JPH07109942B2 - Flexible rigid printed wiring board - Google Patents
Flexible rigid printed wiring boardInfo
- Publication number
- JPH07109942B2 JPH07109942B2 JP7586792A JP7586792A JPH07109942B2 JP H07109942 B2 JPH07109942 B2 JP H07109942B2 JP 7586792 A JP7586792 A JP 7586792A JP 7586792 A JP7586792 A JP 7586792A JP H07109942 B2 JPH07109942 B2 JP H07109942B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible
- rigid
- frequency circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、高周波用の回路と低・
中間周波用の回路とを有するフレキシブル・リジッド・
プリント配線板に関するものである。BACKGROUND OF THE INVENTION The present invention relates to a high frequency circuit and a low-frequency circuit.
Flexible rigid with intermediate frequency circuit
The present invention relates to a printed wiring board.
【０００２】[0002]
【従来の技術】プリント配線板にシ−ルド層を設け、こ
のシ−ルド層を挟んで一側に高周波回路用配線板を、他
側に低・中間周波回路用配線板を設けたリジッドプリン
ト配線板が公知である（例えば特願昭６３−３９２１０
号）。Rigid printing in which a shield layer is provided on a printed wiring board, a high-frequency circuit wiring board is provided on one side and a low / intermediate frequency circuit wiring board is provided on the other side with the shield layer sandwiched therebetween. A wiring board is known (for example, Japanese Patent Application No. 63-39210).
issue).
【０００３】ここに高周波回路用配線板には誘電率
（ε）が小さい絶縁材、例えばポリスチレンや４弗化エ
チレン（ε＝２．５程度）を用いる。また低・中間周波
回路用配線板には誘電率が大きい絶縁材、例えばガラス
・エポキシ樹脂（ε＝４．７程度）を用いる。Here, an insulating material having a small dielectric constant (ε), for example, polystyrene or ethylene tetrafluoride (ε = about 2.5) is used for the wiring board for the high frequency circuit. An insulating material having a large dielectric constant, for example, glass epoxy resin (ε = about 4.7) is used for the wiring board for low / intermediate frequency circuits.
【０００４】一方屈曲可能なフレキシブル・プリント配
線板の一部にリジッド・プリント配線板を接着し、両者
を連続し一体化したフレキシブル・リジッド・プリント
配線板も公知である。On the other hand, there is also known a flexible rigid printed wiring board in which a rigid printed wiring board is adhered to a part of a flexible printed wiring board which can be bent, and both are continuously integrated.
【０００５】[0005]
【従来の技術の問題点】しかし従来、このフレキシブル
・リジッド・プリント配線板のリジッド・プリント配線
板部分に、高周波回路用の配線板と低・中間周波回路用
の配線板とを積層したものは知られていない。[Problems of the prior art] However, conventionally, the flexible printed wiring board has a rigid printed wiring board portion on which a high-frequency circuit wiring board and a low-intermediate frequency circuit wiring board are laminated. unknown.
【０００６】この場合フレキシブル・プリント配線板に
低・中間周波回路用信号線層を設け、複数のリジッド・
プリント配線板間あるいはフレキシブル・プリント配線
板に設けた接続端子や他の部品との間での信号の授受を
行うことが必要になる。In this case, a flexible printed wiring board is provided with a signal line layer for a low / intermediate frequency circuit, and a plurality of rigid
It is necessary to send and receive signals between the printed wiring boards or between the connection terminals provided on the flexible printed wiring board and other parts.
【０００７】しかしフレキシブル・プリント配線板は屈
曲可能であり装置に組込まれた状態では高周波回路用の
リジッド・プリント配線板がこのフレキシブル・プリン
ト配線板に近接することがあり得る。またフレキシブル
・プリント配線板を大きく屈曲しなくても、高周波回路
用のリジッド・プリント配線板はフレキシブル・プリン
ト配線板に元来近接し狭い機器内に収納される。このた
め高周波回路から発生する高周波ノイズがフレキシブル
・プリント配線板の信号線層に乗るなど回路間で干渉が
発生するおそれがある。However, the flexible printed wiring board is bendable, and when assembled in the apparatus, the rigid printed wiring board for the high frequency circuit may be close to the flexible printed wiring board. Further, even if the flexible printed wiring board is not largely bent, the rigid printed wiring board for a high frequency circuit is originally close to the flexible printed wiring board and is housed in a narrow device. Therefore, there is a possibility that high-frequency noise generated from the high-frequency circuit may interfere with the circuit, such as riding on the signal line layer of the flexible printed wiring board.
【０００８】[0008]
【発明の目的】本発明はこのような事情に鑑みなされた
ものであり、リジッド・プリント配線板にシ−ルド層を
挟んで高周波回路用および低・中間周波回路用のプリン
ト配線板をそれぞれ設けた場合に、高周波用の回路とフ
レキシブル・プリント配線板の信号線層との間での信号
の干渉を防止し得るようにしたフレキシブル・リジッド
・プリント配線板を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a printed circuit board for a high frequency circuit and a printed circuit board for a low / intermediate frequency circuit are provided with a shield layer sandwiched between them. It is an object of the present invention to provide a flexible rigid printed wiring board capable of preventing signal interference between the high frequency circuit and the signal line layer of the flexible printed wiring board.
【０００９】[0009]
【発明の構成】本発明によればこの目的は、フレキシブ
ル・プリント配線板の一部領域にカバーレイを積層して
なるフレキシブル部と、前記フレキシブル・プリント配
線板の他の領域に形成されたリジッド部とを連続して一
体化し、前記フレキシブル部と前記リジッド部との配線
をスルーホールで接続したフレキシブル・リジッド・プ
リント配線板において、前記フレキシブル・プリント配
線板は、ベースフィルムを介して積層されたシ−ルド層
および低・中間周波用信号線層を備え、前記リジッド部
は、前記ベースフィルムの前記信号線層側に絶縁層を介
して積層された誘電率が比較的大きい基板を用いた低・
中間周波回路用配線板と、前記ベースフィルムのシール
ド層側に積層された誘電率が比較的小さい基板を用いた
高周波回路用配線板とを備え、前記低・中間周波回路を
前記信号線層に接続する前記スルーホールは前記シール
ド層から絶縁されていることを特徴とするフレキシブル
・リジッド・プリント配線板により達成される。According to the present invention, an object of the present invention is to provide a flexible portion formed by laminating a coverlay on a partial area of a flexible printed wiring board and another area of the flexible printed wiring board. Wiring between the flexible part and the rigid part by continuously integrating the formed rigid part
In a rigid rigid printed wiring board, wherein the flexible printed wiring board is a shield layer laminated via a base film.
And a low / intermediate frequency signal line layer, wherein the rigid portion has an insulating layer on the signal line layer side of the base film.
Using a laminated substrate with a relatively large dielectric constant
Wiring board for intermediate frequency circuit and seal of the base film
A high-frequency circuit wiring board using a substrate having a relatively small dielectric constant, which is laminated on the side of the low-frequency circuit.
The through hole connecting to the signal line layer is the seal.
Is achieved by a flexible rigid printed wiring board characterized that you have been isolated from the soil layers.
【００１０】[0010]
【実施例】図１は本発明の一実施例の断面図である。こ
の配線板は、一対のリジッド部１、２と、これらをつな
ぐフレキシブル部３とを連続して形成し一体化したもの
である。FIG. 1 is a sectional view of an embodiment of the present invention. This wiring board is one in which a pair of rigid portions 1 and 2 and a flexible portion 3 connecting them are continuously formed and integrated.
【００１１】フレキシブル部３はフレキシブル・プリン
ト配線板からなり、ベ−スフィルム４と、このベ−スフ
ィルム４の両面に施された屈曲性に優れた銅箔などの金
属導体からなる信号線層５およびシ−ルド層６と、これ
らを覆う絶縁材であるカバ−レイ７、７とを順次積層し
たものである。カバ−レイ７、７と信号線層５およびシ
−ルド層６との間には接着剤層が介在する。ベ−スフィ
ルム４は、通常ポリイミド、ポリエステルなどの誘電率
が比較的大きくかつ耐熱性のある樹脂で作られる。The flexible portion 3 is composed of a flexible printed wiring board, and is a signal line layer composed of a base film 4 and a metal conductor such as copper foil having excellent flexibility provided on both sides of the base film 4. 5 and the shield layer 6, and the cover layers 7 and 7 which are insulating materials that cover them, are sequentially laminated. An adhesive layer is interposed between the cover layers 7, 7 and the signal line layer 5 and the shield layer 6. The base film 4 is usually made of a resin having a relatively large dielectric constant and heat resistance, such as polyimide or polyester.
【００１２】信号線層５には適宜の回路パタ−ン例えば
所定間隔の多数の平行な配線パタ−ンが形成されてい
る。シ−ルド層６は回路パタ−ンが無く連続した薄板状
としたり、広範囲に格子状などの回路パターンを形成し
たものとすることができる。カバ−レイ７としては、通
常ポリエステル、ポリイミドなどベ−スフィルム４と同
質材料の絶縁フィルムが用いられ、これはアクリル系接
着剤などの接着剤により接着される。この結果フレキシ
ブル部３は柔軟性をもち折り曲げ可能となる。The signal line layer 5 is formed with an appropriate circuit pattern, for example, a large number of parallel wiring patterns at predetermined intervals. The shield layer 6 may have a continuous thin plate shape without a circuit pattern, or may have a circuit pattern such as a lattice pattern formed over a wide area. As the cover layer 7, an insulating film made of the same material as the base film 4, such as polyester or polyimide, is usually used, which is adhered by an adhesive such as an acrylic adhesive. As a result, the flexible portion 3 has flexibility and can be bent.
【００１３】リジッド部１、２は前記フレキシブル部３
のカバーレイ７、７を除いた構造の部分の両側に絶縁材
層８、９を介して銅張積層板１０、１１を積層したもの
である。すなわちフレキシブル部３の断面構造は、カバ
ーレイ７、７を除く部分がフレキシブル部３だけでなく
リジッド部１、２にも延び、この延出部分の両面に絶縁
材層８、９および銅張積層板１０、１１を積層したもの
である。The rigid portions 1 and 2 are the flexible portions 3
The copper clad laminates 10 and 11 are laminated on both sides of the structure except the coverlays 7 and 7 with the insulating material layers 8 and 9 interposed therebetween. That cross-sectional structure of the flexible portion 3, hippopotamus
The portions other than the relays 7 and 7 extend not only to the flexible portion 3 but also to the rigid portions 1 and 2, and the insulating material layers 8 and 9 and the copper clad laminates 10 and 11 are laminated on both surfaces of the extended portion. .
【００１４】ここにフレキシブル部３の信号線層５側に
積層される絶縁材層８および銅張積層板１０の基板は低
・中間周波用の絶縁材層となるものであり、誘電率が比
較的大きい材料が用いられる。例えば絶縁材層８は接着
剤であってノーフロータイプのものが用いられ、基板に
はガラスなどの基材にエポキシ、フェノ−ル、ポリイミ
ドなどの樹脂を含浸させ乾燥処理して半硬化状態とした
もの（基材樹脂プリプレグ）が用いられる。The insulating material layer 8 and the substrate of the copper clad laminate 10 which are laminated on the signal line layer 5 side of the flexible portion 3 serve as an insulating material layer for low / intermediate frequencies, and have different dielectric constants. Larger materials are used. For example, the insulating material layer 8 is an adhesive, which is a non-flow type, and the substrate is made into a semi-cured state by impregnating a base material such as glass with a resin such as epoxy, phenol, or polyimide and drying it. What was done (base resin prepreg) is used.
【００１５】なお銅張積層板１０の両面に接着される銅
箔１０ａ、１０ｂには、低・中間周波回路用の回路パタ
−ンが形成される。銅張積層板１０により低・中間周波
回路用配線板が形成される。Circuit patterns for low / intermediate frequency circuits are formed on the copper foils 10a and 10b bonded to both surfaces of the copper clad laminate 10. The copper-clad laminate 10 forms a wiring board for low / intermediate frequency circuits.
【００１６】フレキシブル部３のシ−ルド層６側に積層
される絶縁材層９および銅張積層板１１の基板は高周波
用の絶縁材層となるものであり、誘電率が比較的小さい
材料が用いられる。例えば４弗化エチレン樹脂板が用い
られる。この銅張積層板１１の両面に接着される銅箔１
１ａ、１１ｂには高周波回路用の回路パタ−ンが形成さ
れる。銅張積層板１１により高周波回路用配線板１３が
形成される。The insulating material layer 9 and the substrate of the copper clad laminate 11 laminated on the side of the shield layer 6 of the flexible portion 3 serve as an insulating material layer for high frequency, and a material having a relatively small dielectric constant is used. Used. For example, a tetrafluoroethylene resin plate is used. Copper foil 1 bonded to both sides of this copper clad laminate 11
A circuit pattern for a high frequency circuit is formed on 1a and 11b. The copper clad laminate 11 forms a high frequency circuit wiring board 13.
【００１７】１４、１４はスル−ホ−ルであり、リジッ
ド部１、２に設けられている。すなわちこれらスル−ホ
−ル１４、１４はリジッド部１、２を貫通する孔の内面
に導電性のメッキを施したものであり、各層の回路パタ
−ンを接続する。例えばこの図１に示すものでは、スル
−ホ−ル１４、１４は銅張積層板１０、１０、１１、１
１の回路パタ−ンを互いに接続する。なおシ−ルド層６
はこのスル−ホ−ル１４、１４からは絶縁されているの
は勿論である。Reference numerals 14 and 14 are through-holes and are provided in the rigid portions 1 and 2. That is, these through-holes 14 and 14 are conductive plates plated on the inner surfaces of the holes penetrating the rigid portions 1 and 2, and connect the circuit patterns of the respective layers. For example, in the structure shown in FIG. 1, the through-holes 14, 14 are copper clad laminates 10, 10, 11, 1.
1 circuit patterns are connected to each other. The shield layer 6
Is of course insulated from the through-holes 14, 14.
【００１８】この実施例では低・中間周波回路用配線板
１２および高周波回路用配線板１３をそれぞれ２層の絶
縁材層で形成したが、本発明は１層でも、３層以上とし
てもよい。またフレックス部３には１層の信号線層５と
シ−ルド層６とを設けているが、信号線層を複数層とし
たり、シ−ルド層を複数層としてもよい。In this embodiment, the wiring board 12 for low / intermediate frequency circuit and the wiring board 13 for high frequency circuit are each formed of two layers of insulating material, but the present invention may be one layer or three or more layers. Further, the flex portion 3 is provided with one signal line layer 5 and one shield layer 6, but the signal line layer may be a plurality of layers or the shield layer may be a plurality of layers.
【００１９】また１つのシ−ルド層を挟んで信号線層の
反対側には、高周波回路用の回路パタ−ンを複数層に設
けてもよい。この場合シ−ルド層を複数とし、その間に
絶縁層を介して高周波回路パタ−ンを挟むようにしても
よい。さらに高周波回路用配線板１３にはその外側を囲
むシ−ルド層を設け、このシ−ルド層をフレキシブル部
３のシ−ルド層６に接続してもよく、この場合には高周
波回路の電磁シ−ルドが一層完全になり、高周波回路と
低・中間周波回路との干渉をさらに確実に防止できる。A plurality of circuit patterns for high-frequency circuits may be provided on the opposite side of the signal line layer with one shield layer sandwiched therebetween. In this case, a plurality of shield layers may be provided, and a high frequency circuit pattern may be sandwiched between the shield layers. Further, the high-frequency circuit wiring board 13 may be provided with a shield layer that surrounds the outer side thereof, and this shield layer may be connected to the shield layer 6 of the flexible portion 3. The shield becomes more complete, and the interference between the high frequency circuit and the low / intermediate frequency circuit can be prevented more reliably.
【００２０】[0020]
【発明の効果】本発明は以上のように、フレキシブル・
プリント配線板には、シ−ルド層と低・中間周波用信号
線層とを設け、リジッド部には、このシ−ルド層の側に
絶縁層を介して誘電率が比較的小さい基板を用いた高周
波回路用のリジッド配線板を、他側に絶縁層を介して誘
電率が比較的大きい低・中間周波回路用のリジッド配線
板をそれぞれ積層し、シールド層から絶縁されたスルー
ホールによって低・中間周波用回路を信号線層に接続し
たものである。このため、フレキシブル部を屈曲させて
組込んだ場合などに高周波回路がフレキシブル部に接近
しても、この高周波回路をフレキシブル部の信号線層と
の間にはシ−ルド層が介在することになるから、両者間
での信号の干渉が発生するおそれがなくなる。As described above, the present invention is flexible and
The printed wiring board is provided with a shield layer and a low / intermediate frequency signal line layer, and the rigid portion is provided on the shield layer side.
A rigid wiring board for high-frequency circuits that uses a substrate with a relatively low dielectric constant through an insulating layer is guided to the other side through an insulating layer.
Rigid wiring boards for low / intermediate frequency circuits, which have a relatively high electric power ratio , are stacked and insulated from the shield layer.
A low / intermediate frequency circuit is connected to the signal line layer by a hole . Therefore, even if the high frequency circuit approaches the flexible part when the flexible part is bent and incorporated, the shield layer is interposed between the high frequency circuit and the signal line layer of the flexible part. Therefore, there is no possibility of signal interference between the two.
【図１】本発明の一実施の断面図FIG. 1 is a sectional view of an embodiment of the present invention.
１、２ リジッド部 ３ フレキシブル部４ ベースフィルム ５ 信号線層 ６ シ−ルド層７ カバーレイ ８ 絶縁材層 １０ 低・中間周波回路用配線板としての銅張積層板 １１ 高周波回路用配線板としての銅張積層板1, 2 Rigid part 3 Flexible part 4 Base film 5 Signal line layer 6 Shield layer 7 Coverlay 8 Insulating material layer 10 Copper clad laminate as low / intermediate frequency circuit wiring board 11 As high frequency circuit wiring board Copper clad laminate
Claims (1)
域にカバーレイを積層してなるフレキシブル部と、前記
フレキシブル・プリント配線板の他の領域に形成された
リジッド部とを連続して一体化し、前記フレキシブル部
と前記リジッド部との配線をスルーホールで接続したフ
レキシブル・リジッド・プリント配線板において、前記
フレキシブル・プリント配線板は、ベースフィルムを介
して積層されたシ−ルド層および低・中間周波用信号線
層を備え、前記リジッド部は、前記ベースフィルムの前
記信号線層側に絶縁層を介して積層された誘電率が比較
的大きい基板を用いた低・中間周波回路用配線板と、前
記ベースフィルムのシールド層側に積層された誘電率が
比較的小さい基板を用いた高周波回路用配線板とを備
え、前記低・中間周波回路を前記信号線層に接続する前
記スルーホールは前記シールド層から絶縁されているこ
とを特徴とするフレキシブル・リジッド・プリント配線
板。1. A part of a flexible printed wiring board
The flexible portion formed by laminating a coverlay on the area and the rigid portion formed on the other area of the flexible printed wiring board are continuously integrated to form the flexible portion.
In the flexible rigid printed wiring board in which wiring between the rigid printed circuit board and the rigid portion is connected through a through hole, the flexible printed wiring board has a base film.
Was laminated by - with a shield layer and the low-intermediate-frequency signal line, wherein the rigid portion, the signal line layer side dielectric laminated via an insulating layer on the base film is compared
The wiring board for low / intermediate frequency circuits using a large substrate and the dielectric constant laminated on the shield layer side of the base film
A wiring board for a high frequency circuit using a relatively small substrate, and before connecting the low / intermediate frequency circuit to the signal line layer
Serial through-hole flexible rigid printed wiring board characterized that you have been insulated from the shield layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7586792A JPH07109942B2 (en) | 1992-02-28 | 1992-02-28 | Flexible rigid printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7586792A JPH07109942B2 (en) | 1992-02-28 | 1992-02-28 | Flexible rigid printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05243738A JPH05243738A (en) | 1993-09-21 |
| JPH07109942B2 true JPH07109942B2 (en) | 1995-11-22 |
Family
ID=13588638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7586792A Expired - Fee Related JPH07109942B2 (en) | 1992-02-28 | 1992-02-28 | Flexible rigid printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07109942B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08125342A (en) * | 1994-10-21 | 1996-05-17 | Nec Corp | Flexible multilayered wiring board and its manufacture |
| JP2005236153A (en) * | 2004-02-23 | 2005-09-02 | Sumitomo Bakelite Co Ltd | Multilayer circuit board, and manufacturing method thereof |
| JP2007059645A (en) * | 2005-08-25 | 2007-03-08 | Sony Chemical & Information Device Corp | Composite wiring board |
| JP4852979B2 (en) * | 2005-10-31 | 2012-01-11 | ソニー株式会社 | Flex-rigid board, optical transceiver module and optical transceiver |
| JP5176680B2 (en) * | 2008-05-12 | 2013-04-03 | 富士通株式会社 | Multilayer printed wiring board and electronic device |
| JP2012169523A (en) * | 2011-02-16 | 2012-09-06 | Nec Toppan Circuit Solutions Inc | Manufacturing method of rigid flexible printed wiring board |
-
1992
- 1992-02-28 JP JP7586792A patent/JPH07109942B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05243738A (en) | 1993-09-21 |
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