TWI718907B - Underboarding for laser boring of a printed circuit board - Google Patents
Underboarding for laser boring of a printed circuit board Download PDFInfo
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- TWI718907B TWI718907B TW109109019A TW109109019A TWI718907B TW I718907 B TWI718907 B TW I718907B TW 109109019 A TW109109019 A TW 109109019A TW 109109019 A TW109109019 A TW 109109019A TW I718907 B TWI718907 B TW I718907B
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Abstract
Description
本發明係關於一種加工治具,尤其是一種輔助定位及防止碎屑沾黏的用於印刷電路板雷射鑽孔之墊板。 The invention relates to a processing jig, in particular to a backing plate used for laser drilling of printed circuit boards that assists in positioning and prevents debris from sticking.
請參照第1圖所示,係一種習知的印刷電路板雷射鑽孔製程,係以雷射鑽孔機將捲帶式印刷電路板F做加工處理,製程內容係將整捲的印刷電路板F逐步展開並拉至定位,並將該印刷電路板F上的目標區塊固定於一加工平台P上,使一雷射鑽頭D可以對該印刷電路板F鑽設指定的數個孔洞,各該孔洞係用於導通各層間的電路或用於焊接電子零件。 Please refer to Figure 1, which is a conventional printed circuit board laser drilling process. The tape-and-reel printed circuit board F is processed by a laser drilling machine. The content of the process is to process the entire roll of printed circuit The board F is gradually unfolded and pulled to position, and the target block on the printed circuit board F is fixed on a processing platform P, so that a laser drill D can drill a number of designated holes on the printed circuit board F, Each of the holes is used for conducting circuits between layers or for welding electronic parts.
上述的印刷電路板F係由一種可撓性材料作為基板,該基板的兩面具有金屬材料,該可撓性材料可以是聚醯亞胺(Polyimide,PI),且該金屬材料可以是銅、錫或其合金,係依據導電性及可焊性選擇使用該金屬材料,由於習知印刷電路板雷射鑽孔製程係以瞬間高密度能量的雷射對該印刷電路板F鑽孔,使上述的聚合物層及金屬層在高溫下形成孔洞,同時產生熔渣及碳化物等雜質,而雜質異物容易殘留於孔洞通道內,或反彈沾黏於洞口周圍的基板表面,係導致後續處理困難及增加製程成本等問題。 The above-mentioned printed circuit board F is made of a flexible material as a substrate. The substrate has a metal material on both sides. The flexible material can be Polyimide (PI), and the metal material can be copper or tin. Or its alloy, the metal material is selected based on its conductivity and solderability. Because the conventional printed circuit board laser drilling process uses an instant high-density laser to drill the printed circuit board F, the above-mentioned The polymer layer and the metal layer form holes at high temperatures, and at the same time produce impurities such as slag and carbides. The impurities are likely to remain in the hole channels, or rebound and stick to the substrate surface around the hole, which causes difficulty and increase in subsequent processing. Process cost and other issues.
有鑑於此,習知的印刷電路板雷射鑽孔製程確實仍有加以改善之必要。 In view of this, the conventional laser drilling process for printed circuit boards does still have to be improved.
為解決上述問題,本發明的目的是提供一種用於印刷電路板雷射鑽孔之墊板,可以避免鑽孔異物殘留於印刷電路板。 In order to solve the above-mentioned problems, the purpose of the present invention is to provide a backing plate for laser drilling of printed circuit boards, which can prevent drilling foreign bodies from remaining on the printed circuit board.
本發明的次一目的是提供一種用於印刷電路板雷射鑽孔之墊板,可以固定印刷電路板以輔助鑽孔對位。 The second objective of the present invention is to provide a backing plate for laser drilling of printed circuit boards, which can fix the printed circuit board to assist drilling alignment.
本發明的又一目的是提供一種用於印刷電路板雷射鑽孔之墊板,將軟性電路板平整展開以方便進行加工處理。 Another object of the present invention is to provide a backing plate for laser drilling of printed circuit boards, which flatly unfolds the flexible circuit board to facilitate processing.
本發明的再一目的是提供一種用於印刷電路板雷射鑽孔之墊板,可以雙面運用而提升作業效率及節省耗材。 Another object of the present invention is to provide a backing plate for laser drilling of printed circuit boards, which can be used on both sides to improve work efficiency and save consumables.
本發明全文所述方向性或其近似用語,例如「上(頂)」、「下(底)」、「內」、「外」、「表面」等,主要係參考附加圖式的方向,各方向性或其近似用語僅用以輔助說明及理解本發明的各實施例,非用以限制本發明。 The directionality described in the full text of the present invention or its similar terms, such as "upper (top)", "lower (bottom)", "inner", "outer", "surface", etc., mainly refer to the directions of the attached drawings, each Directionality or similar terms are only used to assist in describing and understanding the embodiments of the present invention, and are not used to limit the present invention.
本發明全文所記載的元件及構件使用「一」或「一個」之量詞,僅是為了方便使用且提供本發明範圍的通常意義;於本發明中應被解讀為包括一個或至少一個,且單一的概念也包括複數的情況,除非其明顯意指其他意思。 The elements and components described in the full text of the present invention use the quantifiers "one" or "one" for convenience and to provide the general meaning of the scope of the present invention; in the present invention, it should be construed as including one or at least one, and single The concept of also includes the plural, unless it clearly implies other meanings.
本發明的用於印刷電路板雷射鑽孔之墊板,包含:一底板,貼合於一印刷電路板之待加工區域,該印刷電路板具有數個導通孔;數個加工孔,該數個加工孔為盲孔,該數個加工孔在該底板的上下兩面且對應各該導通孔;及數個真空孔,係貫通該底板之上下表面的通孔。 The backing plate for laser drilling of a printed circuit board of the present invention includes: a bottom plate attached to an area to be processed of a printed circuit board, the printed circuit board having a plurality of through holes; a plurality of processing holes, the number The processing holes are blind holes, and the processing holes are on the upper and lower surfaces of the bottom plate and correspond to the through holes; and the plurality of vacuum holes are through holes that penetrate the upper and lower surfaces of the bottom plate.
據此,本發明的用於印刷電路板雷射鑽孔之墊板,藉由將該數個加工孔對準待加工的該數個導通孔,使鑽孔過程中所產生的各種異物可以進入至該數個加工孔之孔道,且該數個加工孔之深度可以避免異物反彈而沾 黏於該印刷電路板,又,藉由該數個真空孔密合於該印刷電路板,可以將該印刷電路板以真空吸附固定於該底板,係可以提升鑽孔位置準確度,該底板可以在翻面後繼續鑽孔,係具有提升作業效率及節省耗材的功效。 Accordingly, in the backing plate for laser drilling of printed circuit boards of the present invention, by aligning the plurality of processing holes with the plurality of through holes to be processed, various foreign objects generated during the drilling process can enter To the channels of the several processing holes, and the depth of the several processing holes can prevent foreign matter from rebounding and staining The printed circuit board is adhered to the printed circuit board, and the plurality of vacuum holes are closely attached to the printed circuit board, the printed circuit board can be fixed to the bottom plate by vacuum suction, which can improve the accuracy of the drilling position, and the bottom plate can Continue drilling after turning over, which has the effect of improving work efficiency and saving consumables.
其中,該底板之寬度大於該印刷電路板之寬度。如此,該底板可以完整支撐該印刷電路板且真空吸附該印刷電路板的加工區域,係具有操作便利及輔助定位的功效。 Wherein, the width of the bottom plate is greater than the width of the printed circuit board. In this way, the bottom plate can completely support the printed circuit board and vacuum-adsorb the processing area of the printed circuit board, which has the functions of convenient operation and auxiliary positioning.
其中,各該加工孔的徑寬大於各該導通孔的徑寬,各該導通孔對準各該加工孔的中心,各該加工孔的徑寬是50微米~100微米,各該導通孔的徑寬是20微米~25微米。如此,該加工孔可以完整容納由該導通孔掉落的異物,係具有避免異物殘留於該印刷電路板的功效。 Wherein, the diameter width of each processing hole is greater than the diameter width of each via hole, each via hole is aligned with the center of each processing hole, the diameter width of each processing hole is 50 microns to 100 microns, and the diameter of each via hole The diameter is 20 microns to 25 microns. In this way, the processing hole can completely contain the foreign matter dropped from the through hole, and has the effect of avoiding the foreign matter remaining on the printed circuit board.
其中,當相鄰之二該加工孔中心之間的距離小於90微米時,該二加工孔合併形成單一個凹槽。如此,距離相近之導通孔可以共用加工孔凹槽,係具有確保加工孔的容納空間及減少凹槽數量的功效。 Wherein, when the distance between the centers of two adjacent processing holes is less than 90 microns, the two processing holes merge to form a single groove. In this way, the via holes with similar distances can share the machining hole groove, which has the effect of ensuring the accommodating space of the machining hole and reducing the number of grooves.
其中,當相鄰之二該加工孔中心之間的距離大於或等於90微米時,該二加工孔之間具有一間隙,該間隙大於或等於40微米。如此,數個加工孔之間的分隔區域係具有充足的寬度,係具有保持該底板的結構強度以支撐該印刷電路板的功效。 Wherein, when the distance between the centers of two adjacent processing holes is greater than or equal to 90 microns, there is a gap between the two processing holes, and the gap is greater than or equal to 40 microns. In this way, the separation area between the plurality of processing holes has a sufficient width, and has the effect of maintaining the structural strength of the bottom plate to support the printed circuit board.
其中,該數個真空孔與該數個加工孔及該數個導通孔不重疊。如此,係可以避免異物掉入抽氣孔及影響真空吸附,係具有穩定吸附以固定印刷電路板的功效。 Wherein, the plurality of vacuum holes do not overlap with the plurality of processing holes and the plurality of via holes. In this way, it is possible to prevent foreign matter from falling into the suction hole and affecting the vacuum adsorption, and has the effect of stable adsorption to fix the printed circuit board.
其中,各該真空孔的徑寬是0.5毫米~1.2毫米。如此,該真空孔的大小可以依據因刷電路板作調整,係具有限制孔洞面積比例以保持該底板平整度的功效。 Wherein, the diameter and width of each vacuum hole is 0.5 mm to 1.2 mm. In this way, the size of the vacuum hole can be adjusted according to the brushing of the circuit board, which has the effect of limiting the ratio of the hole area to maintain the flatness of the bottom plate.
其中,該底板具有一玻璃纖維板及位於該玻璃纖維板表面的一 銅膜,在該數個加工孔範圍內的該玻璃纖維板表面未覆蓋該銅膜。如此,各該加工孔以該玻璃纖維板為凹槽底,及該銅膜為凹槽內周面,係具有快速設置加工孔及提升加工孔與導通孔的對位精確度的功效。 Wherein, the bottom plate has a glass fiber board and a glass fiber board located on the surface of the glass fiber board. The copper film is not covered with the copper film on the surface of the glass fiber board in the range of the plurality of processing holes. In this way, each processing hole has the glass fiber board as the groove bottom and the copper film as the groove inner peripheral surface, which has the effect of quickly setting the processing hole and improving the alignment accuracy of the processing hole and the via hole.
其中,該玻璃纖維板之板厚為1.2毫米~2毫米,及該銅膜之膜厚為25微米~35微米。如此,由該玻璃纖維板提供該底板的機械強度,且加工孔的深度可以由銅膜之膜厚調整,係具有設置加工凹槽及支撐該底板維持平整的功效。 Wherein, the thickness of the glass fiber board is 1.2 mm to 2 mm, and the film thickness of the copper film is 25 μm to 35 μm. In this way, the glass fiber board provides the mechanical strength of the bottom plate, and the depth of the processing hole can be adjusted by the film thickness of the copper film, which has the functions of arranging processing grooves and supporting the bottom plate to maintain flatness.
1:底板 1: bottom plate
2:加工孔 2: Machining hole
3:真空孔 3: Vacuum hole
F:印刷電路板 F: Printed circuit board
P:加工平台 P: Processing platform
D:雷射鑽頭 D: Laser drill
T:導通孔 T: Via
S:間隙 S: gap
N1:板厚 N1: Board thickness
N2:膜厚 N2: Film thickness
〔第1圖〕本發明用於雷射鑽孔機的使用情形圖。 [Figure 1] The present invention is used in a laser drilling machine.
〔第2圖〕本發明較佳實施例覆蓋印刷電路板的上視圖。 [Figure 2] A top view of the preferred embodiment of the present invention covering a printed circuit board.
〔第3圖〕如第2圖所示A區塊的局部構造放大圖。 [Figure 3] An enlarged view of the partial structure of Block A shown in Figure 2.
〔第4圖〕本發明較佳實施例的剖面圖。 [Figure 4] A cross-sectional view of a preferred embodiment of the present invention.
為讓本發明之上述及其他目的、特徵及優點能更明顯易懂,下文特舉本發明之較佳實施例,並配合所附圖式,作詳細說明如下:請參照第1及2圖所示,其係本發明用於印刷電路板雷射鑽孔之墊板的較佳實施例,係包含一底板1、數個加工孔2及數個真空孔3,該數個加工孔2及該數個真空孔3位於該底板1,一印刷電路板F展開並定位於該底板1上,該印刷電路板F覆蓋該數個加工孔2及該數個真空孔3。
In order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the preferred embodiments of the present invention are described below in detail with the accompanying drawings: please refer to Figures 1 and 2 It is shown that it is a preferred embodiment of the backing plate for laser drilling of printed circuit boards of the present invention. It includes a
該底板1係固定於一雷射鑽孔機之加工平台P,並藉由該雷射鑽孔機之滾筒將捲帶式的該印刷電路板F展開並輸送至該加工平台P,使該
印刷電路板F之待加工區域貼合於該底板1,該底板1之寬度較佳大於該印刷電路板F之寬度,該底板1的材料可以是玻璃纖維,係具有高絕緣性、耐高溫及平整度良好等特性,使該底板1能夠承受雷射加工的高溫且適合用於支撐該印刷電路板F。
The
請參照第2及3圖所示,該印刷電路板F係具有數個導通孔T,該數個加工孔2的分佈位置係對應該印刷電路板F之該數個導通孔T,且各該加工孔2的開口朝向該印刷電路板F,又,各該加工孔2的徑寬較佳大於各該導通孔T的徑寬,較佳使該印刷電路板F到達加工定位時,各該導通孔T對準各該加工孔2的中心,如此,在該數個導通孔T的鑽孔過程中,所產生的碎屑可以自然掉落該數個加工孔2所形成的凹槽內,具有避免異物殘留於該印刷電路板F的作用。
Please refer to Figures 2 and 3, the printed circuit board F has a plurality of through holes T, the distribution positions of the plurality of
另外,各該加工孔2的徑寬可以是50微米~100微米,各該導通孔T的徑寬可以是20微米~25微米,當相鄰之二該加工孔2中心之間的距離小於90微米時,該二加工孔2可以合併為同一個凹槽,如第3圖所示,連續數個鄰近的該加工孔2可以形成單一長條形的凹槽,又,當相鄰之二該加工孔2中心之間的距離大於或等於90微米時,該二加工孔2之間可以具有一間隙S,且該間隙S較佳大於或等於40微米,如此,由該數個加工孔2所形成的數個凹槽之間的分隔區域具有足夠的寬度可以提供支撐力,當該印刷電路板F貼合於該底板1並覆蓋該數個加工孔2時,該底板1可以維持該印刷電路板F的平整度。
In addition, the diameter width of each
請參照第4圖所示,各該加工孔2可以是通孔或盲孔,本案不以此為限,在本實施例中該數個加工孔2係盲孔且分別設置於該底板1的上下兩面,而在對應各該導通孔T的位置分別形成開口朝上及朝下的兩個凹槽,如此,當長時間的鑽孔作業導致位於同一面的該數個加工孔2變形或填
滿異物時,係可以將該底板1翻面後繼續鑽孔作業,具有節省耗材的作用。
Please refer to Figure 4, each of the
又,該底板1可以是複合板材,係由一玻璃纖維板及位於該玻璃纖維板表面的一銅膜所組成,該玻璃纖維板具有一板厚N1,及該銅膜具有一膜厚N2,該板厚N1較佳為1.2毫米~2毫米,該膜厚N2較佳為25微米~35微米,該底板1可以透過顯影、蝕刻等製程在指定位置去除該銅膜使該部位的玻璃纖維板裸露,而形成該數個加工孔2,使各該加工孔2以該玻璃纖維板為凹槽底,及該銅膜為凹槽內周面,各該加工孔2的深度係該膜厚N2,如此,本發明之墊板可以與對應之印刷電路板以相同製程製作,係能夠快速製備且提升各該加工孔2與各該導通孔T的對位精確度。
In addition, the
請參照第3及4圖所示,該數個真空孔3的分佈位置係對應該雷射鑽孔機的抽氣吸附孔,各該真空孔的徑寬可以是0.5毫米~1.2毫米,該數個真空孔3較佳不重疊於該數個加工孔2及該數個導通孔T,各該真空孔3係貫通該底板1之上下表面的通孔,使各該真空孔3的下開口可以對準該雷射鑽孔機的抽氣吸附孔,及各該真空孔3的上開口朝向該印刷電路板F並密合於該印刷電路板F的平整部位,如此,該抽氣吸附孔可以透過該數個真空孔3抽取該底板1與該印刷電路板F之間的空氣,使該印刷電路板F可以藉由大氣壓力緊密貼合及固定於該底板1,具有避免鑽孔位置偏移的作用。
Please refer to Figures 3 and 4, the positions of the vacuum holes 3 correspond to the suction holes of the laser drilling machine. The diameter and width of each vacuum hole can be 0.5 mm ~ 1.2 mm. Preferably, the vacuum holes 3 do not overlap the plurality of
本發明之該數個加工孔2及該數個真空孔3在該底板1上的分佈位置,係配合待加工印刷電路板F的線路區域,因此,本發明之墊板係專門依據不同印刷電路板F的各種圖案製造及使用,當該印刷電路板F透過該數個真空孔3固定於該底板1時,該底板1可以用於支撐及攤平該軟性捲帶式的印刷電路板F,而該印刷電路板F的鑽孔作業可以準確地在該數個加工孔2上進行。
The distribution positions of the processing holes 2 and the vacuum holes 3 on the
綜上所述,本發明的用於印刷電路板雷射鑽孔之墊板,藉由將 該數個加工孔對準待加工的該數個導通孔,使鑽孔過程中所產生的各種異物可以進入至該數個加工孔之孔道,且該數個加工孔之深度可以避免異物反彈而沾黏於該印刷電路板,又,藉由該數個真空孔密合於該印刷電路板,可以將該印刷電路板以真空吸附固定於該底板,係可以提升鑽孔位置準確度。 In summary, the backing plate for laser drilling of printed circuit boards of the present invention, by combining The plurality of processing holes are aligned with the plurality of through holes to be processed, so that various foreign objects generated during the drilling process can enter the channels of the plurality of processing holes, and the depth of the plurality of processing holes can prevent the foreign objects from rebounding. The printed circuit board is adhered to the printed circuit board, and the plurality of vacuum holes are closely attached to the printed circuit board, and the printed circuit board can be fixed to the bottom plate by vacuum suction, which can improve the accuracy of the drilling position.
雖然本發明已利用上述較佳實施例揭示,然其並非用以限定本發明,任何熟習此技藝者在不脫離本發明之精神和範圍之內,相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed using the above-mentioned preferred embodiments, it is not intended to limit the present invention. Anyone who is familiar with the art without departing from the spirit and scope of the present invention may make various changes and modifications relative to the above-mentioned embodiments. The technical scope of the invention is protected. Therefore, the scope of protection of the invention shall be subject to the scope of the attached patent application.
1:底板 1: bottom plate
2:加工孔 2: Machining hole
3:真空孔 3: Vacuum hole
T:導通孔 T: Via
S:間隙 S: gap
Claims (9)
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TW109109019A TWI718907B (en) | 2020-03-18 | 2020-03-18 | Underboarding for laser boring of a printed circuit board |
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TW109109019A TWI718907B (en) | 2020-03-18 | 2020-03-18 | Underboarding for laser boring of a printed circuit board |
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TW202137834A TW202137834A (en) | 2021-10-01 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101117275A (en) * | 1998-10-13 | 2008-02-06 | Ppg工业俄亥俄公司 | Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric |
CN101951734A (en) * | 2010-09-30 | 2011-01-19 | 深圳市大族激光科技股份有限公司 | Method for processing micro through hole of flexible circuit board |
TWM407585U (en) * | 2011-01-03 | 2011-07-11 | Career Technology Mfg Co Ltd | Circuit board fixture of printing |
WO2017208912A1 (en) * | 2016-05-31 | 2017-12-07 | 三菱瓦斯化学株式会社 | Entry sheet for drilling and drilling method using same |
-
2020
- 2020-03-18 TW TW109109019A patent/TWI718907B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101117275A (en) * | 1998-10-13 | 2008-02-06 | Ppg工业俄亥俄公司 | Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric |
CN101951734A (en) * | 2010-09-30 | 2011-01-19 | 深圳市大族激光科技股份有限公司 | Method for processing micro through hole of flexible circuit board |
TWM407585U (en) * | 2011-01-03 | 2011-07-11 | Career Technology Mfg Co Ltd | Circuit board fixture of printing |
WO2017208912A1 (en) * | 2016-05-31 | 2017-12-07 | 三菱瓦斯化学株式会社 | Entry sheet for drilling and drilling method using same |
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