CN204888786U - Multilayer circuit plate structure of fabrics application of electronic IT - Google Patents
Multilayer circuit plate structure of fabrics application of electronic IT Download PDFInfo
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- CN204888786U CN204888786U CN201520625612.XU CN201520625612U CN204888786U CN 204888786 U CN204888786 U CN 204888786U CN 201520625612 U CN201520625612 U CN 201520625612U CN 204888786 U CN204888786 U CN 204888786U
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Abstract
The utility model discloses a multilayer circuit plate structure of fabrics application of electronic IT, this structure includes at least one deck fabrics cloth, stack gradually between the fabrics cloth and two adjacent fabrics clothes between equal centre gripping have insulating membrane layer, the lower terminal surface of the fabrics cloth of the bottom is equipped with the wire contact of colding pressing, and this layer up end distributes and have first wire anodal, and its down terminal surface be equipped with first wire negative pole, the anodal end of first wire passes the lower terminal surface that extends the fabrics cloth behind the up end of fabrics cloth, the end of anodal end of first wire and first wire negative pole all is connected to the wire and colds pressing and switch on mutually behind the contact, it has the second wire to distribute on the fabrics cloth of top layer, it has the privates to equally divide cloth on the up end of the fabrics cloth of every layer of fabrics cloth in intermediate level and top layer, and every privates all passes corresponding fabrics cloth and the insulating membrane layer that corresponds after all connect on the fabrics cloth up end of lower floor's correspondence.
Description
Technical field
The utility model relates to textile electronic technical field, particularly relates to a kind of Multi-layer circuit board structure of textile electronic, and this structure is mainly used on heating clothes.
Background technology
Existing known heating clothes is of a great variety, substantially form point 3 large classes, the first adds fever tablet on business suit basis, fever tablet is made up of common metal silk, and connect (using welding) with plain conductor (copper in the majority) common in electron trade, energising makes it generate heat as Chinese patent CN201420158371. moreAll fever tablets and conducting wire must be pulled down when its shortcoming is washing, use extremely inconvenient.And owing to employing the plain conductor that ordinary electronic industry uses, its bending, when pullling because of metal fatigue, very easily damage, directly wash if do not pulled down current-carrying part, washing powder or liquid detergent are by etching lines.During machine washing, what washing machine was huge rubs, the power of pullling will damage fever tablet and conductor structure, especially with the structure of solder joint.
It two is utilize the material such as metal dust printing, aluminium foil to make fever tablet, connects, be energized and make it generate heat as Chinese patent CN201310266217 with plain conductor common in electron trade.Its shortcoming and above-mentioned in mention similar, all not directly machine-wash, all current-carrying parts of must dismantling, use very inconvenient and easily damage.
It three is utilize carbon fiber, carbon element, plated conductor fiber and other material to manufacture fever tablet, and to connect with plain conductor common in electron trade, is energized and makes it generate heat as Chinese patent CN200710046675.It still can not avoid the problem run in above-mentioned two kinds.
No doubt heating clothes is of a great variety in sum, but the textile electronic circuit of heating clothes normally adopts single layer planar structure at present, and the cabling that this structure cannot realize wire connects, and there is the limitation of two dimensional surface cabling; And be easy to the waste causing material.
Utility model content
For the weak point existed in above-mentioned technology, the utility model provides the Multi-layer circuit board structure of the textile electronic that a kind of cabling is stablized flexibly and space availability ratio is high.
For achieving the above object, the utility model provides a kind of Multi-layer circuit board structure of textile electronic, comprises at least one deck textile cloth, stacks gradually and be all clamped with insulation diaphragm layer between adjacent two textile clothes between textile cloth; The lower surface of the textile cloth of the bottom is provided with wire and colds pressing contact, and the upper surface of this layer is distributed with the first wire positive pole, and its lower surface is provided with the first wire negative pole, the end of described first wire positive pole is through the lower surface of extending textile cloth behind the upper surface of textile cloth, and the end of described first wire positive pole and the end of the first wire negative pole are all connected to wire and cold pressing after contact and be conducted; The textile cloth of most top layer is distributed with the second wire; The upper surface of the textile cloth of every layer of textile cloth in intermediate layer and most top layer is distributed with privates, and every root privates is all connected on textile cloth upper surface corresponding to lower floor through after the textile cloth of correspondence and the insulation diaphragm layer of correspondence thereof.
Wherein, the upper surface of every layer of textile cloth in intermediate layer is equipped with wire to cold pressing contact, every root privates is divided into privates positive pole and privates negative pole, every root privates negative pole is distributed in the upper surface of corresponding textile cloth, and the end of every root privates positive pole is through being connected on textile cloth upper surface corresponding to lower floor behind the upper surface of the textile cloth of respective layer and the insulation diaphragm layer of correspondence; And every root privates positive pole and every root privates negative pole are all connected to corresponding wire colds pressing after contact and be conducted.
Wherein, described insulation diaphragm layer comprises PUR rete or insulating adhesive film layer.
Wherein, the number of plies quantity of described textile cloth is one deck, described first wire positive pole and the second arrangement of conductors are in the upper surface of textile cloth, described first wire negative pole and wire contact of colding pressing is distributed in the lower surface of textile cloth, the end of described first wire positive pole is through the lower surface of extending textile cloth behind the upper surface of this textile cloth, and the end of described first wire positive pole and the end of the first wire negative pole are all connected to wire colds pressing after contact and be conducted.
Wherein, the number of plies quantity of described textile cloth is two-layer, and is isolated by insulation diaphragm layer between two-layer textile cloth, and privates negative pole and the second wire are distributed in the upper surface of upper strata textile cloth; Privates positive pole and privates negative pole are connected to wire and cold pressing after contact, and the end of this privates positive pole is successively through the upper surface being distributed in lower floor's textile cloth after upper strata textile cloth and insulation diaphragm layer; First wire negative pole is distributed in the lower surface of lower floor's textile cloth, and the first wire positive pole and the first wire negative pole are connected to wire colds pressing after contact, and the first wire positive pole is distributed on its upper surface through after lower floor's textile cloth.
The beneficial effects of the utility model are: compared with prior art, the Multi-layer circuit board structure of the textile electronic that the utility model provides, the wire of every layer of textile cloth distributes on a different plane, and wire can be made after Different Plane interts connection to form sandwich construction, this multilayer circuit board can realize the cabling connection that individual layer planar circuit cannot realize, can realize circuit extremely flexibly to walk, it saves cabling plane space greatly, saves raw material; And jump out the limitation of two dimensional surface cabling, limited textile surface is amassed can hold more, more accurate, more complicated electronic circuit.The utility model has reasonable in design, the feature such as cabling is flexible, space availability ratio is high and cost is low.
Accompanying drawing explanation
Fig. 1 is the first specific embodiment figure of the present utility model;
Fig. 2 is the second specific embodiment figure of the present utility model;
Fig. 3 is the 3rd specific embodiment figure of the present utility model.
Main element symbol description is as follows:
10a, textile cloth 11a, the first wire positive pole
12a, the first wire negative pole 13a, the second wire
14a, wire are colded pressing contact
10b, textile cloth 11b, the first wire positive pole
12b, the first wire negative pole 13b, the second wire
14b, wire are colded pressing contact 15b, privates positive pole
16b, privates negative pole 17b, insulation diaphragm layer
10c, textile cloth 11c, the first wire positive pole
12c, the first wire negative pole 13c, the second wire
14c, wire are colded pressing contact 15c, privates positive pole
16c, privates negative pole 17c, insulation diaphragm layer.
Detailed description of the invention
In order to more clearly state the utility model, below in conjunction with accompanying drawing, the utility model is further described.
The Multi-layer circuit board structure of textile electronic of the present utility model, comprises at least one deck textile cloth, stacks gradually and be all clamped with insulation diaphragm layer between adjacent two textile clothes between textile cloth; The lower surface of the textile cloth of the bottom is provided with wire and colds pressing contact, and the upper surface of this layer is distributed with the first wire positive pole, and its lower surface is provided with the first wire negative pole, the end of the first wire positive pole is through the lower surface of extending textile cloth behind the upper surface of textile cloth, and the end of the first wire positive pole and the end of the first wire negative pole are all connected to wire and cold pressing after contact and be conducted; The textile cloth of most top layer is distributed with the second wire; The upper surface of the textile cloth of every layer of textile cloth in intermediate layer and most top layer is distributed with privates, and every root privates is all connected on textile cloth upper surface corresponding to lower floor through after the textile cloth of correspondence and the insulation diaphragm layer of correspondence thereof.
Compared to the situation of prior art, the Multi-layer circuit board structure of the textile electronic that the utility model provides, the wire of every layer of textile cloth distributes on a different plane, and wire can be made after Different Plane interts connection to form sandwich construction, this multilayer circuit board can realize the cabling connection that individual layer planar circuit cannot realize, can realize circuit extremely flexibly to walk, it saves cabling plane space greatly, saves raw material; And jump out the limitation of two dimensional surface cabling, limited textile surface is amassed can hold more, more accurate, more complicated electronic circuit.The utility model has reasonable in design, the feature such as cabling is flexible, space availability ratio is high and cost is low.
In the utility model, the upper surface of every layer of textile cloth in intermediate layer is equipped with wire to cold pressing contact, every root privates is divided into privates positive pole and privates negative pole, every root privates negative pole is distributed in the upper surface of corresponding textile cloth, and the end of every root privates positive pole is through being connected on textile cloth upper surface corresponding to lower floor behind the upper surface of the textile cloth of respective layer and the insulation diaphragm layer of correspondence; And every root privates positive pole and every root privates negative pole are all connected to corresponding wire colds pressing after contact and be conducted.Insulation diaphragm layer comprises PUR rete or insulating adhesive film layer, certainly, can also be other types, as long as can realize insulating.
Refer to Fig. 1, the number of plies quantity of textile cloth 10a is one deck, first wire positive pole 11a and the second wire 13a is distributed in the upper surface of textile cloth 10a, first wire negative pole 12a and the wire contact 14a that colds pressing is distributed in the lower surface of textile cloth 10a, the end of the first wire positive pole 11a is through the lower surface of extending textile cloth 10a behind the upper surface of this textile cloth 10a, and the end of the end of the first wire positive pole 11a and the first wire negative pole 12a is all connected to wire colds pressing after contact 14a and be conducted.Said structure achieves on one deck textile cloth odt circuit plate structure, and wire interts in the Different Plane of textile cloth.
Refer to Fig. 2, the number of plies quantity of textile cloth 10b is two-layer, and is isolated by insulation diaphragm layer 17b between two-layer textile cloth 10b, and privates negative pole 16b and the second wire 13b is distributed in the upper surface of upper strata textile cloth 10b; Privates positive pole 15b and privates negative pole 16b is connected to wire and colds pressing after contact 14b, and the end of this privates positive pole 15b is successively through the upper surface being distributed in lower floor textile cloth 10b after upper strata textile cloth 10b and insulation diaphragm layer 17b; First wire negative pole 12b is distributed in the lower surface of lower floor textile cloth 10b, and the first wire positive pole 11b and the first wire negative pole 12b is connected to wire colds pressing after contact 14b, and the first wire positive pole 11b is distributed on its upper surface through after lower floor's textile cloth.Said structure achieves on two-layer textile cloth three layer circuit board structures, and wire interts in the Different Plane of textile cloth.
Refer to Fig. 3, the number of plies quantity of textile cloth 10c is three layers, and isolated by insulation diaphragm layer 17c between every adjacent two layers textile cloth 10c, second wire 13c is distributed in the upper surface of most top layer textile cloth 10c, every root privates negative pole 16c is distributed on the upper surface of textile cloth in top layer and intermediate layer, and the end of every root privates positive pole 15c is through being connected on textile cloth 10c upper surface corresponding to lower floor behind the upper surface of the textile cloth 10c of respective layer and the insulation diaphragm layer 17c of correspondence; Be conducted after contact 14c and the wire that every root privates positive pole 15c and every root privates negative pole 16c is all connected to correspondence is colded pressing; First wire negative pole 12c is distributed in the lower surface of lower floor textile cloth 10c, and the first wire positive pole 11c and the first wire negative pole 12c is connected to wire colds pressing after contact 14c, and the first wire positive pole 11c is distributed on its upper surface through after lower floor's textile cloth.Said structure achieves on three layers of textile cloth four-layer circuit board structure, and wire interts in the Different Plane of textile cloth.
The utility model is not limited to three kinds of above-mentioned embodiments, can realize Multi-layer circuit board structure according to the actual needs to multi-layered textile product cloth, if with above-mentioned cabling mode type.Circuit board of the present utility model can design bilayer, three layers, multilayer, circuit extremely flexibly can be realized walk, jump out the limitation of two dimensional surface cabling, save raw material and cabling space greatly, limited clothing surface is amassed can hold more, more accurate, more complicated electronic circuit; Or be applied to textile circuit board making electromagnetic armouring structure, the electronic signal that transmission is more responsive, electromagnetism interference is more weak can be used in, especially make the heating circuit of heating clothes no longer be confined to single two dimensional surface wiring method.
Be only several specific embodiment of the present utility model above, but the utility model is not limited thereto, the changes that any person skilled in the art can think of all should fall into protection domain of the present utility model.
Claims (5)
1. a Multi-layer circuit board structure for textile electronic, is characterized in that, comprises at least one deck textile cloth, stacks gradually and be all clamped with insulation diaphragm layer between adjacent two textile clothes between textile cloth; The lower surface of the textile cloth of the bottom is provided with wire and colds pressing contact, and the upper surface of this layer is distributed with the first wire positive pole, and its lower surface is provided with the first wire negative pole, the end of described first wire positive pole is through the lower surface of extending textile cloth behind the upper surface of textile cloth, and the end of described first wire positive pole and the end of the first wire negative pole are all connected to wire and cold pressing after contact and be conducted; The textile cloth of most top layer is distributed with the second wire; The upper surface of the textile cloth of every layer of textile cloth in intermediate layer and most top layer is distributed with privates, and every root privates is all connected on textile cloth upper surface corresponding to lower floor through after the textile cloth of correspondence and the insulation diaphragm layer of correspondence thereof.
2. the Multi-layer circuit board structure of textile electronic according to claim 1, it is characterized in that, the upper surface of every layer of textile cloth in intermediate layer is equipped with wire to cold pressing contact, every root privates is divided into privates positive pole and privates negative pole, every root privates negative pole is distributed in the upper surface of corresponding textile cloth, and the end of every root privates positive pole is through being connected on textile cloth upper surface corresponding to lower floor behind the upper surface of the textile cloth of respective layer and the insulation diaphragm layer of correspondence; And every root privates positive pole and every root privates negative pole are all connected to corresponding wire colds pressing after contact and be conducted.
3. the Multi-layer circuit board structure of textile electronic according to claim 2, is characterized in that, described insulation diaphragm layer comprises PUR rete or insulating adhesive film layer.
4. the Multi-layer circuit board structure of textile electronic according to claim 1, it is characterized in that, the number of plies quantity of described textile cloth is one deck, described first wire positive pole and the second arrangement of conductors are in the upper surface of textile cloth, described first wire negative pole and wire contact of colding pressing is distributed in the lower surface of textile cloth, the end of described first wire positive pole is through the lower surface of extending textile cloth behind the upper surface of this textile cloth, and the end of described first wire positive pole and the end of the first wire negative pole are all connected to wire colds pressing after contact and be conducted.
5. the Multi-layer circuit board structure of textile electronic according to claim 1, it is characterized in that, the number of plies quantity of described textile cloth is two-layer, and isolated by insulation diaphragm layer between two-layer textile cloth, privates negative pole and the second wire are distributed in the upper surface of upper strata textile cloth; Privates positive pole and privates negative pole are connected to wire and cold pressing after contact, and the end of this privates positive pole is successively through the upper surface being distributed in lower floor's textile cloth after upper strata textile cloth and insulation diaphragm layer; First wire negative pole is distributed in the lower surface of lower floor's textile cloth, and the first wire positive pole and the first wire negative pole are connected to wire colds pressing after contact, and the first wire positive pole is distributed on its upper surface through after lower floor's textile cloth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520625612.XU CN204888786U (en) | 2015-08-19 | 2015-08-19 | Multilayer circuit plate structure of fabrics application of electronic IT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520625612.XU CN204888786U (en) | 2015-08-19 | 2015-08-19 | Multilayer circuit plate structure of fabrics application of electronic IT |
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| Publication Number | Publication Date |
|---|---|
| CN204888786U true CN204888786U (en) | 2015-12-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520625612.XU Active CN204888786U (en) | 2015-08-19 | 2015-08-19 | Multilayer circuit plate structure of fabrics application of electronic IT |
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| Country | Link |
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| CN (1) | CN204888786U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018072538A1 (en) * | 2016-10-17 | 2018-04-26 | 匡海云 | Antiskid structure of flexible circuit board |
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- 2015-08-19 CN CN201520625612.XU patent/CN204888786U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018072538A1 (en) * | 2016-10-17 | 2018-04-26 | 匡海云 | Antiskid structure of flexible circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Jinling Inventor after: Tong Qi Inventor before: Wang Jinling |
|
| COR | Change of bibliographic data | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000, Shenzhen, Guangdong province Baoan District Xixiang Street nine Wai village 280, building two Patentee after: Shenzhen Renben Fashion Co., Ltd. Address before: 518000, Shenzhen, Guangdong province Baoan District Xixiang Street nine Wai village 280, building two Patentee before: SHENZHEN RENBEN APPAREL CO., LTD. |