ID16837A - Metode dan alat pembentuk dengan sistem injeksi - Google Patents

Metode dan alat pembentuk dengan sistem injeksi

Info

Publication number
ID16837A
ID16837A IDP971390A ID971390A ID16837A ID 16837 A ID16837 A ID 16837A ID P971390 A IDP971390 A ID P971390A ID 971390 A ID971390 A ID 971390A ID 16837 A ID16837 A ID 16837A
Authority
ID
Indonesia
Prior art keywords
methods
injection system
forming equipment
equipment
forming
Prior art date
Application number
IDP971390A
Other languages
English (en)
Indonesian (id)
Inventor
Hans Lothar Berghoff
Original Assignee
Hans Lothar Berghoff
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hans Lothar Berghoff filed Critical Hans Lothar Berghoff
Publication of ID16837A publication Critical patent/ID16837A/id

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B15/00Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/0082Dust eliminating means; Mould or press ram cleaning means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03Injection moulding apparatus
    • B29C45/04Injection moulding apparatus using movable moulds or mould halves
    • B29C45/06Injection moulding apparatus using movable moulds or mould halves mounted on a turntable, i.e. on a rotating support having a rotating axis parallel to the mould opening, closing or clamping direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/006Handling moulds, e.g. between a mould store and a moulding machine
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/70Maintenance
    • B29C33/72Cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/1756Handling of moulds or mould parts, e.g. mould exchanging means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/64Mould opening, closing or clamping devices
    • B29C45/66Mould opening, closing or clamping devices mechanical
    • B29C2045/664Mould opening, closing or clamping devices mechanical using mould clamping means operating independently from the mould closing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
IDP971390A 1996-04-25 1997-04-25 Metode dan alat pembentuk dengan sistem injeksi ID16837A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG1996009523A SG66304A1 (en) 1996-04-25 1996-04-25 Injection moulding apparatus and method

Publications (1)

Publication Number Publication Date
ID16837A true ID16837A (id) 1997-11-13

Family

ID=20429399

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP971390A ID16837A (id) 1996-04-25 1997-04-25 Metode dan alat pembentuk dengan sistem injeksi

Country Status (12)

Country Link
US (1) US6461558B1 (de)
EP (1) EP0907481B1 (de)
JP (1) JP2001500074A (de)
KR (1) KR20000010662A (de)
CN (1) CN1082425C (de)
AU (1) AU2920797A (de)
CA (1) CA2252564A1 (de)
DE (1) DE69708092T2 (de)
ID (1) ID16837A (de)
SG (1) SG66304A1 (de)
TW (1) TW316870B (de)
WO (1) WO1997039870A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6362554B1 (en) 1999-07-29 2002-03-26 Encap Motor Corporation Stator assembly
US6753628B1 (en) 1999-07-29 2004-06-22 Encap Motor Corporation High speed spindle motor for disc drive
US6300695B1 (en) 1999-07-29 2001-10-09 Encap Motor Corporation High speed spindle motor with hydrodynamic bearings
AU2580301A (en) 1999-12-17 2001-06-25 Encap Motor Corporation Spindle motor with encapsulated stator and method of making same
SE520529C2 (sv) * 2000-12-27 2003-07-22 Ericsson Telefon Ab L M Metod för tillverkning av avskärmningslåda och avskärmningslåda
US6808661B2 (en) * 2001-12-11 2004-10-26 Asm Technology Singapore Pte Ltd. Method for encapsulating leadframe-mounted integrated circuits
EP1658168A4 (de) * 2003-03-17 2011-01-12 Vmi Holland Bv Rotationsspritzgiessvorrichtung und verwendungsverfahren
CN100391712C (zh) * 2003-05-29 2008-06-04 吕启晟 模塑制品连续成型机
JP2005104071A (ja) * 2003-10-01 2005-04-21 Toyota Motor Corp 成形装置および専用型の段替方法
JP4643717B2 (ja) * 2009-02-06 2011-03-02 株式会社東芝 射出成形機
KR101084801B1 (ko) * 2009-02-18 2011-11-21 삼성에스디아이 주식회사 이차 전지의 제조 방법 및 이에 의해 제조된 이차 전지
CN105538590A (zh) * 2009-12-24 2016-05-04 库尔蒂建筑机械有限公司 注塑机
US20150076735A1 (en) * 2013-09-16 2015-03-19 Tyco Electronics Corporation Injection molding machine
JP2015168175A (ja) * 2014-03-07 2015-09-28 株式会社エムティアール 軸受部材のライナー注入装置
CN104908356A (zh) * 2015-05-29 2015-09-16 许炎章 一种自动换刀数控卧式键镜床分度工作台
IT201600068534A1 (it) * 2016-07-01 2018-01-01 Gd Spa Macchina confezionatrice per realizzare capsule contenenti rispettive dosi di prodotto incoerente.
EP3529024B1 (de) 2016-10-18 2020-07-15 Aisapack Holding SA Prozess und vorrichtung zum umspritzen eines einlegeteils
CN108582649B (zh) * 2018-03-26 2019-12-03 宁波力松注塑科技有限公司 一种注塑机用的切换式复合模具
CN108297346A (zh) * 2018-03-27 2018-07-20 东莞市星洁电器五金有限公司 一种新型线束触头注塑模条运转机构
CN112770888B (zh) * 2018-09-27 2023-05-09 简易制造欧洲有限公司 用于制造三维物品的模具、机器和方法及与其相关的制造车间
CN113661053B (zh) * 2019-04-11 2023-04-14 米其林集团总公司 用于缆索铁路的滚轮的由弹性体材料制成的实心轮胎
CN114007834B (zh) * 2019-05-17 2023-08-29 佳能弗吉尼亚股份有限公司 制造方法和注射成型系统
CN111545703B (zh) * 2020-05-13 2021-11-05 嘉兴日正五金制造有限公司 一种精密铸造工艺及其相关设备
CN116994966B (zh) * 2023-08-22 2024-03-15 江苏仁泽环境科技有限公司 一种半导体自动化封装设备及其封装工艺
CN117283805B (zh) * 2023-10-31 2024-02-27 河北荣祥鞋业有限公司 一种具有防护功能的劳保鞋注塑机成型模具及工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE717122C (de) 1939-03-11 1942-02-06 Siemens Schuckertwereke Ag Verfahren und Vorrichtung zum Herstellen von Formkoerpern aus plastischen Massen, insbesondere haertbaren Kunstharzen
US4307057A (en) * 1980-06-13 1981-12-22 Siebolt Hettinga Method for aligning an injection mold with a nozzle at the mold injection station
US4424015A (en) * 1981-03-12 1984-01-03 Pemco-Kalamazoo, Inc. Apparatus for injection molding
JPS60110414A (ja) * 1983-11-21 1985-06-15 Matsushita Electric Ind Co Ltd ロ−タリ−成形機
IN164804B (de) * 1984-08-13 1989-06-03 Lrc Products
DE3505155A1 (de) * 1985-02-15 1986-08-21 Elastogran Maschinenbau GmbH, 2844 Lemförde Vorrichtung zur herstellung von formteilen aus mehrkomponentenkunststoff, insbesondere polyurethan, mit einer programmsteuerung
JPS6270013A (ja) * 1985-09-24 1987-03-31 Matsushita Electric Works Ltd 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入方法
JPS6315715A (ja) * 1986-07-08 1988-01-22 Sanshin Kogyo Kk 自動封止成型装置
JP2902539B2 (ja) * 1993-05-26 1999-06-07 東海ゴム工業株式会社 成形品の製造装置及び製造方法
NL9302265A (nl) 1993-12-24 1995-07-17 Asm Fico Tooling Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets.
US5698242A (en) * 1995-12-20 1997-12-16 General Instrument Corporation Of Delaware Apparatus for the injection molding of semiconductor elements

Also Published As

Publication number Publication date
AU2920797A (en) 1997-11-12
WO1997039870A1 (en) 1997-10-30
CN1216491A (zh) 1999-05-12
US6461558B1 (en) 2002-10-08
EP0907481A1 (de) 1999-04-14
DE69708092T2 (de) 2002-08-14
KR20000010662A (ko) 2000-02-25
CA2252564A1 (en) 1997-10-30
EP0907481B1 (de) 2001-11-07
CN1082425C (zh) 2002-04-10
SG66304A1 (en) 1999-07-20
TW316870B (en) 1997-10-01
JP2001500074A (ja) 2001-01-09
DE69708092D1 (de) 2001-12-13

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