HK123293A - Low softening point metallic oxide glasses suitable for use in electronic applications - Google Patents
Low softening point metallic oxide glasses suitable for use in electronic applicationsInfo
- Publication number
- HK123293A HK123293A HK1232/93A HK123293A HK123293A HK 123293 A HK123293 A HK 123293A HK 1232/93 A HK1232/93 A HK 1232/93A HK 123293 A HK123293 A HK 123293A HK 123293 A HK123293 A HK 123293A
- Authority
- HK
- Hong Kong
- Prior art keywords
- low softening
- electronic applications
- softening point
- metallic oxide
- oxide glasses
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0103—Zinc [Zn]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01052—Tellurium [Te]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Glass Compositions (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/340,183 US4945071A (en) | 1989-04-19 | 1989-04-19 | Low softening point metallic oxide glasses suitable for use in electronic applications |
Publications (1)
Publication Number | Publication Date |
---|---|
HK123293A true HK123293A (en) | 1993-11-19 |
Family
ID=23332249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK1232/93A HK123293A (en) | 1989-04-19 | 1993-11-11 | Low softening point metallic oxide glasses suitable for use in electronic applications |
Country Status (7)
Country | Link |
---|---|
US (1) | US4945071A (ja) |
EP (1) | EP0393416B1 (ja) |
JP (1) | JP2703385B2 (ja) |
KR (1) | KR920010092B1 (ja) |
DE (1) | DE69002078T2 (ja) |
HK (1) | HK123293A (ja) |
PH (1) | PH27455A (ja) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04270140A (ja) * | 1990-06-21 | 1992-09-25 | Johnson Matthey Inc | シーリングガラス組成物および導電性成分を含む同組成物 |
US5013697A (en) * | 1990-06-21 | 1991-05-07 | Johnson Matthey Inc. | Sealing glass compositions |
GB9015072D0 (en) * | 1990-07-09 | 1990-08-29 | Cookson Group Plc | Glass composition |
JPH04202710A (ja) * | 1990-11-30 | 1992-07-23 | Daido Steel Co Ltd | 真空精錬方法 |
WO1993002980A1 (en) * | 1991-08-07 | 1993-02-18 | Vlsi Packaging Materials, Inc. | Low temperature lead vanadium sealing glass compositions |
DE4128804A1 (de) * | 1991-08-30 | 1993-03-04 | Demetron | Bleifreies, niedrigschmelzendes glas |
US5188990A (en) * | 1991-11-21 | 1993-02-23 | Vlsi Packaging Materials | Low temperature sealing glass compositions |
US5334558A (en) * | 1992-10-19 | 1994-08-02 | Diemat, Inc. | Low temperature glass with improved thermal stress properties and method of use |
US5663109A (en) * | 1992-10-19 | 1997-09-02 | Quantum Materials, Inc. | Low temperature glass paste with high metal to glass ratio |
US5648302A (en) * | 1996-09-13 | 1997-07-15 | Sandia Corporation | Sealing glasses for titanium and titanium alloys |
US5693580A (en) * | 1996-09-13 | 1997-12-02 | Sandia Corporation | Titanium sealing glasses and seals formed therefrom |
US6376399B1 (en) * | 2000-01-24 | 2002-04-23 | Corning Incorporated | Tungstate, molybdate, vanadate base glasses |
US6664567B2 (en) * | 2001-06-28 | 2003-12-16 | Kyocera Corporation | Photoelectric conversion device, glass composition for coating silicon, and insulating coating in contact with silicon |
WO2003023460A2 (en) * | 2001-09-07 | 2003-03-20 | Shipley Company, Llc | Glass bonded fiber array and method for the fabrication thereof |
US7009213B2 (en) * | 2003-07-31 | 2006-03-07 | Lumileds Lighting U.S., Llc | Light emitting devices with improved light extraction efficiency |
TWI251455B (en) * | 2004-07-06 | 2006-03-11 | Advanced Semiconductor Eng | A manufacturing method of a multi-layer circuit board with embedded passive components |
US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
KR100772501B1 (ko) * | 2005-06-30 | 2007-11-01 | 한국전자통신연구원 | 텔루라이트 유리 조성물, 이를 이용한 광도파로 및광증폭기 |
DE102009036395A1 (de) * | 2009-04-30 | 2010-11-04 | Osram Opto Semiconductors Gmbh | Bauteil mit einem ersten und einem zweiten Substrat und Verfahren zu dessen Herstellung |
JP5559509B2 (ja) | 2009-10-28 | 2014-07-23 | 昭栄化学工業株式会社 | 太陽電池電極形成用導電性ペースト |
JP5559510B2 (ja) * | 2009-10-28 | 2014-07-23 | 昭栄化学工業株式会社 | 太陽電池素子及びその製造方法 |
DE102010006072A1 (de) * | 2010-01-28 | 2011-08-18 | OSRAM Opto Semiconductors GmbH, 93055 | Optoelektronisches Halbleiterbauteil und Verwendung eines optoelektronischen Halbleiterbauteils in einem Kfz-Schweinwerfer |
KR102177050B1 (ko) * | 2010-05-04 | 2020-11-10 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 납- 및 텔루륨-산화물을 함유하는 후막 페이스트, 및 반도체 디바이스의 제조에 있어서의 그의 용도 |
TWI448444B (zh) * | 2010-08-11 | 2014-08-11 | Hitachi Ltd | A glass composition for an electrode, a paste for an electrode for use, and an electronic component to which the electrode is used |
JP5011428B2 (ja) | 2010-10-07 | 2012-08-29 | 昭栄化学工業株式会社 | 太陽電池素子並びにその製造方法 |
ES2572679T3 (es) | 2011-04-21 | 2016-06-01 | Shoei Chemical Inc. | Pasta conductora |
JP5726698B2 (ja) * | 2011-07-04 | 2015-06-03 | 株式会社日立製作所 | ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品 |
JP6027171B2 (ja) * | 2011-07-04 | 2016-11-16 | 株式会社日立製作所 | 封着用ガラスフリット、封着用ガラスペースト、導電性ガラスペースト、およびそれらを利用した電気電子部品 |
JP5732414B2 (ja) * | 2012-01-26 | 2015-06-10 | 株式会社日立製作所 | 接合体および半導体モジュール |
JP5816565B2 (ja) * | 2012-01-26 | 2015-11-18 | 株式会社日立産機システム | インク、被印字基材、印字装置、印字方法、被印字基材の製造方法 |
CN103377753B (zh) * | 2012-04-17 | 2017-07-14 | 赫劳斯贵金属北美康舍霍肯有限责任公司 | 用于导电糊组合物的无机反应体系 |
SG194311A1 (en) * | 2012-04-17 | 2013-11-29 | Heraeus Precious Materials North America Conshohocken Llc | Conductive thick film paste for solar cell contacts |
JP5948432B2 (ja) * | 2012-11-09 | 2016-07-06 | 株式会社日立製作所 | 配線基板とその製造方法 |
US20150337106A1 (en) * | 2012-12-26 | 2015-11-26 | Hitachi, Ltd. | Low-Melting-Point Glass Resin Composite Material and Electronic/Electric Apparatus Using Same |
WO2014115252A1 (ja) * | 2013-01-23 | 2014-07-31 | 株式会社 日立製作所 | 回路基板及び回路基板の製造方法 |
US9373558B2 (en) * | 2013-02-22 | 2016-06-21 | Hitachi, Ltd. | Resin-sealed electronic control device |
JP5844299B2 (ja) * | 2013-03-25 | 2016-01-13 | 株式会社日立製作所 | 接合材、接合構造体 |
JP5941006B2 (ja) * | 2013-03-25 | 2016-06-29 | 株式会社 日立パワーデバイス | 接合材、接合構造体およびその製造方法、並びに半導体モジュール |
JP5947238B2 (ja) * | 2013-03-25 | 2016-07-06 | 株式会社日立製作所 | ペースト、アルミニウム電線体、アルミニウム電線体の製造方法、モータ及びモータの製造方法 |
KR101608123B1 (ko) * | 2013-09-13 | 2016-03-31 | 제일모직주식회사 | 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극 |
JP6350126B2 (ja) * | 2014-08-29 | 2018-07-04 | 日立化成株式会社 | 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品 |
JP6350127B2 (ja) * | 2014-08-29 | 2018-07-04 | 日立化成株式会社 | 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品 |
DE102014014322B4 (de) * | 2014-10-01 | 2017-11-23 | Ferro Gmbh | Tellurat-Fügeglas mit Verarbeitungstemperaturen ≦ 400 °C |
JP5920513B2 (ja) * | 2015-04-23 | 2016-05-18 | 旭硝子株式会社 | 封着用無鉛ガラス、封着材料、封着材料ペースト |
JP6507826B2 (ja) * | 2015-04-28 | 2019-05-08 | 日立化成株式会社 | 導電性接合体および該接合体の製造方法 |
FR3036396B1 (fr) | 2015-05-22 | 2020-02-28 | Axon Cable | Composition de verre pour le scellement de connecteur micro-d |
JP6761250B2 (ja) * | 2016-01-19 | 2020-09-23 | クラレノリタケデンタル株式会社 | ジルコニア焼結体及び歯科用製品、並びにそれらの製造方法 |
TWI745562B (zh) | 2017-04-18 | 2021-11-11 | 美商太陽帕斯特有限責任公司 | 導電糊料組成物及用其製成的半導體裝置 |
FR3083794B1 (fr) | 2018-07-10 | 2020-07-10 | Axon Cable | Verres pour connecteur hermetique |
CN111847889A (zh) * | 2020-08-26 | 2020-10-30 | 南通天盛新能源股份有限公司 | 一种玻璃粉及含该玻璃粉的银浆 |
WO2023026771A1 (ja) * | 2021-08-26 | 2023-03-02 | 日本電気硝子株式会社 | ガラス組成物及び封着材料 |
JP2024041707A (ja) * | 2022-09-14 | 2024-03-27 | 日本電気硝子株式会社 | 封着材料層付きガラス基板及び気密パッケージの製造方法 |
FR3141693A1 (fr) | 2022-11-08 | 2024-05-10 | Axon Cable | Verres pour connecteur hermetique miniature |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3798114A (en) * | 1971-05-11 | 1974-03-19 | Owens Illinois Inc | Glasses with high content of silver oxide |
US3885975A (en) * | 1972-04-24 | 1975-05-27 | Corning Glass Works | Low melting vanadate glasses |
US4401767A (en) * | 1981-08-03 | 1983-08-30 | Johnson Matthey Inc. | Silver-filled glass |
US4459166A (en) * | 1982-03-08 | 1984-07-10 | Johnson Matthey Inc. | Method of bonding an electronic device to a ceramic substrate |
DE3434190C1 (de) * | 1984-09-18 | 1985-10-24 | Kali Und Salz Ag, 3500 Kassel | Verfahren und Vorrichtung zur Steuerung der elektrostatischen Trennung von Kalirohsalzen in elektrostatischen Freifallscheidern |
US4743302A (en) * | 1986-06-06 | 1988-05-10 | Vlsi Packaging Materials, Inc. | Low melting glass composition |
EP0258408B1 (en) * | 1986-02-19 | 1991-09-18 | Vlsi Packaging Materials, Inc. | A low melting glass composition containing pbo and v 2?o 5? |
-
1989
- 1989-04-19 US US07/340,183 patent/US4945071A/en not_active Expired - Lifetime
-
1990
- 1990-04-03 DE DE90106384T patent/DE69002078T2/de not_active Expired - Fee Related
- 1990-04-03 EP EP90106384A patent/EP0393416B1/en not_active Expired - Lifetime
- 1990-04-04 PH PH40325A patent/PH27455A/en unknown
- 1990-04-14 KR KR1019900005179A patent/KR920010092B1/ko not_active IP Right Cessation
- 1990-04-18 JP JP2100557A patent/JP2703385B2/ja not_active Expired - Lifetime
-
1993
- 1993-11-11 HK HK1232/93A patent/HK123293A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE69002078T2 (de) | 1993-10-21 |
KR900016060A (ko) | 1990-11-12 |
PH27455A (en) | 1993-07-02 |
DE69002078D1 (de) | 1993-08-05 |
JPH02293344A (ja) | 1990-12-04 |
EP0393416B1 (en) | 1993-06-30 |
US4945071A (en) | 1990-07-31 |
JP2703385B2 (ja) | 1998-01-26 |
EP0393416A1 (en) | 1990-10-24 |
KR920010092B1 (ko) | 1992-11-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |