GB9521224D0 - Flexible multi-layered wiring board and method of manufacturing the same - Google Patents

Flexible multi-layered wiring board and method of manufacturing the same

Info

Publication number
GB9521224D0
GB9521224D0 GBGB9521224.7A GB9521224A GB9521224D0 GB 9521224 D0 GB9521224 D0 GB 9521224D0 GB 9521224 A GB9521224 A GB 9521224A GB 9521224 D0 GB9521224 D0 GB 9521224D0
Authority
GB
United Kingdom
Prior art keywords
manufacturing
same
wiring board
flexible multi
layered wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9521224.7A
Other versions
GB2294363A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of GB9521224D0 publication Critical patent/GB9521224D0/en
Publication of GB2294363A publication Critical patent/GB2294363A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB9521224A 1994-10-21 1995-10-17 Flexible multi-layered wiring board Withdrawn GB2294363A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28292394A JPH08125342A (en) 1994-10-21 1994-10-21 Flexible multilayered wiring board and its manufacture

Publications (2)

Publication Number Publication Date
GB9521224D0 true GB9521224D0 (en) 1995-12-20
GB2294363A GB2294363A (en) 1996-04-24

Family

ID=17658870

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9521224A Withdrawn GB2294363A (en) 1994-10-21 1995-10-17 Flexible multi-layered wiring board

Country Status (2)

Country Link
JP (1) JPH08125342A (en)
GB (1) GB2294363A (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2127125B1 (en) * 1997-02-05 1999-11-16 Mecanismos Aux Ind SOME IMPROVEMENTS INTRODUCED IN THE MANUFACTURE OF PRINTED CIRCUITS.
DE19829581A1 (en) * 1998-07-02 2000-01-05 Bosch Gmbh Robert Subrack for electronic circuits
KR100278609B1 (en) * 1998-10-08 2001-01-15 윤종용 Printed circuit board
US6292370B1 (en) * 1999-10-01 2001-09-18 Motorola, Inc. Flexible circuit board and method for making a flexible circuit board
DE10312158A1 (en) * 2003-03-19 2004-10-14 Hirschmann Electronics Gmbh & Co. Kg Curved circuit board of an antenna amplifier for a vehicle antenna device
US7378596B2 (en) 2003-04-18 2008-05-27 Ibiden Co., Ltd. Rigid-flex wiring board
JP4586424B2 (en) * 2004-03-15 2010-11-24 日立化成工業株式会社 Printed circuit board
JP4536430B2 (en) * 2004-06-10 2010-09-01 イビデン株式会社 Flex rigid wiring board
KR100854614B1 (en) 2004-06-11 2008-08-27 이비덴 가부시키가이샤 Flexrigid circuit board and method of manufacturing the same
JP4735092B2 (en) * 2004-07-14 2011-07-27 日立化成工業株式会社 Printed circuit board
US7312401B2 (en) 2004-09-21 2007-12-25 Ibiden Co., Ltd. Flexible printed wiring board
JP2007096131A (en) * 2005-09-29 2007-04-12 Toshiba Corp Printed wiring board
FI122216B (en) 2009-01-05 2011-10-14 Imbera Electronics Oy Rigid-flex module
CN102469699B (en) * 2010-11-12 2014-05-21 富葵精密组件(深圳)有限公司 Manufacturing method of rigid-flexible circuit board
CN103096647B (en) * 2011-10-31 2016-01-13 健鼎（无锡）电子有限公司 The manufacture method of folding type printed circuit board (PCB)
WO2014207822A1 (en) * 2013-06-25 2014-12-31 株式会社メイコー Printed wiring board
US9326376B2 (en) 2014-01-14 2016-04-26 Meiko Electronics Co., Ltd. Printed wiring board
US11355829B2 (en) 2017-09-12 2022-06-07 Knowles Cazenovia, Inc. Vertical switched filter bank
CN109600912A (en) * 2018-12-13 2019-04-09 中科芯集成电路股份有限公司 Flexible rigid PCB circuit board of one kind and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693534B2 (en) * 1990-02-26 1994-11-16 日本アビオニクス株式会社 Flexible rigid printed wiring board
JP2503580Y2 (en) * 1990-05-22 1996-07-03 凸版印刷株式会社 Antenna support
US5121297A (en) * 1990-12-31 1992-06-09 Compaq Computer Corporation Flexible printed circuits
JPH07109942B2 (en) * 1992-02-28 1995-11-22 日本アビオニクス株式会社 Flexible rigid printed wiring board
JP2630241B2 (en) * 1993-06-17 1997-07-16 日本電気株式会社 Electronics
JP4131964B2 (en) * 2004-12-10 2008-08-13 株式会社東芝 Information terminal equipment

Also Published As

Publication number Publication date
JPH08125342A (en) 1996-05-17
GB2294363A (en) 1996-04-24

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)