HK1204490A1 - Device for measuring film thickness and device for forming film - Google Patents

Device for measuring film thickness and device for forming film

Info

Publication number
HK1204490A1
HK1204490A1 HK15104929.1A HK15104929A HK1204490A1 HK 1204490 A1 HK1204490 A1 HK 1204490A1 HK 15104929 A HK15104929 A HK 15104929A HK 1204490 A1 HK1204490 A1 HK 1204490A1
Authority
HK
Hong Kong
Prior art keywords
measuring
film thickness
film
forming
forming film
Prior art date
Application number
HK15104929.1A
Other languages
Chinese (zh)
Inventor
佐井旭陽
日向陽平
大瀧芳幸
姜友松
Original Assignee
Shincron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shincron Co Ltd filed Critical Shincron Co Ltd
Publication of HK1204490A1 publication Critical patent/HK1204490A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/52—Means for observation of the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
    • C23C14/547—Controlling the film thickness or evaporation rate using measurement on deposited material using optical methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Physical Vapour Deposition (AREA)
HK15104929.1A 2012-06-13 2015-05-24 Device for measuring film thickness and device for forming film HK1204490A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/065141 WO2013186879A1 (en) 2012-06-13 2012-06-13 Device for measuring film thickness and device for forming film

Publications (1)

Publication Number Publication Date
HK1204490A1 true HK1204490A1 (en) 2015-11-20

Family

ID=49595820

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15104929.1A HK1204490A1 (en) 2012-06-13 2015-05-24 Device for measuring film thickness and device for forming film

Country Status (5)

Country Link
JP (1) JP5319856B1 (en)
CN (1) CN104395690B (en)
HK (1) HK1204490A1 (en)
TW (1) TWI489080B (en)
WO (1) WO2013186879A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101532239B1 (en) * 2014-02-11 2015-07-01 주식회사 지디 Thickness Mesurement Device Applicable in Glass Etching System
JP5925930B1 (en) * 2015-03-18 2016-05-25 日本航空電子工業株式会社 Optical fiber cable assembly and measuring device
JPWO2017135303A1 (en) * 2016-02-02 2018-11-22 コニカミノルタ株式会社 measuring device
KR102414892B1 (en) * 2016-04-19 2022-07-01 도쿄엘렉트론가부시키가이샤 Substrate for temperature measurement and temperature measurement system
EP3633351B1 (en) * 2017-05-23 2023-03-29 Hamamatsu Photonics K.K. Orientation characteristic measurement method, orientation characteristic measurement program, and orientation characteristic measurement device
KR102366788B1 (en) 2017-05-23 2022-02-23 하마마츠 포토닉스 가부시키가이샤 Orientation characteristic measurement method, orientation characteristic measurement program, and orientation characteristic measurement apparatus
JP6394825B1 (en) * 2018-02-08 2018-09-26 横河電機株式会社 Measuring apparatus and measuring method
CN112176309B (en) * 2020-11-27 2021-04-09 江苏永鼎光电子技术有限公司 Laser direct light control device for film plating machine

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037060U (en) * 1973-07-30 1975-04-18
JPS61145413A (en) * 1984-12-19 1986-07-03 Mitsubishi Rayon Co Ltd Sensing apparatus
JPH06195705A (en) * 1992-10-27 1994-07-15 Sony Corp Method and apparatus for manufacturing magnetic recording medium
US5483347A (en) * 1993-05-19 1996-01-09 Hughes Aircraft Company Non-contact measurement apparatus using bifurcated optical fiber bundle with intermixed fibers
US6411373B1 (en) * 1999-10-08 2002-06-25 Instrumentation Metrics, Inc. Fiber optic illumination and detection patterns, shapes, and locations for use in spectroscopic analysis
JP2001124526A (en) * 1999-10-29 2001-05-11 Japan Aviation Electronics Industry Ltd Optical film thickness monitoring mechanism
JP2001141563A (en) * 1999-11-17 2001-05-25 Toshiba Corp Spectrometry, its device, temperature measuring device, and film pressure measurement device
JP2003121116A (en) * 2001-10-12 2003-04-23 Optorun Co Ltd Vacuum ultraviolet optical film thickness monitor and vacuum film forming apparatus provided therewith
JP3865303B2 (en) * 2002-02-26 2007-01-10 オリンパス株式会社 Optical film thickness monitoring method and apparatus
US7049156B2 (en) * 2003-03-19 2006-05-23 Verity Instruments, Inc. System and method for in-situ monitor and control of film thickness and trench depth
TWI290614B (en) * 2006-04-21 2007-12-01 Advance Design Technology Inc A measuring apparatus for the thin film thickness using interference technology of laser
JP4813292B2 (en) * 2006-08-25 2011-11-09 株式会社昭和真空 Organic thin film thickness measuring device and organic thin film forming device
TW200839911A (en) * 2007-03-21 2008-10-01 Promos Technologies Inc Method for measuring thickness of film on sidewall of trench in semiconductor device
CN101038183A (en) * 2007-04-23 2007-09-19 华中科技大学 Fibre-optical freezing sensor
JP4878632B2 (en) * 2009-07-03 2012-02-15 株式会社シンクロン Optical film thickness meter and thin film forming apparatus equipped with optical film thickness meter
CN102103081A (en) * 2009-12-16 2011-06-22 中国科学院大连化学物理研究所 Optical fiber bundle fluorescent sensor
CN201748901U (en) * 2009-12-25 2011-02-16 成都南光机器有限公司 Optical film thickness measurement control system

Also Published As

Publication number Publication date
TW201350785A (en) 2013-12-16
TWI489080B (en) 2015-06-21
JP5319856B1 (en) 2013-10-16
JPWO2013186879A1 (en) 2016-02-01
CN104395690A (en) 2015-03-04
CN104395690B (en) 2017-05-31
WO2013186879A1 (en) 2013-12-19

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20210610