HK179096A - Thermal annealing of palladium alloys - Google Patents

Thermal annealing of palladium alloys Download PDF

Info

Publication number
HK179096A
HK179096A HK179096A HK179096A HK179096A HK 179096 A HK179096 A HK 179096A HK 179096 A HK179096 A HK 179096A HK 179096 A HK179096 A HK 179096A HK 179096 A HK179096 A HK 179096A
Authority
HK
Hong Kong
Prior art keywords
alloy
nickel
palladium
annealing
temperature
Prior art date
Application number
HK179096A
Other languages
German (de)
English (en)
French (fr)
Inventor
Anthony Abys Joseph
Veljko Kadija Igor
John Maison Joseph Jr
Nakahara Shohei
Original Assignee
At&T Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At&T Corp. filed Critical At&T Corp.
Publication of HK179096A publication Critical patent/HK179096A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
HK179096A 1991-07-22 1996-09-26 Thermal annealing of palladium alloys HK179096A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/733,492 US5180482A (en) 1991-07-22 1991-07-22 Thermal annealing of palladium alloys

Publications (1)

Publication Number Publication Date
HK179096A true HK179096A (en) 1996-10-04

Family

ID=24947830

Family Applications (1)

Application Number Title Priority Date Filing Date
HK179096A HK179096A (en) 1991-07-22 1996-09-26 Thermal annealing of palladium alloys

Country Status (9)

Country Link
US (1) US5180482A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0524760B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP2607002B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR950004992B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA2069363C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE69210704T2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
HK (1) HK179096A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
SG (1) SG43778A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW208046B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7628339B2 (en) 1991-04-24 2009-12-08 Novartis Pharma Ag Systems and methods for controlling fluid feed to an aerosol generator
US6540154B1 (en) * 1991-04-24 2003-04-01 Aerogen, Inc. Systems and methods for controlling fluid feed to an aerosol generator
EP0600570A1 (en) * 1992-11-30 1994-06-08 Dynapro Thin Film Products Inc. Touch switch with coating for inhibiting increased contact resistance
US7200930B2 (en) * 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US5665639A (en) * 1994-02-23 1997-09-09 Cypress Semiconductor Corp. Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal
US6205999B1 (en) 1995-04-05 2001-03-27 Aerogen, Inc. Methods and apparatus for storing chemical compounds in a portable inhaler
US5758637A (en) 1995-08-31 1998-06-02 Aerogen, Inc. Liquid dispensing apparatus and methods
US6085740A (en) 1996-02-21 2000-07-11 Aerogen, Inc. Liquid dispensing apparatus and methods
KR960039315A (ko) * 1995-04-06 1996-11-25 이대원 리드프레임 제조방법
FR2766396B1 (fr) * 1997-07-25 1999-10-01 Radiall Sa Procede pour revetir une piece metallique destinee a etre brasee, revetement utilise a cet effet et piece ainsi revetue
US6807734B2 (en) * 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
US6235177B1 (en) 1999-09-09 2001-05-22 Aerogen, Inc. Method for the construction of an aperture plate for dispensing liquid droplets
US6335107B1 (en) 1999-09-23 2002-01-01 Lucent Technologies Inc. Metal article coated with multilayer surface finish for porosity reduction
US7600511B2 (en) * 2001-11-01 2009-10-13 Novartis Pharma Ag Apparatus and methods for delivery of medicament to a respiratory system
US7100600B2 (en) 2001-03-20 2006-09-05 Aerogen, Inc. Fluid filled ampoules and methods for their use in aerosolizers
US6948491B2 (en) * 2001-03-20 2005-09-27 Aerogen, Inc. Convertible fluid feed system with comformable reservoir and methods
MXPA02010884A (es) * 2000-05-05 2003-03-27 Aerogen Ireland Ltd Aparato y metodo para el suministro de medicamentos al sistema respiratorio.
US7971588B2 (en) * 2000-05-05 2011-07-05 Novartis Ag Methods and systems for operating an aerosol generator
US8336545B2 (en) * 2000-05-05 2012-12-25 Novartis Pharma Ag Methods and systems for operating an aerosol generator
US6546927B2 (en) 2001-03-13 2003-04-15 Aerogen, Inc. Methods and apparatus for controlling piezoelectric vibration
US6732944B2 (en) * 2001-05-02 2004-05-11 Aerogen, Inc. Base isolated nebulizing device and methods
AU2003202925B2 (en) 2002-01-07 2008-12-18 Aerogen, Inc. Devices and methods for nebulizing fluids for inhalation
US20050205089A1 (en) * 2002-01-07 2005-09-22 Aerogen, Inc. Methods and devices for aerosolizing medicament
US7677467B2 (en) * 2002-01-07 2010-03-16 Novartis Pharma Ag Methods and devices for aerosolizing medicament
AU2003203043A1 (en) 2002-01-15 2003-07-30 Aerogen, Inc. Methods and systems for operating an aerosol generator
US7109111B2 (en) * 2002-02-11 2006-09-19 Applied Materials, Inc. Method of annealing metal layers
EP1509259B1 (en) * 2002-05-20 2016-04-20 Novartis AG Apparatus for providing aerosol for medical treatment and methods
US20070044792A1 (en) * 2005-08-30 2007-03-01 Aerogen, Inc. Aerosol generators with enhanced corrosion resistance
US8616195B2 (en) * 2003-07-18 2013-12-31 Novartis Ag Nebuliser for the production of aerosolized medication
US7290541B2 (en) * 2004-04-20 2007-11-06 Aerogen, Inc. Aerosol delivery apparatus and method for pressure-assisted breathing systems
BRPI0509991A (pt) * 2004-04-20 2007-10-16 Aerogen Inc aparelho de fornecimento em aerossol, métodos e composições para sistemas de respiração auxiliados por pressão
US7267121B2 (en) * 2004-04-20 2007-09-11 Aerogen, Inc. Aerosol delivery apparatus and method for pressure-assisted breathing systems
US7946291B2 (en) 2004-04-20 2011-05-24 Novartis Ag Ventilation systems and methods employing aerosol generators
SG163503A1 (en) * 2005-05-25 2010-08-30 Aerogen Inc Vibration systems and methods
JP4828884B2 (ja) * 2005-07-26 2011-11-30 株式会社東芝 プリント回路配線基板、及び電子機器
CN100388572C (zh) * 2006-03-15 2008-05-14 上海坤链电子产品有限公司 电连接器的盒式结构插孔接触件的局部电镀金方法
JP5318375B2 (ja) * 2007-06-25 2013-10-16 株式会社サンユー パラジウム−コバルト合金めっき液、パラジウム−コバルト合金被膜の形成方法及びパラジウム−コバルト合金硬質被膜の製造方法
JP4846740B2 (ja) * 2008-01-23 2011-12-28 旭鍍金株式会社 めっき物の製造方法及び電気めっき方法
US7842170B1 (en) * 2009-03-09 2010-11-30 Von Detten Volker Device for selective plating of electrical contacts for connectors
CN103415398B (zh) 2010-12-28 2016-08-10 斯坦福设备有限公司 光限定孔板以及其制备方法
WO2013186031A2 (en) * 2012-06-11 2013-12-19 Stamford Devices Limited A method of producing an aperture plate for a nebulizer
US10279357B2 (en) 2014-05-23 2019-05-07 Stamford Devices Limited Method for producing an aperture plate

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3925170A (en) * 1974-01-23 1975-12-09 American Chem & Refining Co Method and composition for producing bright palladium electrodepositions
GB1495910A (en) * 1975-10-30 1977-12-21 Ibm Method and bath for electroplating palladium on an articl
US4066517A (en) * 1976-03-11 1978-01-03 Oxy Metal Industries Corporation Electrodeposition of palladium
JPS569387A (en) * 1979-07-04 1981-01-30 Seiko Instr & Electronics Ltd Plating method of decorative article
JPS6019630B2 (ja) * 1979-07-18 1985-05-17 日本鉱業株式会社 接触子
US4319967A (en) * 1979-11-01 1982-03-16 Bell Telephone Laboratories, Incorporated Fabrication of palladium anode for X-ray lithography
JPS5772284A (en) * 1980-10-21 1982-05-06 Fujitsu Ltd Method of producing electric contactor
US4486274A (en) * 1981-02-27 1984-12-04 At&T Bell Laboratories Palladium plating prodedure
US4468296A (en) * 1982-12-10 1984-08-28 At&T Bell Laboratories Process for electroplating palladium
JPH0244106B2 (ja) * 1985-06-17 1990-10-02 Yazaki Corp Denkyosetsuten
JPS6353872A (ja) * 1986-08-22 1988-03-08 三菱電機株式会社 接触子用材料
US4911798A (en) * 1988-12-20 1990-03-27 At&T Bell Laboratories Palladium alloy plating process
US4911799A (en) * 1989-08-29 1990-03-27 At&T Bell Laboratories Electrodeposition of palladium films

Also Published As

Publication number Publication date
CA2069363A1 (en) 1993-01-23
EP0524760A2 (en) 1993-01-27
TW208046B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-06-21
SG43778A1 (en) 1997-11-14
EP0524760A3 (en) 1994-07-13
JPH05190250A (ja) 1993-07-30
EP0524760B1 (en) 1996-05-15
CA2069363C (en) 1999-05-18
KR950004992B1 (ko) 1995-05-16
JP2607002B2 (ja) 1997-05-07
DE69210704T2 (de) 1996-10-10
US5180482A (en) 1993-01-19
KR930003459A (ko) 1993-02-24
DE69210704D1 (de) 1996-06-20

Similar Documents

Publication Publication Date Title
EP0524760B1 (en) Thermal annealing of palladium alloys
US6627011B2 (en) Process for producing connector copper alloys
EP2743381B1 (en) Tin-plated copper alloy terminal member with outstanding insertion and removal characteristics
EP3187627B1 (en) Conductive material for connection parts which has excellent fretting wear resistance
US6755958B2 (en) Barrier layer for electrical connectors and methods of applying the layer
EP2682263A2 (en) Tin-plated copper-alloy material for terminal and method for producing the same
US6207035B1 (en) Method for manufacturing a metallic composite strip
JP4522970B2 (ja) ウィスカーが抑制されたＣｕ−Ｚｎ合金耐熱Ｓｎめっき条
US2304709A (en) Method of coating ferrous articles
JP2007092173A (ja) Ｃｕ−Ｎｉ−Ｓｉ−Ｚｎ系合金すずめっき条
US20030129076A1 (en) Connector copper alloys and a process for producing the same
WO2021166581A1 (ja) コネクタ用端子材
JP2005154819A (ja) 嵌合型接続端子
JP5226032B2 (ja) ウィスカーが抑制されたＣｕ−Ｚｎ合金耐熱Ｓｎめっき条
US4246322A (en) Platinum alloy jewellery wire
JP6809265B2 (ja) 貴金属層付銅端子材の製造方法
JP2587258B2 (ja) 銅又は銅合金を母材としたリフロー錫又は錫合金めっき材の製造方法
JPH0297696A (ja) Ｎｉ‐Ｔｉ基合金材及びその製造方法
JPH0344454A (ja) 電子部品および機器用リード線の製造方法
JP3515226B2 (ja) 銀被覆バネ用りん青銅とその製造方法
JP3314268B2 (ja) 柔軟性のあるケーブル用線状導体の製造方法
JPH03202495A (ja) リフロー錫めっき線材の製造方法
JPH09282961A (ja) 電気接点材料及びその製造方法
JPH03202490A (ja) リフロー錫めっき線材の製造方法
JPH01180951A (ja) 端子、コネクター用ニッケルめっき銅合金条の製造方法

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)