SG66304A1 - Injection moulding apparatus and method - Google Patents

Injection moulding apparatus and method

Info

Publication number
SG66304A1
SG66304A1 SG1996009523A SG1996009523A SG66304A1 SG 66304 A1 SG66304 A1 SG 66304A1 SG 1996009523 A SG1996009523 A SG 1996009523A SG 1996009523 A SG1996009523 A SG 1996009523A SG 66304 A1 SG66304 A1 SG 66304A1
Authority
SG
Singapore
Prior art keywords
injection moulding
moulding apparatus
injection
moulding
Prior art date
Application number
SG1996009523A
Other languages
English (en)
Inventor
Hans Lothar Berghoff
Original Assignee
Fastech System S Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fastech System S Pte Ltd filed Critical Fastech System S Pte Ltd
Priority to SG1996009523A priority Critical patent/SG66304A1/en
Priority to TW085112064A priority patent/TW316870B/zh
Priority to CN97194030A priority patent/CN1082425C/zh
Priority to DE69709103T priority patent/DE69709103T2/de
Priority to PCT/SG1997/000017 priority patent/WO1997039870A1/en
Priority to JP09538007A priority patent/JP2001500074A/ja
Priority to US09/171,660 priority patent/US6254378B1/en
Priority to AU29206/97A priority patent/AU2920697A/en
Priority to JP09538006A priority patent/JP2001501550A/ja
Priority to CA002252564A priority patent/CA2252564A1/en
Priority to US09/171,662 priority patent/US6461558B1/en
Priority to CN97194029A priority patent/CN1087216C/zh
Priority to CA002252562A priority patent/CA2252562A1/en
Priority to PCT/SG1997/000016 priority patent/WO1997039873A1/en
Priority to EP97923393A priority patent/EP0907489B1/de
Priority to KR1019980708631A priority patent/KR20000010662A/ko
Priority to AU29207/97A priority patent/AU2920797A/en
Priority to DE69708092T priority patent/DE69708092T2/de
Priority to EP97923394A priority patent/EP0907481B1/de
Priority to IDP971390A priority patent/ID16837A/id
Publication of SG66304A1 publication Critical patent/SG66304A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/0082—Dust eliminating means; Mould or press ram cleaning means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/006—Handling moulds, e.g. between a mould store and a moulding machine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/06—Injection moulding apparatus using movable moulds or mould halves mounted on a turntable, i.e. on a rotating support having a rotating axis parallel to the mould opening, closing or clamping direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1756—Handling of moulds or mould parts, e.g. mould exchanging means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/66—Mould opening, closing or clamping devices mechanical
    • B29C2045/664—Mould opening, closing or clamping devices mechanical using mould clamping means operating independently from the mould closing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG1996009523A 1996-04-25 1996-04-25 Injection moulding apparatus and method SG66304A1 (en)

Priority Applications (20)

Application Number Priority Date Filing Date Title
SG1996009523A SG66304A1 (en) 1996-04-25 1996-04-25 Injection moulding apparatus and method
TW085112064A TW316870B (en) 1996-04-25 1996-10-01 Injection molding apparatus integrated circuits encapsulation apparatus and method for encapsulating intergrated circuits
CN97194030A CN1082425C (zh) 1996-04-25 1997-04-24 注射模制设备和方法
DE69709103T DE69709103T2 (de) 1996-04-25 1997-04-24 Verbesserung an einer spritzgiessmaschine
PCT/SG1997/000017 WO1997039870A1 (en) 1996-04-25 1997-04-24 Injection molding apparatus and method
JP09538007A JP2001500074A (ja) 1996-04-25 1997-04-24 射出成形の装置および方法
US09/171,660 US6254378B1 (en) 1996-04-25 1997-04-24 Injection molding apparatus
AU29206/97A AU2920697A (en) 1996-04-25 1997-04-24 Improvement in injection molding apparatus
JP09538006A JP2001501550A (ja) 1996-04-25 1997-04-24 射出成形装置
CA002252564A CA2252564A1 (en) 1996-04-25 1997-04-24 Injection molding apparatus and method
US09/171,662 US6461558B1 (en) 1996-04-25 1997-04-24 Injection molding apparatus and method
CN97194029A CN1087216C (zh) 1996-04-25 1997-04-24 改进的注射模制设备和闭合夹紧模压机的方法
CA002252562A CA2252562A1 (en) 1996-04-25 1997-04-24 Improvement in injection molding apparatus
PCT/SG1997/000016 WO1997039873A1 (en) 1996-04-25 1997-04-24 Improvement in injection molding apparatus
EP97923393A EP0907489B1 (de) 1996-04-25 1997-04-24 Verbesserung an einer spritzgiessmaschine
KR1019980708631A KR20000010662A (ko) 1996-04-25 1997-04-24 사출 성형 장치와 방법
AU29207/97A AU2920797A (en) 1996-04-25 1997-04-24 Injection molding apparatus and method
DE69708092T DE69708092T2 (de) 1996-04-25 1997-04-24 Spritzgiessvorrichtung und spritzgiessverfahren
EP97923394A EP0907481B1 (de) 1996-04-25 1997-04-24 Spritzgiessvorrichtung und spritzgiessverfahren
IDP971390A ID16837A (id) 1996-04-25 1997-04-25 Metode dan alat pembentuk dengan sistem injeksi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG1996009523A SG66304A1 (en) 1996-04-25 1996-04-25 Injection moulding apparatus and method

Publications (1)

Publication Number Publication Date
SG66304A1 true SG66304A1 (en) 1999-07-20

Family

ID=20429399

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996009523A SG66304A1 (en) 1996-04-25 1996-04-25 Injection moulding apparatus and method

Country Status (12)

Country Link
US (1) US6461558B1 (de)
EP (1) EP0907481B1 (de)
JP (1) JP2001500074A (de)
KR (1) KR20000010662A (de)
CN (1) CN1082425C (de)
AU (1) AU2920797A (de)
CA (1) CA2252564A1 (de)
DE (1) DE69708092T2 (de)
ID (1) ID16837A (de)
SG (1) SG66304A1 (de)
TW (1) TW316870B (de)
WO (1) WO1997039870A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6753628B1 (en) 1999-07-29 2004-06-22 Encap Motor Corporation High speed spindle motor for disc drive
US6300695B1 (en) 1999-07-29 2001-10-09 Encap Motor Corporation High speed spindle motor with hydrodynamic bearings
US6362554B1 (en) 1999-07-29 2002-03-26 Encap Motor Corporation Stator assembly
AU2580301A (en) 1999-12-17 2001-06-25 Encap Motor Corporation Spindle motor with encapsulated stator and method of making same
SE520529C2 (sv) * 2000-12-27 2003-07-22 Ericsson Telefon Ab L M Metod för tillverkning av avskärmningslåda och avskärmningslåda
US6808661B2 (en) * 2001-12-11 2004-10-26 Asm Technology Singapore Pte Ltd. Method for encapsulating leadframe-mounted integrated circuits
US20050019443A1 (en) * 2003-03-17 2005-01-27 Boyd Kathleen C. Rotary injection molding apparatus and method for use
CN100391712C (zh) * 2003-05-29 2008-06-04 吕启晟 模塑制品连续成型机
JP2005104071A (ja) * 2003-10-01 2005-04-21 Toyota Motor Corp 成形装置および専用型の段替方法
JP4643717B2 (ja) * 2009-02-06 2011-03-02 株式会社東芝 射出成形機
KR101084801B1 (ko) * 2009-02-18 2011-11-21 삼성에스디아이 주식회사 이차 전지의 제조 방법 및 이에 의해 제조된 이차 전지
CN105538590A (zh) * 2009-12-24 2016-05-04 库尔蒂建筑机械有限公司 注塑机
US20150076735A1 (en) * 2013-09-16 2015-03-19 Tyco Electronics Corporation Injection molding machine
JP2015168175A (ja) * 2014-03-07 2015-09-28 株式会社エムティアール 軸受部材のライナー注入装置
CN104908356A (zh) * 2015-05-29 2015-09-16 许炎章 一种自动换刀数控卧式键镜床分度工作台
IT201600068534A1 (it) * 2016-07-01 2018-01-01 Gd Spa Macchina confezionatrice per realizzare capsule contenenti rispettive dosi di prodotto incoerente.
ES2814006T3 (es) 2016-10-18 2021-03-25 Aisapack Holding Sa Procedimiento y dispositivo de sobremoldeo por inyección
CN108582649B (zh) * 2018-03-26 2019-12-03 宁波力松注塑科技有限公司 一种注塑机用的切换式复合模具
CN108297346A (zh) * 2018-03-27 2018-07-20 东莞市星洁电器五金有限公司 一种新型线束触头注塑模条运转机构
WO2020065118A2 (es) * 2018-09-27 2020-04-02 Simplicity Works Europe, S.L. Molde, máquina y procedimiento para la fabricación de artículos tridimensionales y planta de fabricación asociada a la misma
WO2020208575A1 (fr) * 2019-04-11 2020-10-15 Compagnie Générale Des Établissements Michelin Bandage plein en matériau élastomère pour galet de roulement de telepherique
CN114007834B (zh) * 2019-05-17 2023-08-29 佳能弗吉尼亚股份有限公司 制造方法和注射成型系统
CN111545703B (zh) * 2020-05-13 2021-11-05 嘉兴日正五金制造有限公司 一种精密铸造工艺及其相关设备
CN116994966B (zh) * 2023-08-22 2024-03-15 江苏仁泽环境科技有限公司 一种半导体自动化封装设备及其封装工艺
CN117283805B (zh) * 2023-10-31 2024-02-27 河北荣祥鞋业有限公司 一种具有防护功能的劳保鞋注塑机成型模具及工艺

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DE717122C (de) 1939-03-11 1942-02-06 Siemens Schuckertwereke Ag Verfahren und Vorrichtung zum Herstellen von Formkoerpern aus plastischen Massen, insbesondere haertbaren Kunstharzen
US4307057A (en) * 1980-06-13 1981-12-22 Siebolt Hettinga Method for aligning an injection mold with a nozzle at the mold injection station
US4424015A (en) 1981-03-12 1984-01-03 Pemco-Kalamazoo, Inc. Apparatus for injection molding
JPS60110414A (ja) * 1983-11-21 1985-06-15 Matsushita Electric Ind Co Ltd ロ−タリ−成形機
IN164804B (de) 1984-08-13 1989-06-03 Lrc Products
DE3505155A1 (de) * 1985-02-15 1986-08-21 Elastogran Maschinenbau GmbH, 2844 Lemförde Vorrichtung zur herstellung von formteilen aus mehrkomponentenkunststoff, insbesondere polyurethan, mit einer programmsteuerung
JPS6270013A (ja) * 1985-09-24 1987-03-31 Matsushita Electric Works Ltd 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入方法
JPS6315715A (ja) * 1986-07-08 1988-01-22 Sanshin Kogyo Kk 自動封止成型装置
JP2902539B2 (ja) * 1993-05-26 1999-06-07 東海ゴム工業株式会社 成形品の製造装置及び製造方法
NL9302265A (nl) * 1993-12-24 1995-07-17 Asm Fico Tooling Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets.
US5698242A (en) * 1995-12-20 1997-12-16 General Instrument Corporation Of Delaware Apparatus for the injection molding of semiconductor elements

Also Published As

Publication number Publication date
AU2920797A (en) 1997-11-12
JP2001500074A (ja) 2001-01-09
CN1216491A (zh) 1999-05-12
KR20000010662A (ko) 2000-02-25
US6461558B1 (en) 2002-10-08
CN1082425C (zh) 2002-04-10
DE69708092T2 (de) 2002-08-14
WO1997039870A1 (en) 1997-10-30
DE69708092D1 (de) 2001-12-13
ID16837A (id) 1997-11-13
EP0907481A1 (de) 1999-04-14
EP0907481B1 (de) 2001-11-07
CA2252564A1 (en) 1997-10-30
TW316870B (en) 1997-10-01

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