HK1216454A1 - 形成太陽能電池中的結構的方法 - Google Patents
形成太陽能電池中的結構的方法Info
- Publication number
- HK1216454A1 HK1216454A1 HK16104328.7A HK16104328A HK1216454A1 HK 1216454 A1 HK1216454 A1 HK 1216454A1 HK 16104328 A HK16104328 A HK 16104328A HK 1216454 A1 HK1216454 A1 HK 1216454A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- solar cell
- forming structures
- structures
- forming
- solar
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17118709P | 2009-04-21 | 2009-04-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1216454A1 true HK1216454A1 (zh) | 2016-11-11 |
Family
ID=43011456
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12110486.6A HK1169745A1 (zh) | 2009-04-21 | 2012-10-22 | 形成太陽能電池中的結構的方法 |
HK16104328.7A HK1216454A1 (zh) | 2009-04-21 | 2016-04-15 | 形成太陽能電池中的結構的方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12110486.6A HK1169745A1 (zh) | 2009-04-21 | 2012-10-22 | 形成太陽能電池中的結構的方法 |
Country Status (6)
Country | Link |
---|---|
US (3) | US8940572B2 (zh) |
EP (1) | EP2422374A4 (zh) |
JP (3) | JP5643293B2 (zh) |
CN (2) | CN102439728B (zh) |
HK (2) | HK1169745A1 (zh) |
WO (1) | WO2010123976A1 (zh) |
Families Citing this family (37)
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US8242354B2 (en) | 2008-12-04 | 2012-08-14 | Sunpower Corporation | Backside contact solar cell with formed polysilicon doped regions |
JP5643293B2 (ja) | 2009-04-21 | 2014-12-17 | テトラサン インコーポレイテッド | 太陽電池内の構造部を形成するための方法 |
US8324015B2 (en) | 2009-12-01 | 2012-12-04 | Sunpower Corporation | Solar cell contact formation using laser ablation |
US8263899B2 (en) | 2010-07-01 | 2012-09-11 | Sunpower Corporation | High throughput solar cell ablation system |
US20130276882A1 (en) | 2010-12-21 | 2013-10-24 | Condalign As | Method for forming conductive structures in a solar cell |
EP2663419A2 (en) * | 2011-01-13 | 2013-11-20 | Tamarack Scientific Co. Inc. | Laser removal of conductive seed layers |
US8692111B2 (en) | 2011-08-23 | 2014-04-08 | Sunpower Corporation | High throughput laser ablation processes and structures for forming contact holes in solar cells |
US8822262B2 (en) | 2011-12-22 | 2014-09-02 | Sunpower Corporation | Fabricating solar cells with silicon nanoparticles |
EP2787541B1 (en) | 2013-04-03 | 2022-08-31 | LG Electronics, Inc. | Solar cell |
US9087941B2 (en) | 2013-09-19 | 2015-07-21 | International Business Machines Corporation | Selective self-aligned plating of heterojunction solar cells |
CN203936519U (zh) * | 2014-05-30 | 2014-11-12 | 宁德新能源科技有限公司 | 锂离子电池极片涂层清洗装置 |
US9349648B2 (en) * | 2014-07-22 | 2016-05-24 | Applied Materials, Inc. | Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process |
KR20170036004A (ko) * | 2014-09-12 | 2017-03-31 | 동관 엠프렉스 테크놀로지 리미티드 | 폴피스 코팅층의 제거 장치 |
CN105406028A (zh) * | 2014-09-12 | 2016-03-16 | 东莞新能源科技有限公司 | 极片涂层的移除方法 |
JP6506520B2 (ja) * | 2014-09-16 | 2019-04-24 | 株式会社ディスコ | SiCのスライス方法 |
WO2016080347A1 (ja) * | 2014-11-20 | 2016-05-26 | 日本ゼオン株式会社 | 光学フィルムの製造方法 |
JP6399913B2 (ja) | 2014-12-04 | 2018-10-03 | 株式会社ディスコ | ウエーハの生成方法 |
JP6358941B2 (ja) | 2014-12-04 | 2018-07-18 | 株式会社ディスコ | ウエーハの生成方法 |
JP6391471B2 (ja) | 2015-01-06 | 2018-09-19 | 株式会社ディスコ | ウエーハの生成方法 |
JP6395632B2 (ja) | 2015-02-09 | 2018-09-26 | 株式会社ディスコ | ウエーハの生成方法 |
JP6395633B2 (ja) | 2015-02-09 | 2018-09-26 | 株式会社ディスコ | ウエーハの生成方法 |
JP6425606B2 (ja) | 2015-04-06 | 2018-11-21 | 株式会社ディスコ | ウエーハの生成方法 |
JP6494382B2 (ja) | 2015-04-06 | 2019-04-03 | 株式会社ディスコ | ウエーハの生成方法 |
JP6429715B2 (ja) | 2015-04-06 | 2018-11-28 | 株式会社ディスコ | ウエーハの生成方法 |
JP6482389B2 (ja) * | 2015-06-02 | 2019-03-13 | 株式会社ディスコ | ウエーハの生成方法 |
JP6472333B2 (ja) | 2015-06-02 | 2019-02-20 | 株式会社ディスコ | ウエーハの生成方法 |
JP6552898B2 (ja) * | 2015-07-13 | 2019-07-31 | 株式会社ディスコ | 多結晶SiCウエーハの生成方法 |
JP6482423B2 (ja) | 2015-07-16 | 2019-03-13 | 株式会社ディスコ | ウエーハの生成方法 |
JP6482425B2 (ja) | 2015-07-21 | 2019-03-13 | 株式会社ディスコ | ウエーハの薄化方法 |
JP6472347B2 (ja) | 2015-07-21 | 2019-02-20 | 株式会社ディスコ | ウエーハの薄化方法 |
CN105463401A (zh) * | 2015-12-02 | 2016-04-06 | 浙江大学 | 一种化学气相沉积制备硅掺杂石墨烯材料的方法 |
JP6602207B2 (ja) * | 2016-01-07 | 2019-11-06 | 株式会社ディスコ | SiCウエーハの生成方法 |
JPWO2017145330A1 (ja) * | 2016-02-25 | 2019-01-31 | 株式会社島津製作所 | レーザ加工装置 |
JP6690983B2 (ja) | 2016-04-11 | 2020-04-28 | 株式会社ディスコ | ウエーハ生成方法及び実第2のオリエンテーションフラット検出方法 |
JP2018093046A (ja) * | 2016-12-02 | 2018-06-14 | 株式会社ディスコ | ウエーハ生成方法 |
JP6773539B2 (ja) * | 2016-12-06 | 2020-10-21 | 株式会社ディスコ | ウエーハ生成方法 |
JP6858587B2 (ja) | 2017-02-16 | 2021-04-14 | 株式会社ディスコ | ウエーハ生成方法 |
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JPS5984477A (ja) * | 1982-11-04 | 1984-05-16 | Matsushita Electric Ind Co Ltd | 太陽電池の電極形成法 |
JPS59117276A (ja) * | 1982-12-24 | 1984-07-06 | Mitsubishi Electric Corp | 太陽電池の製造方法 |
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JP4162516B2 (ja) * | 2003-03-14 | 2008-10-08 | 三洋電機株式会社 | 光起電力装置 |
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JP4222910B2 (ja) * | 2003-09-17 | 2009-02-12 | 三洋電機株式会社 | 光起電力装置の製造方法 |
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CN101874408A (zh) * | 2007-11-22 | 2010-10-27 | 日本电气株式会社 | 图像捕获设备、编码方法及程序 |
KR100864062B1 (ko) * | 2008-02-22 | 2008-10-16 | 한국철강 주식회사 | 태양전지 모듈 패터닝 장치 |
US20100037941A1 (en) * | 2008-08-13 | 2010-02-18 | E. I. Du Pont De Nemours And Company | Compositions and processes for forming photovoltaic devices |
JP2012501249A (ja) * | 2008-08-26 | 2012-01-19 | アプライド マテリアルズ インコーポレイテッド | レーザー材料除去方法および装置 |
US7855089B2 (en) * | 2008-09-10 | 2010-12-21 | Stion Corporation | Application specific solar cell and method for manufacture using thin film photovoltaic materials |
GB2467361A (en) * | 2009-01-30 | 2010-08-04 | Renewable Energy Corp Asa | Contact and interconnect for a solar cell |
AU2010229103A1 (en) * | 2009-03-26 | 2011-11-03 | Bp Corporation North America Inc. | Apparatus and method for solar cells with laser fired contacts in thermally diffused doped regions |
JP5643293B2 (ja) | 2009-04-21 | 2014-12-17 | テトラサン インコーポレイテッド | 太陽電池内の構造部を形成するための方法 |
KR101032624B1 (ko) * | 2009-06-22 | 2011-05-06 | 엘지전자 주식회사 | 태양 전지 및 그 제조 방법 |
CN105789337B (zh) * | 2010-03-26 | 2017-09-26 | 泰特拉桑有限公司 | 贯穿包括结构和制造方法的高效率晶体太阳能电池中的钝化电介质层的屏蔽电触点和掺杂 |
-
2010
- 2010-04-21 JP JP2012507342A patent/JP5643293B2/ja not_active Expired - Fee Related
- 2010-04-21 EP EP10767690.0A patent/EP2422374A4/en not_active Withdrawn
- 2010-04-21 CN CN201080022387.0A patent/CN102439728B/zh not_active Expired - Fee Related
- 2010-04-21 CN CN201510431927.5A patent/CN105023973A/zh active Pending
- 2010-04-21 WO PCT/US2010/031874 patent/WO2010123976A1/en active Application Filing
- 2010-04-21 US US13/265,438 patent/US8940572B2/en not_active Expired - Fee Related
-
2012
- 2012-10-22 HK HK12110486.6A patent/HK1169745A1/zh not_active IP Right Cessation
-
2014
- 2014-10-30 JP JP2014221664A patent/JP2015035623A/ja active Pending
- 2014-12-19 US US14/576,293 patent/US9478694B2/en not_active Expired - Fee Related
-
2016
- 2016-04-15 HK HK16104328.7A patent/HK1216454A1/zh unknown
- 2016-10-07 JP JP2016199449A patent/JP2017055122A/ja not_active Withdrawn
- 2016-10-21 US US15/299,753 patent/US20170040471A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN102439728A (zh) | 2012-05-02 |
US20150104900A1 (en) | 2015-04-16 |
US20170040471A1 (en) | 2017-02-09 |
HK1169745A1 (zh) | 2013-02-01 |
CN105023973A (zh) | 2015-11-04 |
US8940572B2 (en) | 2015-01-27 |
JP2012525007A (ja) | 2012-10-18 |
EP2422374A1 (en) | 2012-02-29 |
JP5643293B2 (ja) | 2014-12-17 |
US9478694B2 (en) | 2016-10-25 |
JP2015035623A (ja) | 2015-02-19 |
CN102439728B (zh) | 2015-08-19 |
EP2422374A4 (en) | 2016-09-14 |
WO2010123976A1 (en) | 2010-10-28 |
US20120055546A1 (en) | 2012-03-08 |
JP2017055122A (ja) | 2017-03-16 |
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