PL342654A1 - Glass fibre reinforced laminates, printed circuit boards made of such laminates and glass fibre fabric used as their reinforcement - Google Patents

Glass fibre reinforced laminates, printed circuit boards made of such laminates and glass fibre fabric used as their reinforcement

Info

Publication number
PL342654A1
PL342654A1 PL99342654A PL34265499A PL342654A1 PL 342654 A1 PL342654 A1 PL 342654A1 PL 99342654 A PL99342654 A PL 99342654A PL 34265499 A PL34265499 A PL 34265499A PL 342654 A1 PL342654 A1 PL 342654A1
Authority
PL
Poland
Prior art keywords
glass fibre
laminates
reinforcement
printed circuit
circuit boards
Prior art date
Application number
PL99342654A
Inventor
Bruce E Novich
Xiang Wu
Original Assignee
Ppg Ind Ohio
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio filed Critical Ppg Ind Ohio
Publication of PL342654A1 publication Critical patent/PL342654A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/28—Macromolecular compounds or prepolymers obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/32—Macromolecular compounds or prepolymers obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/42—Coatings containing inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Composite Materials (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Woven Fabrics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laser Surgery Devices (AREA)
  • Surface Treatment Of Glass Fibres Or Filaments (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
PL99342654A 1998-03-03 1999-02-25 Glass fibre reinforced laminates, printed circuit boards made of such laminates and glass fibre fabric used as their reinforcement PL342654A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3452598A 1998-03-03 1998-03-03
US13027098A 1998-08-06 1998-08-06
US17057898A 1998-10-13 1998-10-13

Publications (1)

Publication Number Publication Date
PL342654A1 true PL342654A1 (en) 2001-07-02

Family

ID=27364684

Family Applications (1)

Application Number Title Priority Date Filing Date
PL99342654A PL342654A1 (en) 1998-03-03 1999-02-25 Glass fibre reinforced laminates, printed circuit boards made of such laminates and glass fibre fabric used as their reinforcement

Country Status (16)

Country Link
EP (1) EP1060144A1 (en)
JP (1) JP2002505216A (en)
KR (1) KR20010041518A (en)
CN (1) CN1291963A (en)
AU (1) AU2788999A (en)
BR (1) BR9908520A (en)
CA (1) CA2320746A1 (en)
HU (1) HUP0101382A3 (en)
ID (1) ID26528A (en)
IL (1) IL137977A0 (en)
MX (2) MXPA00008517A (en)
NO (1) NO20004272L (en)
PL (1) PL342654A1 (en)
TR (1) TR200002520T2 (en)
TW (1) TW436422B (en)
WO (1) WO1999044959A1 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6949289B1 (en) * 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6593255B1 (en) * 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
MXPA01003660A (en) * 1999-07-30 2001-07-01 Impregnated glass fiber torones and products that include them
MXPA02001090A (en) * 1999-07-30 2003-07-21 Ppg Ind Ohio Inc Impregnated glass fiber strands and products including the same.
CA2380975A1 (en) * 1999-07-30 2001-02-08 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US20020051882A1 (en) * 2000-02-18 2002-05-02 Lawton Ernest L. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
AU2001249257A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068749A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252916A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252911A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068750A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068755A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US20030150641A1 (en) * 2002-02-14 2003-08-14 Noyan Kinayman Multilayer package for a semiconductor device
US20050277721A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
US7553781B2 (en) * 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
JP5048307B2 (en) 2006-11-13 2012-10-17 信越石英株式会社 Composite fabric and printed wiring board
DE102009045892A1 (en) * 2009-10-21 2011-04-28 Evonik Degussa Gmbh Polyarylene ether ketone film
KR101890915B1 (en) * 2012-07-04 2018-09-28 에스케이케미칼 주식회사 Polyarylene sulfide resin composition and formed article
CN103788583B (en) * 2014-01-13 2016-04-06 安徽省瑞发复合材料制造有限公司 A kind of artificial synthesis stone of high-temperature resistant and antistatic and manufacturing process thereof
FR3020361B1 (en) * 2014-04-28 2016-05-06 Saint Gobain METHOD FOR MANUFACTURING THIN GLASS
WO2017077980A1 (en) * 2015-11-02 2017-05-11 セントラル硝子株式会社 Electromagnetic shielding metal-coated glass fiber filler, method for manufacturing electromagnetic shielding metal-coated glass fiber filler, and electromagnetic shielding resin article
CN105517324B (en) * 2015-11-30 2018-07-24 卢美珍 The metal-clad board structure of printed circuit board
CN105517323B (en) * 2015-11-30 2018-09-18 赣州市金顺科技有限公司 The laminated plate of the load conductor pattern of printed circuit board
CN105517322B (en) * 2015-11-30 2018-08-14 卢美珍 The fabric of printed circuit board covers the laminate structure of metal
CN105517321B (en) * 2015-11-30 2018-06-19 燕山大学里仁学院 The metal-clad board structure of electronic element packaging body
CN105517325B (en) * 2015-11-30 2018-07-24 卢美珍 The metal-clad structure of printed circuit board
CN105517332B (en) * 2015-12-21 2019-02-19 广东生益科技股份有限公司 A kind of bonding sheet and preparation method thereof for Multi-layer force fit
EP3665213A2 (en) * 2017-08-07 2020-06-17 Zoltek Corporation Polyvinyl alcohol-sized fillers for reinforcing plastics
CN110981223B (en) * 2019-12-18 2022-05-03 安徽省宁国昊成高温材料有限公司 High-temperature-resistant glass fiber and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
US5217778A (en) * 1982-10-21 1993-06-08 Raymark Industries, Inc. Composite fiber friction facing
DE3826522A1 (en) * 1988-08-04 1990-02-08 Teldix Gmbh PCB
JPH0818853B2 (en) * 1989-11-15 1996-02-28 日東紡績株式会社 Glass cloth manufacturing method
JP3520604B2 (en) * 1995-05-23 2004-04-19 日立化成工業株式会社 Composite laminate
US5773146A (en) * 1995-06-05 1998-06-30 Ppg Industries, Inc. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers

Also Published As

Publication number Publication date
HUP0101382A2 (en) 2001-08-28
TW436422B (en) 2001-05-28
ID26528A (en) 2001-01-11
IL137977A0 (en) 2001-10-31
AU2788999A (en) 1999-09-20
CN1291963A (en) 2001-04-18
JP2002505216A (en) 2002-02-19
CA2320746A1 (en) 1999-09-10
HUP0101382A3 (en) 2002-10-28
BR9908520A (en) 2000-10-24
MXPA00008554A (en) 2001-03-01
TR200002520T2 (en) 2001-01-22
EP1060144A1 (en) 2000-12-20
WO1999044959A1 (en) 1999-09-10
MXPA00008517A (en) 2001-03-01
NO20004272D0 (en) 2000-08-25
KR20010041518A (en) 2001-05-25
NO20004272L (en) 2000-11-01

Similar Documents

Publication Publication Date Title
PL342654A1 (en) Glass fibre reinforced laminates, printed circuit boards made of such laminates and glass fibre fabric used as their reinforcement
AU6391499A (en) Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
GB2340959B (en) Multi layered optoelectronic circuit board
DE60043404D1 (en) Printed wiring material and method of making printed circuit boards using the same
AU2001284499A1 (en) Photosensitive composition, cured article thereof, and printed circuit board using the same
IL142354A0 (en) Multi-layer printed circuit board fabrication system and method
SG101924A1 (en) Composite material used in making printed wiring boards
AU4946897A (en) Laminates for printed circuits using unidirectional glass fabric
HK1050034A1 (en) Glass cloth and printed wiring board
EP0768313A3 (en) A surface treating agent for glass fiber substrates
EP0675673A3 (en) Reinforcement for flexible printed circuit board and reinforced flexible circuit board.
SG50438A1 (en) Composite board
FR2744323B1 (en) SOFT PRINTED CIRCUIT BOARD
NO970390D0 (en) Polymer-glass fiber composite laminates
GB2337862B (en) Printed circuit board
ZA945883B (en) Composite board
PL343028A1 (en) Base webs for printed circuit board production using the foam process and aramid fibers
DE69917688D1 (en) Flame retardant epoxy resin for printed circuit boards, as well as this uses prepreg and metal foil laminate
HU0002227D0 (en) Circuit board at least with one electronic construction member and method for connecting the construction member to the circuit board
GB9928257D0 (en) Improvements in or relating to circuit boards
GB9017182D0 (en) Double-sided composite printed circuit board
FR2723500B1 (en) ELECTRONIC PRINTED CIRCUIT BOARD.
GB2280547B (en) Printed circuit board with integral strip-line structure
GB2336566B (en) Spirally reinforced board
KR950016073U (en) Structure of Fiberglass Fabric for Printed Circuit Board Manufacturing