the metal forming the conductor pattern and the via portion into the insulating resin layer on the surface of the conductor pattern and the via portion formed by removing the exposed portion of the adhesion barrier layer exposed by removing the resist layer A method of manufacturing a multilayer wiring board, comprising forming a barrier layer for prevention. 6. An insulating resin layer in which a plurality of insulating resin layers are laminated on an insulating substrate and conductor patterns formed on the respective surface sides of the insulating substrate and the insulating resin layer are different from each other. When manufacturing a multilayer wiring board including a via part made of metal formed through the insulating resin layer so as to connect predetermined conductor patterns formed on the front surface side of the A taper shape having a smaller diameter toward the bottom surface side so that the land portion is exposed and forms a bottom surface in the insulating resin layer of the next layer that covers the land portion of the conductor pattern formed on the surface of the substrate or the insulating resin layer. After forming the through hole, on the entire surface of the insulating resin layer including the bottom surface and the wall surface of the tapered through hole, the adhesion between the insulating resin layer and the via portion is improved, and the metal forming the via portion is formed. Dense to prevent diffusion to the insulating resin layer After forming a barrier layer, and then patterning the adhesion barrier layer so that the adhesion barrier layer in the portion where the conductor pattern and the via portion are formed remains, the adhesion barrier in the portion where the conductor pattern is formed A step preventing layer made of an insulating resin and having a predetermined height is formed between the layer and the adhesion barrier layer in the portion forming the via portion, and then the adhesion barrier layer is exposed to form a conductor pattern and a via portion. The conductor pattern and the via portion are formed on the surface of the conductor pattern and the via portion, which are formed by polishing a metal layer having a height equal to or higher than that of the step prevention layer formed by plating and planarizing the portion. A method of manufacturing a multilayer wiring board, comprising forming a barrier layer for preventing the diffusion of the metal to the insulating resin layer. 7. An insulating resin layer in which a plurality of insulating resin layers are laminated on an insulating substrate, and conductor patterns formed on respective surface sides of the insulating substrate and the insulating resin layer are different from each other. When manufacturing a multilayer wiring board including a via part made of metal formed through the insulating resin layer so as to connect predetermined conductor patterns formed on the front surface side of the A taper shape having a smaller diameter toward the bottom surface side so that the land portion is exposed and forms a bottom surface in the insulating resin layer of the next layer that covers the land portion of the conductor pattern formed on the surface of the substrate or the insulating resin layer. After forming the through hole, a step preventing layer made of an insulating resin and having a predetermined height is formed between the portion where the conductor pattern is formed and the portion where the via portion is formed, and then the tapered through hole is formed. Including the bottom and wall of Adhesion formed over the entire surface of the insulating resin layer and the step prevention layer to improve the adhesiveness between the insulating resin layer and the via portion and prevent diffusion of the metal forming the via portion into the insulating resin layer A metal layer having a predetermined thickness is formed on the barrier layer by plating, and then the metal layer is subjected to a polishing treatment to be flattened and the conductor pattern and the surface of the via portion formed through the step prevention layer exposed by the planarization. And a barrier layer for preventing the diffusion of the metal forming the conductor pattern and the via into the insulating resin layer.