HK28096A - Packaging of semiconductor integrated circuits - Google Patents

Packaging of semiconductor integrated circuits

Info

Publication number
HK28096A
HK28096A HK28096A HK28096A HK28096A HK 28096 A HK28096 A HK 28096A HK 28096 A HK28096 A HK 28096A HK 28096 A HK28096 A HK 28096A HK 28096 A HK28096 A HK 28096A
Authority
HK
Hong Kong
Prior art keywords
wafers
packaging
integrated circuits
semiconductor integrated
edges
Prior art date
Application number
HK28096A
Other languages
English (en)
Inventor
Masanori Tazunoki
Hiromitsu Mishimagi
Makoto Homma
Toshiyuki Sakuta
Hisashi Nakamura
Keiji Sasaki
Minoru Enomoto
Toshihiko Satoh
Kunizo Sahara
Shigeo Kuroda
Kanji Otsuka
Masao Kawamura
Hinoko Kurosawa
Kazuya Ito
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62097326A external-priority patent/JPS63263747A/ja
Priority claimed from JP62097331A external-priority patent/JPS63263735A/ja
Priority claimed from JP62097329A external-priority patent/JPS63263736A/ja
Priority claimed from JP62097330A external-priority patent/JPS63263734A/ja
Priority claimed from JP62099779A external-priority patent/JPS63266700A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of HK28096A publication Critical patent/HK28096A/xx

Links

Classifications

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    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Packaging Frangible Articles (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
  • Semiconductor Memories (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
HK28096A 1987-04-22 1996-02-15 Packaging of semiconductor integrated circuits HK28096A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP62097326A JPS63263747A (ja) 1987-04-22 1987-04-22 実装基板の製造方法
JP62097331A JPS63263735A (ja) 1987-04-22 1987-04-22 半導体集積回路の実装装置
JP62097329A JPS63263736A (ja) 1987-04-22 1987-04-22 半導体装置
JP62097330A JPS63263734A (ja) 1987-04-22 1987-04-22 半導体集積回路の実装装置
JP62099779A JPS63266700A (ja) 1987-04-24 1987-04-24 ウエハ大半導体集積回路装置

Publications (1)

Publication Number Publication Date
HK28096A true HK28096A (en) 1996-02-23

Family

ID=27525857

Family Applications (2)

Application Number Title Priority Date Filing Date
HK28096A HK28096A (en) 1987-04-22 1996-02-15 Packaging of semiconductor integrated circuits
HK98101603A HK1003348A1 (en) 1987-04-22 1998-03-02 Wafer-scale semiconductor integrated circuit device

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK98101603A HK1003348A1 (en) 1987-04-22 1998-03-02 Wafer-scale semiconductor integrated circuit device

Country Status (5)

Country Link
EP (2) EP0288186B1 (ko)
KR (2) KR960012649B1 (ko)
DE (2) DE3856019T2 (ko)
HK (2) HK28096A (ko)
SG (1) SG36588G (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960703274A (ko) * 1993-06-23 1996-06-19 토마스 씨, 토코스 분리 실리콘기판을 사용하여 전기적 열적으로 향상된 팩키지(electrically and thermally enhanced package using a separate silicon substrate)
US5598031A (en) * 1993-06-23 1997-01-28 Vlsi Technology, Inc. Electrically and thermally enhanced package using a separate silicon substrate
KR19980064369A (ko) * 1996-12-19 1998-10-07 윌리엄비.켐플러 메모리 모듈, 메모리 탑 및 메모리 모듈 구성 방법
JP2001102523A (ja) * 1999-09-28 2001-04-13 Sony Corp 薄膜デバイスおよびその製造方法
JP2003229517A (ja) 2002-01-31 2003-08-15 Fujitsu Hitachi Plasma Display Ltd 半導体チップ実装基板及びフラットディスプレイ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3908155A (en) * 1974-04-19 1975-09-23 Ibm Wafer circuit package
DE2611749C3 (de) * 1976-03-19 1980-11-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiteranordnung mit einem über Spannbolzen durch Druck kontaktierbaren Halbleiterbauelement
JPS5618439A (en) * 1979-07-25 1981-02-21 Fujitsu Ltd Semiconductor device consisting of different ic
JPH0620107B2 (ja) * 1985-09-25 1994-03-16 日本電気株式会社 半導体装置

Also Published As

Publication number Publication date
SG36588G (en) 1995-09-01
EP0516185B1 (en) 1997-09-03
HK1003348A1 (en) 1998-10-23
EP0516185A2 (en) 1992-12-02
KR970001885B1 (en) 1997-02-18
EP0288186B1 (en) 1993-06-30
EP0288186A3 (en) 1990-05-23
KR960012649B1 (en) 1996-09-23
KR930020560A (ko) 1993-10-20
EP0288186A2 (en) 1988-10-26
EP0516185A3 (en) 1993-03-17
DE3856019T2 (de) 1998-04-02
DE3882074D1 (de) 1993-08-05
DE3856019D1 (de) 1997-10-09
KR880013223A (ko) 1988-11-30
DE3882074T2 (de) 1993-10-07

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