HK1215894A1 - 用於半導體封裝件的重構技術 - Google Patents

用於半導體封裝件的重構技術

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Publication number
HK1215894A1
HK1215894A1 HK16103790.8A HK16103790A HK1215894A1 HK 1215894 A1 HK1215894 A1 HK 1215894A1 HK 16103790 A HK16103790 A HK 16103790A HK 1215894 A1 HK1215894 A1 HK 1215894A1
Authority
HK
Hong Kong
Prior art keywords
semiconductor packages
reconstitution techniques
reconstitution
techniques
packages
Prior art date
Application number
HK16103790.8A
Other languages
English (en)
Inventor
羅立德
雷佐爾．拉赫曼．卡恩
胡坤忠
Original Assignee
Broadcom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Broadcom Corp filed Critical Broadcom Corp
Publication of HK1215894A1 publication Critical patent/HK1215894A1/zh

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    • H01L2924/191—Disposition
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    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
HK16103790.8A 2014-04-22 2016-04-05 用於半導體封裝件的重構技術 HK1215894A1 (zh)

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US9613942B2 (en) * 2015-06-08 2017-04-04 Qualcomm Incorporated Interposer for a package-on-package structure
US10170444B2 (en) * 2015-06-30 2019-01-01 Taiwan Semiconductor Manufacturing Company, Ltd. Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices
US10483211B2 (en) * 2016-02-22 2019-11-19 Mediatek Inc. Fan-out package structure and method for forming the same
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