HK1217830A1 - 通信控制裝置和安裝基板 - Google Patents

通信控制裝置和安裝基板

Info

Publication number
HK1217830A1
HK1217830A1 HK16105688.8A HK16105688A HK1217830A1 HK 1217830 A1 HK1217830 A1 HK 1217830A1 HK 16105688 A HK16105688 A HK 16105688A HK 1217830 A1 HK1217830 A1 HK 1217830A1
Authority
HK
Hong Kong
Prior art keywords
control device
communication control
mounting board
board
mounting
Prior art date
Application number
HK16105688.8A
Other languages
English (en)
Inventor
澀谷祐貴
佐佐木英樹
佃龍明
清水忠
土橋雅裕
西園晉二
久保田博子
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of HK1217830A1 publication Critical patent/HK1217830A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
    • H04B5/79—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for data transfer in combination with power transfer
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/80—Circuit arrangements or systems for wireless supply or distribution of electric power involving the exchange of data, concerning supply or distribution of electric power, between transmitting devices and receiving devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
    • H04B5/24—Inductive coupling
    • H04B5/26—Inductive coupling using coils

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)
  • Near-Field Transmission Systems (AREA)
  • Structure Of Printed Boards (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
HK16105688.8A 2013-06-14 2016-05-18 通信控制裝置和安裝基板 HK1217830A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/066420 WO2014199507A1 (ja) 2013-06-14 2013-06-14 通信制御装置及び実装基板

Publications (1)

Publication Number Publication Date
HK1217830A1 true HK1217830A1 (zh) 2017-01-20

Family

ID=52021837

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16105688.8A HK1217830A1 (zh) 2013-06-14 2016-05-18 通信控制裝置和安裝基板

Country Status (7)

Country Link
US (1) US9705363B2 (zh)
JP (1) JP6067110B2 (zh)
KR (1) KR20160019437A (zh)
CN (1) CN105284056B (zh)
HK (1) HK1217830A1 (zh)
TW (1) TWI638499B (zh)
WO (1) WO2014199507A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016051961A (ja) * 2014-08-29 2016-04-11 ルネサスエレクトロニクス株式会社 通信用電子装置
JP6512799B2 (ja) * 2014-11-27 2019-05-15 キヤノン株式会社 給電装置、制御方法及びプログラム
FR3032076A1 (fr) * 2015-01-26 2016-07-29 Stmicroelectronics Rousset Procede de gestion de la communication sans contact et de la charge sans contact au sein d'un systeme, et systeme correspondant
JP6540087B2 (ja) * 2015-02-24 2019-07-10 セイコーエプソン株式会社 回路装置及び電子機器
CN107852033B (zh) * 2015-07-10 2022-01-28 株式会社村田制作所 输电装置以及无线供电系统
JP2017112706A (ja) * 2015-12-16 2017-06-22 東芝テック株式会社 携帯端末装置
US10056332B2 (en) * 2016-09-05 2018-08-21 Renesas Electronics Corporation Electronic device with delamination resistant wiring board
US10277061B1 (en) * 2018-03-08 2019-04-30 Nxp B.V. Wireless device
JP7122902B2 (ja) * 2018-07-27 2022-08-22 日本電産サンキョー株式会社 非接触式通信モジュールおよびカードリーダ
JP7383890B2 (ja) * 2019-03-20 2023-11-21 オムロン株式会社 非接触給電装置
JP2021197647A (ja) * 2020-06-16 2021-12-27 株式会社村田製作所 電力増幅モジュール
JP2021197893A (ja) * 2020-06-18 2021-12-27 オムロン株式会社 絶縁型共振回路装置及び非接触給電システム
EP3937337B1 (en) 2020-07-09 2022-11-09 Japan Tobacco Inc. Power supply unit for aerosol inhaler comprising a temperature sensor
JP6875595B1 (ja) * 2020-07-09 2021-05-26 日本たばこ産業株式会社 エアロゾル吸引器の電源ユニット

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JP3181710B2 (ja) * 1992-08-31 2001-07-03 株式会社日立製作所 多層プリント回路基板モジュールおよび多層プリント回路基板装置
JPH09232790A (ja) * 1996-02-26 1997-09-05 Fuji Electric Co Ltd プリント基板回路のシールド方法
US7471188B2 (en) 2003-12-19 2008-12-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
JP4536496B2 (ja) * 2003-12-19 2010-09-01 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の駆動方法
WO2005081303A1 (en) * 2004-02-25 2005-09-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
EP1855315A4 (en) * 2005-02-16 2009-05-27 Hitachi Ltd ELECTRONIC BRAND CHIP
KR101299932B1 (ko) * 2006-03-10 2013-08-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2007108371A1 (en) 2006-03-15 2007-09-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7541213B2 (en) * 2006-07-21 2009-06-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP2070019A4 (en) * 2006-10-02 2015-07-01 Semiconductor Energy Lab SEMICONDUCTOR DEVICE
JP5092354B2 (ja) * 2006-10-30 2012-12-05 日本電気株式会社 両面プリント配線基板、電子機器及び両面プリント配線基板の製造方法
US7889528B2 (en) * 2006-11-29 2011-02-15 Semiconductor Energy Laroratory Co., Ltd. Rectifier circuit, power supply circuit, and semiconductor device
JP2008165744A (ja) * 2006-12-07 2008-07-17 Semiconductor Energy Lab Co Ltd 半導体装置
JP2008147573A (ja) * 2006-12-13 2008-06-26 Nec System Technologies Ltd 多層基板装置
JP2008271188A (ja) * 2007-04-20 2008-11-06 Toshiba Corp 無線機
WO2010038581A1 (en) * 2008-10-02 2010-04-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2011030404A (ja) 2009-06-22 2011-02-10 Felica Networks Inc 情報処理装置、プログラム、および情報処理システム
JP5636662B2 (ja) * 2009-10-07 2014-12-10 株式会社村田製作所 高周波モジュール
DE102010061351A1 (de) * 2010-12-20 2012-06-21 Huf Hülsbeck & Fürst Gmbh & Co. Kg Kompakter, eine NFC-Kommunikationsmöglichkeit aufweisender ID-Geber eines Kraftfahrzeug-Zugangssystems
JP5288668B2 (ja) * 2011-01-26 2013-09-11 パナソニック株式会社 アンテナ装置および無線通信装置
WO2013054596A1 (ja) * 2011-10-13 2013-04-18 株式会社村田製作所 分波装置
GB2510509A (en) * 2011-10-28 2014-08-06 Murata Manufacturing Co Power reception device, power transmission device, and wireless power transmission system

Also Published As

Publication number Publication date
WO2014199507A1 (ja) 2014-12-18
JPWO2014199507A1 (ja) 2017-02-23
JP6067110B2 (ja) 2017-01-25
TW201507312A (zh) 2015-02-16
CN105284056A (zh) 2016-01-27
US9705363B2 (en) 2017-07-11
TWI638499B (zh) 2018-10-11
US20160156231A1 (en) 2016-06-02
CN105284056B (zh) 2017-09-05
KR20160019437A (ko) 2016-02-19

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20220609