ID26528A - GLASS-STRENGTH FIBER LAMINATION, ELECTRONIC CIRCUIT BOARD AND METHOD FOR PREPARATION OF A ROAD STRUCTURE - Google Patents

GLASS-STRENGTH FIBER LAMINATION, ELECTRONIC CIRCUIT BOARD AND METHOD FOR PREPARATION OF A ROAD STRUCTURE

Info

Publication number
ID26528A
ID26528A IDW20001683A ID20001683A ID26528A ID 26528 A ID26528 A ID 26528A ID W20001683 A IDW20001683 A ID W20001683A ID 20001683 A ID20001683 A ID 20001683A ID 26528 A ID26528 A ID 26528A
Authority
ID
Indonesia
Prior art keywords
glass
preparation
circuit board
electronic circuit
road structure
Prior art date
Application number
IDW20001683A
Other languages
Indonesian (id)
Inventor
Bruce E Novich
Xiang Wu
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of ID26528A publication Critical patent/ID26528A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10Coating
    • C03C25/24Coatings containing organic materials
    • C03C25/26Macromolecular compounds or prepolymers
    • C03C25/28Macromolecular compounds or prepolymers obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10Coating
    • C03C25/24Coatings containing organic materials
    • C03C25/26Macromolecular compounds or prepolymers
    • C03C25/32Macromolecular compounds or prepolymers obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10Coating
    • C03C25/42Coatings containing inorganic materials
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10Coating
    • C03C25/465Coatings containing composite materials
    • C03C25/47Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0175Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0212Resin particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0242Shape of an individual particle
    • H05K2201/0245Flakes, flat particles or lamellar particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/029Woven fibrous reinforcement or textile
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/127Lubricants, e.g. during drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
IDW20001683A 1998-03-03 1999-02-25 GLASS-STRENGTH FIBER LAMINATION, ELECTRONIC CIRCUIT BOARD AND METHOD FOR PREPARATION OF A ROAD STRUCTURE ID26528A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3452598A 1998-03-03 1998-03-03
US13027098A 1998-08-06 1998-08-06
US17057898A 1998-10-13 1998-10-13

Publications (1)

Publication Number Publication Date
ID26528A true ID26528A (en) 2001-01-11

Family

ID=27364684

Family Applications (1)

Application Number Title Priority Date Filing Date
IDW20001683A ID26528A (en) 1998-03-03 1999-02-25 GLASS-STRENGTH FIBER LAMINATION, ELECTRONIC CIRCUIT BOARD AND METHOD FOR PREPARATION OF A ROAD STRUCTURE

Country Status (16)

Country Link
EP (1) EP1060144A1 (en)
JP (1) JP2002505216A (en)
KR (1) KR20010041518A (en)
CN (1) CN1291963A (en)
AU (1) AU2788999A (en)
BR (1) BR9908520A (en)
CA (1) CA2320746A1 (en)
HU (1) HUP0101382A3 (en)
ID (1) ID26528A (en)
IL (1) IL137977A0 (en)
MX (2) MXPA00008517A (en)
NO (1) NO20004272L (en)
PL (1) PL342654A1 (en)
TR (1) TR200002520T2 (en)
TW (1) TW436422B (en)
WO (1) WO1999044959A1 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6949289B1 (en) * 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6593255B1 (en) * 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
MXPA02001090A (en) * 1999-07-30 2003-07-21 Ppg Ind Ohio Inc Impregnated glass fiber strands and products including the same.
KR20020057947A (en) * 1999-07-30 2002-07-12 랜닝 지. 브라이어 Impregnated glass fiber strands and products including the same
MXPA01003660A (en) * 1999-07-30 2001-07-01 Impregnated glass fiber torones and products that include them
US20020051882A1 (en) * 2000-02-18 2002-05-02 Lawton Ernest L. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
AU2001252911A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068753A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068750A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001247564A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068751A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068749A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US20030150641A1 (en) * 2002-02-14 2003-08-14 Noyan Kinayman Multilayer package for a semiconductor device
US7553781B2 (en) * 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
US20050277721A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
JP5048307B2 (en) 2006-11-13 2012-10-17 信越石英株式会社 Composite fabric and printed wiring board
DE102009045892A1 (en) 2009-10-21 2011-04-28 Evonik Degussa Gmbh Polyarylene ether ketone film
KR101890915B1 (en) * 2012-07-04 2018-09-28 에스케이케미칼 주식회사 Polyarylene sulfide resin composition and formed article
CN103788583B (en) * 2014-01-13 2016-04-06 安徽省瑞发复合材料制造有限公司 A kind of artificial synthesis stone of high-temperature resistant and antistatic and manufacturing process thereof
FR3020361B1 (en) * 2014-04-28 2016-05-06 Saint Gobain METHOD FOR MANUFACTURING THIN GLASS
CN108349796A (en) * 2015-11-02 2018-07-31 中央硝子株式会社 The fiber glass packing of electromagnetic wave shielding coating metal, the manufacturing method of electromagnetic wave shielding coating metal fiber glass packing and electromagnetic wave shielding resin article
CN105517325B (en) * 2015-11-30 2018-07-24 卢美珍 The metal-clad structure of printed circuit board
CN105517322B (en) * 2015-11-30 2018-08-14 卢美珍 The fabric of printed circuit board covers the laminate structure of metal
CN105517323B (en) * 2015-11-30 2018-09-18 赣州市金顺科技有限公司 The laminated plate of the load conductor pattern of printed circuit board
CN105517324B (en) * 2015-11-30 2018-07-24 卢美珍 The metal-clad board structure of printed circuit board
CN105517321B (en) * 2015-11-30 2018-06-19 燕山大学里仁学院 The metal-clad board structure of electronic element packaging body
CN105517332B (en) * 2015-12-21 2019-02-19 广东生益科技股份有限公司 A kind of bonding sheet and preparation method thereof for Multi-layer force fit
CN111356723A (en) * 2017-08-07 2020-06-30 卓尔泰克公司 Polyvinyl alcohol-sized fillers for reinforcing plastics
CN110981223B (en) * 2019-12-18 2022-05-03 安徽省宁国昊成高温材料有限公司 High-temperature-resistant glass fiber and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
US5217778A (en) * 1982-10-21 1993-06-08 Raymark Industries, Inc. Composite fiber friction facing
DE3826522A1 (en) * 1988-08-04 1990-02-08 Teldix Gmbh PCB
JPH0818853B2 (en) * 1989-11-15 1996-02-28 日東紡績株式会社 Glass cloth manufacturing method
JP3520604B2 (en) * 1995-05-23 2004-04-19 日立化成工業株式会社 Composite laminate
US5773146A (en) * 1995-06-05 1998-06-30 Ppg Industries, Inc. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers

Also Published As

Publication number Publication date
AU2788999A (en) 1999-09-20
CA2320746A1 (en) 1999-09-10
KR20010041518A (en) 2001-05-25
EP1060144A1 (en) 2000-12-20
NO20004272L (en) 2000-11-01
MXPA00008517A (en) 2001-03-01
HUP0101382A2 (en) 2001-08-28
HUP0101382A3 (en) 2002-10-28
MXPA00008554A (en) 2001-03-01
PL342654A1 (en) 2001-07-02
NO20004272D0 (en) 2000-08-25
TW436422B (en) 2001-05-28
IL137977A0 (en) 2001-10-31
BR9908520A (en) 2000-10-24
JP2002505216A (en) 2002-02-19
CN1291963A (en) 2001-04-18
WO1999044959A1 (en) 1999-09-10
TR200002520T2 (en) 2001-01-22

Similar Documents

Publication Publication Date Title
ID26528A (en) GLASS-STRENGTH FIBER LAMINATION, ELECTRONIC CIRCUIT BOARD AND METHOD FOR PREPARATION OF A ROAD STRUCTURE
KR970706714A (en) PRINTED WIRING BOARD, METHOD OF PRODUCING THE SAME AND ELECTRONIC DEVICES
DE69936493D1 (en) Circuit board connection structure, electro-optical device, electronic device provided therewith, and electro-optical device manufacturing method
ID27676A (en) ELECTRONIC EQUIPMENT
DE69936483D1 (en) Laminated circuit board and manufacturing process
DE59911524D1 (en) ELECTRONIC COMMUNICATION SYSTEM
DE69941937D1 (en) Multilayer printed circuit board and manufacturing method therefor
ID24684A (en) ELECTRONIC CIRCUIT FOR SETTINGS OF TIME AND CIRCUITS OF DELAYERS
EP1199588A4 (en) Optoelectronic substrate, circuit board, and method of manufacturing optoelectronic substrate
SG86345A1 (en) Circuit board and method of manufacturing the same
DE69922480D1 (en) PORTABLE ELECTRONIC PLAYER, ENTERTAINMENT SYSTEM AND CORRESPONDING OPERATING METHOD
DE69814322D1 (en) Printed circuit board connector and manufacturing method therefor
ID21593A (en) ELECTRONIC RESISTANT ELECTRIC CIRCUIT CIRCUIT
DE69925880D1 (en) Connection method for printed circuit board
DE69801261T2 (en) Selective etching of silicate
IL155452A0 (en) System and method for fabricating printed circuit boards
DE69831652D1 (en) Serial bus acceleration circuit
DE60042313D1 (en) ENTERTAINMENT ELECTRONIC SYSTEM WITH LANGUAGE KNOWLEDGE
AU3156095A (en) High speed deadlock free bridge circuit
DE69935566D1 (en) Printed circuit board and method of making the same
AU7692701A (en) Single board web server system and method
GB9820932D0 (en) Circuit board and connection method
DE69728205D1 (en) Method of manufacturing connections in an integrated circuit
DE69819581D1 (en) Serial data transmission circuit
FI19992062A (en) Printed circuit board