GB2280547B - Printed circuit board with integral strip-line structure - Google Patents

Printed circuit board with integral strip-line structure

Info

Publication number
GB2280547B
GB2280547B GB9313751A GB9313751A GB2280547B GB 2280547 B GB2280547 B GB 2280547B GB 9313751 A GB9313751 A GB 9313751A GB 9313751 A GB9313751 A GB 9313751A GB 2280547 B GB2280547 B GB 2280547B
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
line structure
integral strip
integral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9313751A
Other versions
GB2280547A (en
GB9313751D0 (en
Inventor
David William Bowman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quantel Ltd
Original Assignee
Quantel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantel Ltd filed Critical Quantel Ltd
Priority to GB9313751A priority Critical patent/GB2280547B/en
Publication of GB9313751D0 publication Critical patent/GB9313751D0/en
Publication of GB2280547A publication Critical patent/GB2280547A/en
Application granted granted Critical
Publication of GB2280547B publication Critical patent/GB2280547B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • H01P3/088Stacked transmission lines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224Patterned shielding planes, ground planes or power planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/025Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224Patterned shielding planes, ground planes or power planes
    • H05K1/0225Single or multiple openings in a shielding, ground or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0191Dielectric layers wherein the thickness of the dielectric plays an important role
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09318Core having one signal plane and one power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09327Special sequence of power, ground and signal layers in multilayer PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09336Signal conductors in same plane as power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672Superposed layout, i.e. in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681Mesh conductors, e.g. as a ground plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB9313751A 1993-07-02 1993-07-02 Printed circuit board with integral strip-line structure Expired - Lifetime GB2280547B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9313751A GB2280547B (en) 1993-07-02 1993-07-02 Printed circuit board with integral strip-line structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9313751A GB2280547B (en) 1993-07-02 1993-07-02 Printed circuit board with integral strip-line structure

Publications (3)

Publication Number Publication Date
GB9313751D0 GB9313751D0 (en) 1993-08-18
GB2280547A GB2280547A (en) 1995-02-01
GB2280547B true GB2280547B (en) 1997-04-16

Family

ID=10738216

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9313751A Expired - Lifetime GB2280547B (en) 1993-07-02 1993-07-02 Printed circuit board with integral strip-line structure

Country Status (1)

Country Link
GB (1) GB2280547B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016122222A1 (en) * 2016-11-18 2018-05-24 Telegärtner Karl Gärtner GmbH Electrical socket

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB795559A (en) * 1955-11-14 1958-05-28 Sanders Associates Inc Improvements relating to high frequency electric transmission lines
GB986672A (en) * 1960-07-07 1965-03-17 Sanders Associates Inc Improvements in high frequency circuit units
GB1095103A (en) * 1966-03-25 1967-12-13 Mullard Ltd Variable-impedance transmission-line device
US4639693A (en) * 1984-04-20 1987-01-27 Junkosha Company, Ltd. Strip line cable comprised of conductor pairs which are surrounded by porous dielectric

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB795559A (en) * 1955-11-14 1958-05-28 Sanders Associates Inc Improvements relating to high frequency electric transmission lines
GB986672A (en) * 1960-07-07 1965-03-17 Sanders Associates Inc Improvements in high frequency circuit units
GB1095103A (en) * 1966-03-25 1967-12-13 Mullard Ltd Variable-impedance transmission-line device
US4639693A (en) * 1984-04-20 1987-01-27 Junkosha Company, Ltd. Strip line cable comprised of conductor pairs which are surrounded by porous dielectric

Also Published As

Publication number Publication date
GB2280547A (en) 1995-02-01
GB9313751D0 (en) 1993-08-18

Similar Documents

Publication Publication Date Title
EP0614331A3 (en) Printed circuit board.
IL109242A (en) Annular circuit components coupled with printed circuit board through- hole
AU4920090A (en) Printed circuit board
GB2279180B (en) Printed wiring board structure
EP0629107A3 (en) Multiple wiring and X section printed circuit board technique.
EP0467698A3 (en) Printed circuit board having holes with multiple conductors
EP0624054A3 (en) Printed circuit boards.
GB2280792B (en) Printed circuit board connector assembly
SG79881A1 (en) Printed circuit board
EP0715489A3 (en) Printed circuit board assembly
GB9222924D0 (en) Printed circuit board assembly
GB2243247B (en) Printed circuit board assemblies
GB9508857D0 (en) Printed circuit board
EP0442145A3 (en) Printed circuit board
GB2280547B (en) Printed circuit board with integral strip-line structure
GB2253521B (en) Printed circuit board
GB2276496B (en) Electronic circuit board arrangements
GB2254157B (en) Printed circuit board
EP0717587A3 (en) Multilayer printed circuit board
TW314307U (en) Circuit board flipping structure
IL100614A0 (en) Printed circuit board construction
AU117820S (en) Printed circuit board
AU115480S (en) Printed circuit board
AU122015S (en) Printed circuit board antenna
AU116272S (en) Printed circuit board

Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20130701