HK1215100A1 - 重構的插入式半導體封裝件 - Google Patents

重構的插入式半導體封裝件

Info

Publication number
HK1215100A1
HK1215100A1 HK16102866.9A HK16102866A HK1215100A1 HK 1215100 A1 HK1215100 A1 HK 1215100A1 HK 16102866 A HK16102866 A HK 16102866A HK 1215100 A1 HK1215100 A1 HK 1215100A1
Authority
HK
Hong Kong
Prior art keywords
reconstituted
semiconductor package
interposer semiconductor
interposer
package
Prior art date
Application number
HK16102866.9A
Other languages
English (en)
Inventor
羅立德
趙子群
胡坤忠
雷佐爾．拉赫曼．卡恩
Original Assignee
Broadcom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Broadcom Corp filed Critical Broadcom Corp
Publication of HK1215100A1 publication Critical patent/HK1215100A1/zh

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
HK16102866.9A 2014-05-21 2016-03-14 重構的插入式半導體封裝件 HK1215100A1 (zh)

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US14/323,759 US20150340308A1 (en) 2014-05-21 2014-07-03 Reconstituted interposer semiconductor package

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US10510633B1 (en) 2018-07-16 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Package and printed circuit board attachment
CN111465312A (zh) * 2020-04-14 2020-07-28 杭州洛微科技有限公司 基于周期性阵列排布的光电产品封装生产方法
KR20210144050A (ko) 2020-05-21 2021-11-30 삼성전자주식회사 반도체 패키지
US20230160953A1 (en) * 2021-11-19 2023-05-25 Taiwan Semiconductor Manufacturing Co., Ltd. Interconnect structures in integrated circuit chips

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TW201545247A (zh) 2015-12-01
US20150340308A1 (en) 2015-11-26
EP2947683B1 (en) 2020-07-15
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