DE69708092T2 - Spritzgiessvorrichtung und spritzgiessverfahren - Google Patents

Spritzgiessvorrichtung und spritzgiessverfahren

Info

Publication number
DE69708092T2
DE69708092T2 DE69708092T DE69708092T DE69708092T2 DE 69708092 T2 DE69708092 T2 DE 69708092T2 DE 69708092 T DE69708092 T DE 69708092T DE 69708092 T DE69708092 T DE 69708092T DE 69708092 T2 DE69708092 T2 DE 69708092T2
Authority
DE
Germany
Prior art keywords
injection molding
molding method
molding device
injection
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69708092T
Other languages
English (en)
Other versions
DE69708092D1 (de
Inventor
Hans Lothar Berghoff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fastech System S Pte Ltd
Original Assignee
Fastech System S Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fastech System S Pte Ltd filed Critical Fastech System S Pte Ltd
Publication of DE69708092D1 publication Critical patent/DE69708092D1/de
Application granted granted Critical
Publication of DE69708092T2 publication Critical patent/DE69708092T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/06—Injection moulding apparatus using movable moulds or mould halves mounted on a turntable, i.e. on a rotating support having a rotating axis parallel to the mould opening, closing or clamping direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/0082—Dust eliminating means; Mould or press ram cleaning means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/006—Handling moulds, e.g. between a mould store and a moulding machine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1756—Handling of moulds or mould parts, e.g. mould exchanging means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/66—Mould opening, closing or clamping devices mechanical
    • B29C2045/664—Mould opening, closing or clamping devices mechanical using mould clamping means operating independently from the mould closing means
DE69708092T 1996-04-25 1997-04-24 Spritzgiessvorrichtung und spritzgiessverfahren Expired - Fee Related DE69708092T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG1996009523A SG66304A1 (en) 1996-04-25 1996-04-25 Injection moulding apparatus and method
PCT/SG1997/000017 WO1997039870A1 (en) 1996-04-25 1997-04-24 Injection molding apparatus and method

Publications (2)

Publication Number Publication Date
DE69708092D1 DE69708092D1 (de) 2001-12-13
DE69708092T2 true DE69708092T2 (de) 2002-08-14

Family

ID=20429399

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69708092T Expired - Fee Related DE69708092T2 (de) 1996-04-25 1997-04-24 Spritzgiessvorrichtung und spritzgiessverfahren

Country Status (12)

Country Link
US (1) US6461558B1 (de)
EP (1) EP0907481B1 (de)
JP (1) JP2001500074A (de)
KR (1) KR20000010662A (de)
CN (1) CN1082425C (de)
AU (1) AU2920797A (de)
CA (1) CA2252564A1 (de)
DE (1) DE69708092T2 (de)
ID (1) ID16837A (de)
SG (1) SG66304A1 (de)
TW (1) TW316870B (de)
WO (1) WO1997039870A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108582649A (zh) * 2018-03-26 2018-09-28 宁波力松注塑科技有限公司 一种注塑机用的切换式复合模具

Families Citing this family (24)

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US6362554B1 (en) 1999-07-29 2002-03-26 Encap Motor Corporation Stator assembly
US6753628B1 (en) 1999-07-29 2004-06-22 Encap Motor Corporation High speed spindle motor for disc drive
US6300695B1 (en) 1999-07-29 2001-10-09 Encap Motor Corporation High speed spindle motor with hydrodynamic bearings
AU2580301A (en) 1999-12-17 2001-06-25 Encap Motor Corporation Spindle motor with encapsulated stator and method of making same
SE520529C2 (sv) * 2000-12-27 2003-07-22 Ericsson Telefon Ab L M Metod för tillverkning av avskärmningslåda och avskärmningslåda
US6808661B2 (en) * 2001-12-11 2004-10-26 Asm Technology Singapore Pte Ltd. Method for encapsulating leadframe-mounted integrated circuits
EP1658168A4 (de) * 2003-03-17 2011-01-12 Vmi Holland Bv Rotationsspritzgiessvorrichtung und verwendungsverfahren
CN100391712C (zh) * 2003-05-29 2008-06-04 吕启晟 模塑制品连续成型机
JP2005104071A (ja) * 2003-10-01 2005-04-21 Toyota Motor Corp 成形装置および専用型の段替方法
JP4643717B2 (ja) * 2009-02-06 2011-03-02 株式会社東芝 射出成形機
KR101084801B1 (ko) * 2009-02-18 2011-11-21 삼성에스디아이 주식회사 이차 전지의 제조 방법 및 이에 의해 제조된 이차 전지
CN105538590A (zh) * 2009-12-24 2016-05-04 库尔蒂建筑机械有限公司 注塑机
US20150076735A1 (en) * 2013-09-16 2015-03-19 Tyco Electronics Corporation Injection molding machine
JP2015168175A (ja) * 2014-03-07 2015-09-28 株式会社エムティアール 軸受部材のライナー注入装置
CN104908356A (zh) * 2015-05-29 2015-09-16 许炎章 一种自动换刀数控卧式键镜床分度工作台
IT201600068534A1 (it) * 2016-07-01 2018-01-01 Gd Spa Macchina confezionatrice per realizzare capsule contenenti rispettive dosi di prodotto incoerente.
EP3529024B1 (de) 2016-10-18 2020-07-15 Aisapack Holding SA Prozess und vorrichtung zum umspritzen eines einlegeteils
CN108297346A (zh) * 2018-03-27 2018-07-20 东莞市星洁电器五金有限公司 一种新型线束触头注塑模条运转机构
EP3858575B1 (de) * 2018-09-27 2023-08-16 Simplicity Works Europe, S.L. Werkzeugform, maschine und prozess zur herstellung von dreidimensionalen teilen und damit asoziierte fertigungshalle
CN113661053B (zh) * 2019-04-11 2023-04-14 米其林集团总公司 用于缆索铁路的滚轮的由弹性体材料制成的实心轮胎
CN116872430A (zh) * 2019-05-17 2023-10-13 佳能弗吉尼亚股份有限公司 制造方法和注射成型系统
CN111545703B (zh) * 2020-05-13 2021-11-05 嘉兴日正五金制造有限公司 一种精密铸造工艺及其相关设备
CN116994966B (zh) * 2023-08-22 2024-03-15 江苏仁泽环境科技有限公司 一种半导体自动化封装设备及其封装工艺
CN117283805B (zh) * 2023-10-31 2024-02-27 河北荣祥鞋业有限公司 一种具有防护功能的劳保鞋注塑机成型模具及工艺

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
DE717122C (de) 1939-03-11 1942-02-06 Siemens Schuckertwereke Ag Verfahren und Vorrichtung zum Herstellen von Formkoerpern aus plastischen Massen, insbesondere haertbaren Kunstharzen
US4307057A (en) 1980-06-13 1981-12-22 Siebolt Hettinga Method for aligning an injection mold with a nozzle at the mold injection station
US4424015A (en) * 1981-03-12 1984-01-03 Pemco-Kalamazoo, Inc. Apparatus for injection molding
JPS60110414A (ja) * 1983-11-21 1985-06-15 Matsushita Electric Ind Co Ltd ロ−タリ−成形機
IN164804B (de) * 1984-08-13 1989-06-03 Lrc Products
DE3505155A1 (de) * 1985-02-15 1986-08-21 Elastogran Maschinenbau GmbH, 2844 Lemförde Vorrichtung zur herstellung von formteilen aus mehrkomponentenkunststoff, insbesondere polyurethan, mit einer programmsteuerung
JPS6270013A (ja) * 1985-09-24 1987-03-31 Matsushita Electric Works Ltd 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入方法
JPS6315715A (ja) * 1986-07-08 1988-01-22 Sanshin Kogyo Kk 自動封止成型装置
JP2902539B2 (ja) * 1993-05-26 1999-06-07 東海ゴム工業株式会社 成形品の製造装置及び製造方法
NL9302265A (nl) * 1993-12-24 1995-07-17 Asm Fico Tooling Werkwijze en pellet voor het omhullen van leadframes en inrichting voor het vervaardigen van pellets.
US5698242A (en) * 1995-12-20 1997-12-16 General Instrument Corporation Of Delaware Apparatus for the injection molding of semiconductor elements

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108582649A (zh) * 2018-03-26 2018-09-28 宁波力松注塑科技有限公司 一种注塑机用的切换式复合模具

Also Published As

Publication number Publication date
DE69708092D1 (de) 2001-12-13
TW316870B (en) 1997-10-01
SG66304A1 (en) 1999-07-20
ID16837A (id) 1997-11-13
KR20000010662A (ko) 2000-02-25
EP0907481B1 (de) 2001-11-07
EP0907481A1 (de) 1999-04-14
WO1997039870A1 (en) 1997-10-30
AU2920797A (en) 1997-11-12
CN1216491A (zh) 1999-05-12
JP2001500074A (ja) 2001-01-09
CA2252564A1 (en) 1997-10-30
CN1082425C (zh) 2002-04-10
US6461558B1 (en) 2002-10-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: KRAMER - BARSKE - SCHMIDTCHEN, 81245 MUENCHEN

8339 Ceased/non-payment of the annual fee