AU6391499A - Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric - Google Patents

Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric

Info

Publication number
AU6391499A
AU6391499A AU63914/99A AU6391499A AU6391499A AU 6391499 A AU6391499 A AU 6391499A AU 63914/99 A AU63914/99 A AU 63914/99A AU 6391499 A AU6391499 A AU 6391499A AU 6391499 A AU6391499 A AU 6391499A
Authority
AU
Australia
Prior art keywords
laminates
fabric
assembling
methods
glass fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU63914/99A
Inventor
Kami Lammon-Hilinski
Ernest L. Lawton
Bruce E. Novich
Walter J. Robertson
Vedagiri Velpari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPG Industries Ohio Inc
Original Assignee
PPG Industries Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PPG Industries Ohio Inc filed Critical PPG Industries Ohio Inc
Publication of AU6391499A publication Critical patent/AU6391499A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Composite Materials (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Laminated Bodies (AREA)
  • Woven Fabrics (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
AU63914/99A 1998-10-13 1999-10-08 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric Abandoned AU6391499A (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US17057898A 1998-10-13 1998-10-13
US09170578 1998-10-13
US13307599P 1999-05-07 1999-05-07
US13307699P 1999-05-07 1999-05-07
US60133075 1999-05-07
US60133076 1999-05-07
US14633799P 1999-07-30 1999-07-30
US60146337 1999-07-30
PCT/US1999/021443 WO2000021900A1 (en) 1998-10-13 1999-10-08 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric

Publications (1)

Publication Number Publication Date
AU6391499A true AU6391499A (en) 2000-05-01

Family

ID=27495008

Family Applications (1)

Application Number Title Priority Date Filing Date
AU63914/99A Abandoned AU6391499A (en) 1998-10-13 1999-10-08 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric

Country Status (7)

Country Link
EP (1) EP1124770A1 (en)
JP (1) JP2002527538A (en)
CN (2) CN100488906C (en)
AU (1) AU6391499A (en)
CA (1) CA2346111A1 (en)
MX (1) MXPA01003656A (en)
WO (1) WO2000021900A1 (en)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6593255B1 (en) * 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6949289B1 (en) * 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
CN100366563C (en) * 1999-07-30 2008-02-06 匹兹堡玻璃板工业俄亥俄股份有限公司 Impregnated glass fibre strands and products including same
MXPA01003660A (en) * 1999-07-30 2001-07-01 Impregnated glass fiber torones and products that include them
JP2004500488A (en) * 1999-07-30 2004-01-08 ピーピージー　インダストリーズ　オハイオ，　インコーポレイテッド Impregnated fiberglass strands and products containing such strands
US20020051882A1 (en) * 2000-02-18 2002-05-02 Lawton Ernest L. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
AU2001247491A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068751A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001252911A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
AU2001247564A1 (en) * 2000-03-16 2001-09-24 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068753A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2001068750A1 (en) * 2000-03-16 2001-09-20 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
FR2811662B1 (en) 2000-07-13 2003-07-18 Saint Gobain Isover THERMAL / PHONIC INSULATION PRODUCT BASED ON MINERAL WOOL
US20040052997A1 (en) * 2002-09-17 2004-03-18 Ietsugu Santo Composite pressure container or tubular body and composite intermediate
JP4996086B2 (en) * 2005-09-29 2012-08-08 株式会社東芝 Mica tape and rotating electric coil using this mica tape
JP4476226B2 (en) * 2006-02-24 2010-06-09 三洋電機株式会社 Circuit board and circuit board manufacturing method
EP2201079B1 (en) * 2007-09-14 2017-08-23 Henkel AG & Co. KGaA Thermally conductive composition
JP5181221B2 (en) * 2008-01-15 2013-04-10 日立化成株式会社 Low thermal expansion low dielectric loss prepreg and its application
EP2163570A1 (en) * 2008-09-10 2010-03-17 Rohm and Haas France SA Urethane Arcrylic Blends
TWI560223B (en) 2009-12-25 2016-12-01 Hitachi Chemical Co Ltd Thermal curable resin composition, fabricating method of resin composition varnish, perpreg and laminated board
CN102548222A (en) * 2010-12-30 2012-07-04 北大方正集团有限公司 Method and device for manufacturing circuit board and circuit board
AT511501A1 (en) * 2011-06-09 2012-12-15 Helfenberger Immobilien Llc & Co Textilforschungs Und Entwicklungs Kg TEXTILE SURFACE
KR101420525B1 (en) 2012-11-23 2014-07-16 삼성전기주식회사 Multilayer inductor and method for preparing thereof
KR20150046609A (en) * 2013-10-22 2015-04-30 삼성전기주식회사 Insulating substrate for printed circuit board and printed circuit board
CN103613909B (en) * 2013-11-22 2016-06-29 哈尔滨工业大学 Glass fiber compound material motor retaining ring
JP2018058938A (en) * 2016-10-03 2018-04-12 学校法人金沢工業大学 Composite material and method for producing composite material
FR3071891B1 (en) * 2017-09-29 2021-04-23 Valeo Materiaux De Friction AQUEOUS IMPREGNATION CEMENT
CN108102125A (en) * 2017-12-25 2018-06-01 广东生益科技股份有限公司 prepreg, laminate and printed circuit board
JP7234922B2 (en) * 2018-03-30 2023-03-08 東レ株式会社 nonwoven sheet
US20210402719A1 (en) * 2018-11-13 2021-12-30 J&P Coats Limited Vehicle component based on selective commingled fiber bundle having integral electrical harness and embedded electronics
TWI718907B (en) * 2020-03-18 2021-02-11 易華電子股份有限公司 Underboarding for laser boring of a printed circuit board
JP7131732B2 (en) * 2020-05-22 2022-09-06 日東紡績株式会社 Surface colored glass cloth and fiber reinforced resin molded products
CN114059349B (en) * 2021-11-23 2022-09-06 中国科学院合肥物质科学研究院 Surface modification method for glass fiber tape, glass fiber tape and application thereof
CN114315172B (en) * 2021-12-30 2024-04-16 中国建筑材料科学研究总院有限公司 Impregnating compound, preparation method and application thereof, aluminized glass fiber, preparation method and application thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
US5217778A (en) * 1982-10-21 1993-06-08 Raymark Industries, Inc. Composite fiber friction facing
US4542106A (en) * 1983-12-19 1985-09-17 Ppg Industries, Inc. Fiber glass composition
DE3826522A1 (en) * 1988-08-04 1990-02-08 Teldix Gmbh PCB
JPH0818853B2 (en) * 1989-11-15 1996-02-28 日東紡績株式会社 Glass cloth manufacturing method
JP2993065B2 (en) * 1990-07-27 1999-12-20 三菱瓦斯化学株式会社 Metal foil-clad laminate with smooth surface
CA2060709C (en) * 1991-02-08 1996-06-04 Kiyotaka Komori Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material
JP3116341B2 (en) * 1995-04-26 2000-12-11 新神戸電機株式会社 Glass woven fabric for laminates and laminate substrates, and methods of using laminates
JP3520604B2 (en) * 1995-05-23 2004-04-19 日立化成工業株式会社 Composite laminate
US5773146A (en) * 1995-06-05 1998-06-30 Ppg Industries, Inc. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
US6187852B1 (en) * 1996-03-22 2001-02-13 Isola Laminate Systems Corp. Fillers for improved epoxy laminates

Also Published As

Publication number Publication date
EP1124770A1 (en) 2001-08-22
CN101117275B (en) 2012-10-24
CN101117275A (en) 2008-02-06
MXPA01003656A (en) 2001-07-01
JP2002527538A (en) 2002-08-27
CN1332704A (en) 2002-01-23
CN100488906C (en) 2009-05-20
CA2346111A1 (en) 2000-04-20
WO2000021900A1 (en) 2000-04-20

Similar Documents

Publication Publication Date Title
AU6391499A (en) Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
HUP0101382A3 (en) Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric
AU1926900A (en) Printed circuit boards with integrated passive components and method for making same
AU6483199A (en) Electronic circuit board
EP1307075A3 (en) Prepreg and circuit board and method for manufacturing the same
AU2003211704A1 (en) Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof
AU2003260274A1 (en) Printed circuit board and method for producing the same
HUP0200426A2 (en) Method for manufacturing a multilayer printed circuit board and composite foil for use therein
AU2002214241A1 (en) Multi-layer printed circuit board fabrication system and method
EP0621746A3 (en) Composite printed circuit board and manufacturing method thereof.
AU2003235219A1 (en) Flexible printed circuit board and process for producing the same
AU2002215173A1 (en) System and method for fabricating printed circuit boards
EP1229769A4 (en) Carrier-foiled copper foil circuit, printed circuit board manufacturing method using the circuit, and printed circuit board
AU2074001A (en) Electronics circuit board assembly apparatus and method
SG74116A1 (en) Composite copper foil process for preparing the same and copper-clad laminate and printed wiring board using the same
AU9450298A (en) Printed circuit boards
HK1066321A1 (en) Printed circuit boards with plated resistors and process for the manufacturing the same
EP0751700A3 (en) Copper-clad laminate, process for producing the same, printed wiring board, and process for producing the same
SG85102A1 (en) Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same
AU2001290429A1 (en) An arrangement mounted on a printed circuit board and method of producing such an arrangement
EP1094692A3 (en) Printed circuit board and manufacturing process thereof
AU3690000A (en) Printed circuit boards with solid interconnect and method of producing the same
HK1027431A1 (en) Laminated electronic parts
AU3926200A (en) Method for making segmented through holes in printed circuit boards
HU0002227D0 (en) Circuit board at least with one electronic construction member and method for connecting the construction member to the circuit board

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase