ID18410A - Bubur multi pengoksidasi untuk pemolesan mekanis kimia - Google Patents

Bubur multi pengoksidasi untuk pemolesan mekanis kimia

Info

Publication number
ID18410A
ID18410A IDP973264A ID973264A ID18410A ID 18410 A ID18410 A ID 18410A ID P973264 A IDP973264 A ID P973264A ID 973264 A ID973264 A ID 973264A ID 18410 A ID18410 A ID 18410A
Authority
ID
Indonesia
Prior art keywords
occurizing
oxidizing
chemical mechanical
mechanical processing
processing
Prior art date
Application number
IDP973264A
Other languages
English (en)
Inventor
Vlasta Brusic Kaufman
Shumin Wang
Original Assignee
Cabot Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/718,937 external-priority patent/US5783489A/en
Priority claimed from US08/800,562 external-priority patent/US6033596A/en
Application filed by Cabot Corp filed Critical Cabot Corp
Publication of ID18410A publication Critical patent/ID18410A/id

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
IDP973264A 1996-09-24 1997-09-23 Bubur multi pengoksidasi untuk pemolesan mekanis kimia ID18410A (id)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/718,937 US5783489A (en) 1996-09-24 1996-09-24 Multi-oxidizer slurry for chemical mechanical polishing
US08/800,562 US6033596A (en) 1996-09-24 1997-02-18 Multi-oxidizer slurry for chemical mechanical polishing
US08/890,778 US6039891A (en) 1996-09-24 1997-07-11 Multi-oxidizer precursor for chemical mechanical polishing

Publications (1)

Publication Number Publication Date
ID18410A true ID18410A (id) 1998-04-09

Family

ID=27418986

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP973264A ID18410A (id) 1996-09-24 1997-09-23 Bubur multi pengoksidasi untuk pemolesan mekanis kimia

Country Status (9)

Country Link
US (2) US6039891A (id)
EP (1) EP0831136A3 (id)
JP (1) JPH10226784A (id)
CN (1) CN1238812A (id)
AU (1) AU4589897A (id)
ID (1) ID18410A (id)
IL (1) IL121813A0 (id)
TW (1) TW438880B (id)
WO (1) WO1998013536A1 (id)

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US6126853A (en) * 1996-12-09 2000-10-03 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
US6309560B1 (en) * 1996-12-09 2001-10-30 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
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US6630106B1 (en) * 2001-03-13 2003-10-07 Selecto, Inc. Compositions and methods for controlling microorganism growth in water processing systems
US7288498B1 (en) 1997-03-18 2007-10-30 Selecto, Inc Transition metal oxide-aluminosilicate purification media
US6592776B1 (en) * 1997-07-28 2003-07-15 Cabot Microelectronics Corporation Polishing composition for metal CMP
JP4326144B2 (ja) * 1997-11-10 2009-09-02 エリコン・トレーディング・アクチェンゲゼルシャフト，トリュープバッハ 物体より層を分離するための方法
US6432828B2 (en) * 1998-03-18 2002-08-13 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
US6435947B2 (en) 1998-05-26 2002-08-20 Cabot Microelectronics Corporation CMP polishing pad including a solid catalyst
US6177026B1 (en) * 1998-05-26 2001-01-23 Cabot Microelectronics Corporation CMP slurry containing a solid catalyst
US6217416B1 (en) * 1998-06-26 2001-04-17 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper/tantalum substrates
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US6677445B1 (en) 1999-08-27 2004-01-13 Chiron Corporation Chimeric antisense oligonucleotides and cell transfecting formulations thereof
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JP4075247B2 (ja) * 1999-09-30 2008-04-16 Ｊｓｒ株式会社 化学機械研磨用水系分散体
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US6435944B1 (en) * 1999-10-27 2002-08-20 Applied Materials, Inc. CMP slurry for planarizing metals
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WO2002061810A1 (en) * 2001-01-16 2002-08-08 Cabot Microelectronics Corporation Ammonium oxalate-containing polishing system and method
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US7820067B2 (en) * 2006-03-23 2010-10-26 Cabot Microelectronics Corporation Halide anions for metal removal rate control
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CN101724346A (zh) * 2008-10-10 2010-06-09 安集微电子（上海）有限公司 一种化学机械抛光液
CN102452036B (zh) * 2010-10-29 2016-08-24 安集微电子（上海）有限公司 一种钨化学机械抛光方法
CN102181232B (zh) * 2011-03-17 2013-12-11 清华大学 Ulsi多层铜布线铜的低下压力化学机械抛光的组合物
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TWI629347B (zh) * 2012-07-17 2018-07-11 福吉米股份有限公司 使用合金材料硏磨用組成物來研磨合金材料的方法
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CN111962080A (zh) * 2020-07-10 2020-11-20 沈阳中钛装备制造有限公司 一种化学抛光剂及钛合金的金相组织显示方法
CN112920716A (zh) * 2021-01-26 2021-06-08 中国科学院上海微系统与信息技术研究所 一种用于氮化钛化学机械抛光的组合物及其使用方法
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Also Published As

Publication number Publication date
CN1238812A (zh) 1999-12-15
US6316366B1 (en) 2001-11-13
TW438880B (en) 2001-06-07
WO1998013536A1 (en) 1998-04-02
EP0831136A2 (en) 1998-03-25
EP0831136A3 (en) 1998-10-21
IL121813A0 (en) 1998-02-22
US6039891A (en) 2000-03-21
JPH10226784A (ja) 1998-08-25
AU4589897A (en) 1998-04-17

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