CN105517325B - The metal-clad structure of printed circuit board - Google Patents
The metal-clad structure of printed circuit board Download PDFInfo
- Publication number
- CN105517325B CN105517325B CN201510862535.4A CN201510862535A CN105517325B CN 105517325 B CN105517325 B CN 105517325B CN 201510862535 A CN201510862535 A CN 201510862535A CN 105517325 B CN105517325 B CN 105517325B
- Authority
- CN
- China
- Prior art keywords
- metal
- coat
- fabric
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 claims abstract description 79
- 229910052751 metal Inorganic materials 0.000 claims abstract description 79
- 239000004744 fabric Substances 0.000 claims abstract description 69
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 23
- 239000000956 alloy Substances 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052709 silver Inorganic materials 0.000 claims abstract description 10
- 239000004332 silver Substances 0.000 claims abstract description 10
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 5
- 229920000800 acrylic rubber Polymers 0.000 claims description 4
- 229920000058 polyacrylate Polymers 0.000 claims description 4
- 238000009434 installation Methods 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910000978 Pb alloy Inorganic materials 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
- D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
- D06M15/21—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- D06M15/263—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated carboxylic acids; Salts or esters thereof
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
- D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
- D06M15/37—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D06M15/55—Epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of metal-clad structures of printed circuit board, including：First coat of metal, to be 5~6 μm containing copper 35~40%, tin 20~25%, the alloy that remaining is lead, and the thickness of first coat of metal；Second coat of metal, to be 5~15 μm containing copper 40~50%, silver 5~25%, the alloy that remaining is tin, and the thickness of first coat of metal；Wherein, second coat of metal is located at most inner side, and first coat of metal is located at outermost；Wherein, further include fabric, most middle part, second coat of metal for being located at printed circuit board are covered in fabric；Fabric is to be constituted immersed with the fabric of resin combination, and fabric has double-layer cavity structure comprising upper fabric surface and lower fabric surface, with 2~3 μm of gap between two fabric surfaces.The present invention has better installation, the advantageous effect of the connection reliability of each sublayer structure and etching performance.
Description
Technical field
The present invention relates to printed-board technology fields.It is more particularly related to which a kind of printed circuit board covers
Metal stacking harden structure.
Background technology
Printed circuit board (PCB circuit board), also known as printed circuit board are the suppliers of electronic component electrical connection.It
Development have more than 100 years history；Its design is mainly layout design；Major advantage using circuit board is to subtract significantly
Few mistake connected up and assemble, improves the gentle productive labor rate of Automated water.
In recent years, as the printed circuit board used in a large amount of electronic equipments such as intelligent hand, tablet computer, printed circuit board
It is formed by the way that conductive pattern is arranged on metal-clad, wherein the important component metal-clad of printed circuit board
Infiltration is typically impregnated by resin combination and forms prepreg in fabric substrate, by the way that metal foil is laminated on the prepreg of formation
It is fabricated, in order to which printed circuit board upper conductor pattern is preferably fitted closely with metal-clad, metal-clad knot
The connection of the installation of sublayer structure, insulating properties and each sublayer structure is reliable in the etching performance of structure, metal-clad
Property become it is particularly important.
Invention content
It is an object of the invention to solve at least the above and/or defect, and provide at least one will be described later
The advantages of.
It is folded that it is a still further object of the present invention to provide a kind of metal-clads of the printed circuit board with more preferable etching performance
The surface of harden structure, outermost metal coating is sprayed with tin layers, avoids copper face from being easy oxidation, improves the solderability of circuit board.
It is a still further object of the present invention to provide a kind of metal-clads of the printed circuit board with better insulation performance
Laminate structure, since fabric has double-layer cavity structure comprising upper fabric surface and lower fabric surface, two fabric tables
With 2~3 μm of gap between face, the insulation performance between the metallic plate of the fabric both sides is improved.
In order to realize these purposes and other advantages according to the present invention, the present invention provides a kind of covering for printed circuit board
Metal stacking harden structure, including：
First coat of metal, for containing copper 35~40%, tin 20~25%, the alloy that remaining is lead, and described first
The thickness of the coat of metal is 5~6 μm；
Second coat of metal, to contain copper 40~50%, silver 5~25%, the alloy that remaining is tin, and second gold medal
The thickness for belonging to coating is 5~15 μm；
Wherein, second coat of metal is located at most inner side, and first coat of metal is located at outermost；
Wherein, further include fabric, be located at the most middle part of the printed circuit board, second coat of metal covering
In the fabric；
The fabric is the fabric composition immersed with resin combination, and the fabric has double-layer cavity knot
Structure comprising go up fabric surface and lower fabric surface, there is 2~3 μm of gap between two fabric surfaces.
Preferably, wherein further include the third coat of metal, for containing copper 45~55%, gold 5~10%, remaining be
The alloy of lead, and the thickness of the third coat of metal is 6~8 μm, the third coat of metal is covered in second metal
On coating surface.
Preferably, wherein first coat of metal, for containing copper 36~38%, tin 21~23%, remaining be lead
Alloy, and the thickness of first coat of metal be 5~6 μm.
Preferably, wherein second coat of metal, for containing copper 42~48%, silver 10~20%, remaining be tin
Alloy, and the thickness of second coat of metal be 8~12 μm.
Preferably, wherein first coat of metal, for containing copper 37%, tin 22%, the alloy that remaining is lead,
And the thickness of first coat of metal is 6 μm.
Preferably, wherein second coat of metal, for containing copper 45%, silver 15%, the alloy that remaining is tin,
And the thickness of second coat of metal is 10 μm.
Preferably, wherein the third coat of metal, for containing copper 48~52%, gold 6~8%, remaining be lead
Alloy, and the thickness of the third coat of metal is 6~8 μm, the third coat of metal is covered in second coat of metal
On surface.
Preferably, wherein the third coat of metal, for containing copper 50%, gold 7%, the alloy that remaining is lead, and
The thickness of the third coat of metal is 6 μm, and the third coat of metal is covered on second metal coating surface.
Preferably, wherein the resin combination is epoxy resin and acrylic rubber with naphthalene type skeleton.
The present invention includes at least following advantageous effect：
1, its surface of the metal layer of the metal-clad structure setting of printed circuit board provided by the invention is sprayed
Tin, avoiding copper face from being easy oxidation causes to be not easy upper tin, and the metal-clad that circuit board is improved by layer on surface of metal spray tin is folded
The solderability of plate；
2, the metal-clad structure of printed circuit board provided by the invention, since fabric has double-layer cavity knot
Structure improves the insulation performance between the metallic plate of the fabric both sides；
3, the metal-clad structure of printed circuit board provided by the invention, due in fabric both sides in both sides shape
At different thickness of coating, to facilitate the semiconductor original paper of selection installation different performance；
4, the metal-clad structure of printed circuit board provided by the invention, since fabric includes upper fabric surface
With lower fabric surface, with 2~3 μm of gap between two fabric surfaces, while ensureing insulating properties, it may have centainly
Elasticity can facilitate plating operation；
5, the metal-clad structure of printed circuit board provided by the invention, since fabric is immersed with resin group
The fabric for closing object is constituted, and containing the epoxy resin with naphthalene type skeleton in the resin combination, printed circuit board can be improved
Heat resistance.
Description of the drawings
Fig. 1 is that the structure of the cross section of the metal-clad structure of printed circuit board in one embodiment of the present of invention is shown
It is intended to；
Fig. 2 is the upper fabric surface of the metal-clad board structure of printed circuit board in one embodiment of the present of invention under
The structural schematic diagram of fabric surface.
Specific implementation mode
Present invention will be described in further detail below with reference to the accompanying drawings, to enable those skilled in the art with reference to specification text
Word can be implemented according to this.
In order to realize these purposes and other advantages according to the present invention,
Such as Fig. 1 and Fig. 2 shows a kind of metal-clad structures of printed circuit board of the present invention, including：
First coat of metal 4, for containing copper 35~40%, tin 20~25%, the alloy that remaining is lead, and described first
The thickness of the coat of metal 4 is 5~6 μm；
Second coat of metal 2, for containing copper 40~50%, silver 5~25%, the alloy that remaining is tin, and described second
The thickness of the coat of metal 2 is 5~15 μm；
Wherein, second coat of metal 2 is located at most inner side, and first coat of metal 4 is located at outermost；
Wherein, further include fabric 1, most middle part, second coat of metal 2 for being located at the printed circuit board cover
It covers in the fabric 1；
The fabric 1 is the fabric composition immersed with resin combination, and the fabric 1 has double-layer cavity knot
Structure comprising go up fabric surface and lower fabric surface 100, there is 2~3 μm of gap between two fabric surfaces.
Wherein, since the fabric 1 has double-layer cavity structure, 1 both sides metallic plate of the fabric is improved
Between insulation performance；The fabric 1 includes upper fabric surface and lower fabric surface 100, is had between two fabric surfaces
The gap for having 2~3 μm, while ensureing insulating properties, it may have certain elasticity can facilitate plating operation；
In wherein a kind of embodiment, for fabric, be not particularly limited, as long as with warp thread as such as plain weave and
The material that the substantially orthogonal mode of weft yarn is made into can use such as material made of inorfil, such as glass cloth or the like
Material, or the material made of organic fiber, such as aromatic polyamides cloth or the like material, the thickness of fabric is preferred
210~300 μm.
Further include the third coat of metal 3 in wherein a kind of embodiment, for containing copper 45~55%, gold 5~10%,
Remaining is the alloy of lead, and the thickness of the third coat of metal 3 is 6~8 μm, and the third coat of metal 3 is covered in described
On the surface of second coat of metal 2.
Wherein, the third coat of metal 3 preferably comprises copper 48~52%, gold 6~8%, the alloy that remaining is lead, and
The thickness of the third coat of metal 3 is 6~8 μm；Further preferably copper 50%, gold 7%, the alloy that remaining is lead, and it is described
The thickness of the third coat of metal 3 is 6 μm.
In another embodiment, first coat of metal 4 preferably containing copper 36~38%, tin 21~23%, its
The remaining alloy for lead, and the thickness of first coat of metal 4 is 5~6 μm；More preferably contain copper 37%, tin 22%, its
The remaining alloy for lead, and the thickness of first coat of metal is 6 μm.
In another embodiment, second coat of metal 2 preferably containing copper 42~48%, silver 10~20%, its
The remaining alloy for tin, and the thickness of second coat of metal 2 is 8~12 μm；More preferably contain copper 45%, silver 15%,
Remaining is the alloy of tin, and the thickness of two coat of metal 2 is 10 μm.
In another embodiment, the resin combination is epoxy resin and acrylic rubber with naphthalene type skeleton.
Also, this mode is a kind of explanation of preferred embodiments, and however, it is not limited to this.It in carrying out the present invention, can be according to making
The performance of user's demand fabric is different and selects different state sample implementations.
Wherein, the epoxy resin with naphthalene type skeleton can be a kind of or a variety of, can be with naphthalene type skeleton
Epoxy resin with without naphthalene type skeleton epoxy resin composition, or individually with naphthalene type skeleton epoxy
The combination of resin, still, wherein must it is at least one be the epoxy resin with naphthalene type skeleton, to improve printed circuit board
The heat resistance of metal-clad structure, such as printed circuit board are mounted on the heat resistance in electronic product, or in circuit board
The upper heat resistance for carrying out scolding tin increases the service life of printed circuit board and uses sensitivity.
Wherein, do not have unsaturated bond as such as double bond, three keys, carbon in the ingredient of acrylic rubber between carbon atom
It is bonded by singly-bound between atom, avoids that there is unsaturated bond to be easy oxidation and make the metal-clad of printed circuit board folded
Harden structure follows the string and becomes fragile, and influences the respective performances of printed circuit board.
As described above, according to the present invention, since fabric has double-layer cavity structure, the fabric two is improved
Insulation performance between the metallic plate of side；Fabric includes upper fabric surface and lower fabric surface, is had between two fabric surfaces
The gap for having 2~3 μm, while ensureing insulating properties, it may have certain elasticity can facilitate plating operation；Due to fabric
Base is the fabric composition immersed with resin combination, contains the epoxy resin with naphthalene type skeleton in the resin combination,
The heat resistance of printed circuit board can be improved；Due to forming different thickness of coating on both sides in fabric both sides, to facilitate choosing
Select the semiconductor original paper of installation different performance.
Although the embodiments of the present invention have been disclosed as above, but its is not only in the description and the implementation listed
With it can be fully applied to various fields suitable for the present invention, for those skilled in the art, can be easily
Realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, the present invention is simultaneously unlimited
In specific details and legend shown and described herein.
Claims (9)
1. a kind of metal-clad structure of printed circuit board, which is characterized in that including：
First coat of metal, to contain copper 35~40%, tin 20~25%, the alloy that remaining is lead, and first metal
The thickness of coating is 5~6 μm；
Second coat of metal, to contain copper 40~50%, silver 5~25%, the alloy that remaining is tin, and second metal-plated
The thickness of layer is 5~15 μm；
Wherein, second coat of metal is located at most inner side, and first coat of metal is located at outermost；
Wherein, further include fabric, most middle part, second coat of metal for being located at the printed circuit board are covered in institute
It states in fabric；
The fabric is the fabric composition immersed with resin combination, and the fabric has double-layer cavity structure,
Including upper fabric surface and lower fabric surface, there is 2~3 μm of gap between two fabric surfaces.
2. the metal-clad structure of printed circuit board as described in claim 1, which is characterized in that further include third metal
Coating, to be 6 containing copper 45~55%, gold 5~10%, the alloy that remaining is lead, and the thickness of the third coat of metal
~8 μm, the third coat of metal is covered on second metal coating surface.
3. the metal-clad structure of printed circuit board as described in claim 1, which is characterized in that first metal-plated
Layer, for be 5 containing copper 36~38%, tin 21~23%, the alloy that remaining is lead, and the thickness of first coat of metal~
6μm。
4. the metal-clad structure of printed circuit board as described in claim 1, which is characterized in that second metal-plated
Layer, for containing copper 42~48%, silver 10~20%, the alloy that remaining is tin, and the thickness of second coat of metal be 8~
12μm。
5. the metal-clad structure of printed circuit board as described in claim 1, which is characterized in that first metal-plated
Layer, to be 6 μm containing copper 37%, tin 22%, the alloy that remaining is lead, and the thickness of first coat of metal.
6. the metal-clad structure of printed circuit board as described in claim 1, which is characterized in that second metal-plated
Layer, to be 10 μm containing copper 45%, silver 15%, the alloy that remaining is tin, and the thickness of second coat of metal.
7. the metal-clad structure of printed circuit board as claimed in claim 2, which is characterized in that the third metal-plated
Layer, to be 6~8 μ containing copper 48~52%, gold 6~8%, the alloy that remaining is lead, and the thickness of the third coat of metal
M, the third coat of metal are covered on second metal coating surface.
8. the metal-clad structure of printed circuit board as claimed in claim 7, which is characterized in that the third metal-plated
Layer, to be 6 μm containing copper 50%, gold 7%, the alloy that remaining is lead, and the thickness of the third coat of metal, the third
The coat of metal is covered on second metal coating surface.
9. the metal-clad structure of printed circuit board as described in claim 1, which is characterized in that the resin combination
For epoxy resin, acrylic rubber with naphthalene type skeleton.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510862535.4A CN105517325B (en) | 2015-11-30 | 2015-11-30 | The metal-clad structure of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510862535.4A CN105517325B (en) | 2015-11-30 | 2015-11-30 | The metal-clad structure of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105517325A CN105517325A (en) | 2016-04-20 |
| CN105517325B true CN105517325B (en) | 2018-07-24 |
Family
ID=55724848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510862535.4A Expired - Fee Related CN105517325B (en) | 2015-11-30 | 2015-11-30 | The metal-clad structure of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105517325B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5837624A (en) * | 1995-10-16 | 1998-11-17 | Matsushita Electric Works, Ltd. | Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom |
| WO1999044959A1 (en) * | 1998-03-03 | 1999-09-10 | Ppg Industries Ohio, Inc. | Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric |
| WO2010113892A1 (en) * | 2009-03-30 | 2010-10-07 | 株式会社トクヤマ | Process for producing metallized substrate and metallized substrate |
| CN103167731A (en) * | 2011-12-08 | 2013-06-19 | 祝琼 | Soft board base material without glue and preparation method thereof |
| CN104837622A (en) * | 2012-12-06 | 2015-08-12 | 三菱瓦斯化学株式会社 | Method for producing metal-foil-clad laminate |
-
2015
- 2015-11-30 CN CN201510862535.4A patent/CN105517325B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5837624A (en) * | 1995-10-16 | 1998-11-17 | Matsushita Electric Works, Ltd. | Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom |
| WO1999044959A1 (en) * | 1998-03-03 | 1999-09-10 | Ppg Industries Ohio, Inc. | Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric |
| WO2010113892A1 (en) * | 2009-03-30 | 2010-10-07 | 株式会社トクヤマ | Process for producing metallized substrate and metallized substrate |
| CN103167731A (en) * | 2011-12-08 | 2013-06-19 | 祝琼 | Soft board base material without glue and preparation method thereof |
| CN104837622A (en) * | 2012-12-06 | 2015-08-12 | 三菱瓦斯化学株式会社 | Method for producing metal-foil-clad laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105517325A (en) | 2016-04-20 |
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| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Lu Meizhen Inventor after: Yi Tugui Inventor before: Lu Meizhen |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190524 Address after: 528305 Tianfulai International Industrial City, 33 Changbaoxi Road, Ronggui Rongli Residential Committee, Shunde District, Foshan City, Guangdong Province (Phase III), 13 Blocks, 1 Floor 101 Patentee after: Foshan Shunde Gaoxin Electronic Industry Co.,Ltd. Address before: 536000, 8 floor, Ledu tower, West Bay Road, Beihai, the Guangxi Zhuang Autonomous Region. Patentee before: Lu Meizhen |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180724 Termination date: 20211130 |