CN112176309B - Laser direct light control device for film plating machine - Google Patents
Laser direct light control device for film plating machine Download PDFInfo
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- CN112176309B CN112176309B CN202011354676.2A CN202011354676A CN112176309B CN 112176309 B CN112176309 B CN 112176309B CN 202011354676 A CN202011354676 A CN 202011354676A CN 112176309 B CN112176309 B CN 112176309B
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- monitoring
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- control device
- direct light
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/547—Controlling the film thickness or evaporation rate using measurement on deposited material using optical methods
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Abstract
The invention discloses a laser direct light control device for a film plating machine, which comprises a light source, a signal receiver and a tool part, wherein the tool part is provided with at least two film forming bases, and the two film forming bases are arranged on a circumference which takes the center of the tool part as the center of a circle; at least one film forming base is a monitoring base, and at least one monitoring substrate is arranged on the monitoring base; the monitoring substrate is characterized by further comprising a shielding part, the shielding part is arranged on one side, close to the evaporation source, of the monitoring base, a through hole is formed in the thickness direction of the shielding part, and the shielding part and the monitoring base are in running fit, so that all the monitoring substrates can be exposed through the through hole, and only one of the monitoring substrates is exposed through the through hole at each time. The laser direct light control device for the film coating machine reduces the accumulated tolerance of film thickness measurement and improves the measurement accuracy.
Description
Technical Field
The invention relates to the technical field of evaporation coating, in particular to a laser direct light control device for a coating machine.
Background
The evaporation coating is commonly called vacuum coating and is characterized in that under the vacuum condition, materials are evaporated and condensed to form a film on the surface of glass, a film with strong adhesive force is formed on the surface of the glass, the spectral characteristics of the film are determined by the thickness and the refractive index of the film, and the thickness of each layer of film needs to be accurately monitored on line in the coating process in order to ensure the spectral characteristics of the film in actual production. The existing method for monitoring the thickness of the film on line mainly comprises two methods, namely crystal oscillation and optical control, wherein the crystal oscillation method belongs to an indirect measurement method; the optical control method belongs to a direct measurement method and has higher measurement accuracy.
The evaporation process consists of depositing materials with different refractive indices onto a substrate in sequence, layer by layer, for example, a first refractive index material depositing a first layer of a target thickness (e.g., 100 nm) on the substrate, a second refractive index material depositing a second layer of the target thickness (e.g., 100 nm) on the first layer, and so on to deposit hundreds, even thousands, of layers in sequence. In the prior art, the film thickness detection includes that a signal receiver collects the light transmittance of a light signal transmitted through a thin film, and the optical thickness of the thin film is calculated through the light transmittance.
Disclosure of Invention
The invention aims to provide a laser direct light control device for a film coating machine, which reduces the accumulated tolerance of film thickness measurement and improves the measurement accuracy.
In order to solve the technical problem, the invention provides a laser direct light control device for a film plating machine, which comprises a tool part, wherein at least two film forming bases are arranged on the tool part, and the two film forming bases are arranged on the circumference which takes the center of the tool part as the center of a circle; at least one film forming base is a monitoring base, and at least one monitoring substrate is arranged on the monitoring base;
the monitoring substrate is characterized by further comprising a shielding part, the shielding part is arranged on one side, close to the evaporation source, of the monitoring base, a through hole is formed in the thickness direction of the shielding part, and the shielding part and the monitoring base are in running fit, so that all the monitoring substrates can be exposed through the through hole, and only one of the monitoring substrates is exposed through the through hole at each time.
In a preferred embodiment of the present invention, the shielding member is fixed on a side of the monitoring base close to the evaporation source, and the monitoring base rotates around its center.
In a preferred embodiment of the present invention, the monitoring base is fixed to the tool component, and the shielding component rotates around its center.
In a preferred embodiment of the present invention, the monitoring device further includes a light source and a signal receiver, the light source and the signal receiver are respectively disposed on two opposite sides of the monitoring base, an optical axis of a lens included in the signal receiver is perpendicular to the monitoring base, the light source is located on the optical axis of the lens included in the signal receiver, and an optical signal of the light source can be projected onto the monitoring substrate through the through hole.
In a preferred embodiment of the present invention, the light source is a laser light source.
In a preferred embodiment of the present invention, the tool component further comprises a rotating part rotating around its center.
In a preferred embodiment of the present invention, the tool further comprises a tool component, wherein the tool component is capable of rotating at an adjustable speed.
In a preferred embodiment of the present invention, the tool component further includes six film forming bases provided on a circumference around a center of the tool component.
In a preferred embodiment of the present invention, the monitoring substrate further includes six monitoring substrates disposed on the monitoring base, and the six monitoring substrates are disposed on a circumference centered on the center of the monitoring base.
In a preferred embodiment of the present invention, the evaporation source further comprises an auxiliary positive plate, wherein the auxiliary positive plate is used for shielding part of the evaporation source.
The invention has the beneficial effects that:
the laser direct light control device for the film coating machine, disclosed by the invention, has the advantages that only one blank monitoring substrate and the substrate on the film forming base synchronously participate in evaporation coating all the time through the through hole of the shielding component, when the coating thickness on the substrate reaches a certain value (such as 100 nm), the shielding component or the monitoring base is adjusted, so that the next blank area of the monitoring substrate or the next blank monitoring substrate participates in evaporation coating, the total thickness of the coating on the monitoring substrate is calculated as the total thickness of the coating on the substrate, the accumulated tolerance of film thickness measurement can be reduced by replacing the sampling position of the monitoring substrate or replacing different monitoring substrates to participate in evaporation coating, and the measurement accuracy is improved.
Drawings
FIG. 1 is a schematic structural diagram of a laser direct light control device for a film coating machine in a preferred embodiment of the present invention;
FIG. 2 is a schematic structural view of a coater;
fig. 3 is a schematic structural diagram of a tooling component in a preferred embodiment of the invention.
The reference numbers in the figures illustrate:
1-a coating chamber, 3-a laser light source, 5-a signal receiver and 7-an evaporation source;
2-tool parts, 4-film forming bases, 6-monitoring bases, 8-monitoring substrates, 10-shielding parts, 12-through holes and 14-correction plates.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Examples
The embodiment of the invention discloses a laser direct light control device for a film plating machine, which is used for monitoring the thickness of a plated film in real time in the evaporation film plating process. In the evaporation coating process, the light transmittance is oscillated along with the increase of the coating thickness to reach an extreme value (maximum value/minimum value), the optical thickness (product of actual thickness and coating refractive index) of the coating is integral multiple of a quarter wavelength, and when the light transmittance is changed between extreme values, the optical thickness of the coating is known to be increased by the quarter wavelength, so that the thickness of the coating can be calculated by monitoring the light transmittance.
Referring to fig. 1 and 2, an embodiment of the present invention discloses a laser direct light control device for a film coating machine, which is disposed in a film coating chamber 1, wherein an ion source and at least two groups of evaporation sources 7 are disposed at the bottom of the film coating chamber 1, the two groups of evaporation sources 7 are respectively used for providing two materials, such as a silicon dioxide material and a tantalum pentoxide material, the two evaporation sources 7 alternately work on a substrate to deposit a film of the two materials (the silicon dioxide material and the tantalum pentoxide material), and the ion source assists in evaporation coating. The laser direct light control device for the film coating machine is arranged in a film coating chamber 1 to monitor the thickness of a coated film on line and comprises a tool part 2, a light source and a signal receiver 5, wherein the light source projects light signals to the coated film, the signal receiver 5 is used for receiving light signals penetrating through the coated film, and the thickness of the coated film is calculated by monitoring the light transmittance of the light source penetrating through the coated film.
In the technical scheme of the embodiment of the invention, the light source preferably uses the laser light source 3, the intensity of the laser light source is high, the bandwidth is narrow, the coherence is good, and the signal-to-noise ratio of the signal is high, so that the intensity of the optical signal collected by the signal receiver 5 cannot be weakened along with the increase of the thickness of the coating film, and the film thickness measurement accuracy is improved.
Specifically, at least two film forming bases 4 are arranged on the tool component 2, when the two film forming bases 4 are arranged on the tool component 2, one of the film forming bases is used as a monitoring base 6, and the other film forming base 4 is used for placing a substrate; when three or more film forming bases 4 are provided on the tool part 2, at least one of them is used as the monitor base 6, and the other film forming bases 4 are used for placing substrates. When the number of the film forming bases 4 is two or more, the film forming bases 4 are sequentially arranged on the same circumference with the center of the tool component 2 as the center of a circle.
The monitoring base 6 is provided with at least one monitoring substrate 8, which here comprises at least two embodiments, a first embodiment: the monitoring substrate 6 is provided with a monitoring substrate 8, the monitoring substrate 8 is provided with at least two blank areas, and the two blank areas are sequentially arranged on the same circumference with the center of the monitoring substrate 8 as the center of a circle. When the second embodiment: two or more monitoring substrates 8 are arranged on the monitoring base, the monitoring substrates 8 are sequentially arranged on the same circumference taking the center of the monitoring base 6 as the center, and the monitoring substrates 8 are equivalent to the blank area of the first embodiment.
The direct light control device of laser for coating machine still includes shelters from part 10, shelter from part 10 and set up monitoring base 6 is close to one side of evaporation source 7, the thickness direction that shelters from part 10 is equipped with through-hole 12, shelter from part 10 and monitoring base 6 normal running fit, make all monitoring substrate 8 all can pass through-hole 12 exposes, and only one of them at every turn monitoring substrate 8 passes through-hole 12 exposes. Or all the blank areas of the one monitoring substrate 8 may be exposed through the through-holes 12 and only one of the blank areas is exposed through the through-holes 12 at a time.
Wherein, light source and signal receiver 5 set up respectively monitor 6's the relative both sides, the optical axis of the lens that signal receiver 5 contains with monitor 6 looks vertically, the light source is located on the optical axis of the lens that signal receiver 5 contains, just the light signal of light source can see through-hole 12 throws to on the control substrate 8. Only one monitoring substrate 8 on the monitoring base 6 and the substrate on the film forming base 4 synchronously participate in film coating, and the other monitoring substrates 8 are completely shielded by the shielding part 10 and do not participate in film coating; alternatively, a blank area of the monitoring substrate 8 and the base on the film-forming base 4 participate in the film-forming simultaneously, and the other blank areas are all shielded by the shielding member 10 and do not participate in the film-forming. The light source and signal receiver 5 is used for monitoring the coating thickness on the monitoring substrate 8 participating in coating. When the thickness of the coating film on the substrate reaches a certain value (such as 100 nm), the shielding component 10 or the monitoring base 6 is adjusted to enable the monitoring substrate 8 of the next blank to be exposed at the through hole 12 to participate in evaporation coating, or enable the monitoring substrate 8 of the next blank to be exposed at the through hole 12 to participate in evaporation coating, and then the sum of the thicknesses of the coating films on the monitoring substrates 8 is calculated as the total thickness of the coating film on the substrate, or the sum of the thicknesses of the coating films on the monitoring substrates 8 in the blank areas is calculated as the total thickness of the coating film on the substrate.
In the first implementation of the embodiment of the present invention, the shielding member 10 is fixed on the side of the monitoring base 6 close to the evaporation source 7, while the positions of the light source and the signal receiver are fixed, the monitoring base 6 rotates around its center, and the monitoring substrate 8 exposed to the through hole 12 is changed by the rotation of the monitoring base 6.
In the second implementation scheme of the embodiment of the present invention, the monitoring base 6 is fixed on the tool component 2, the shielding component 10 rotates around its center, and at this time, the positions of the light source and the signal receiver rotate along with the shielding component 10, so that the light source can always be projected onto the monitoring substrate 8 through the through hole, and the monitoring substrate 8 exposed to the through hole 12 is changed by the rotation of the shielding component 10.
In a third implementation of the embodiment of the present invention, the shielding member 10 rotates around its center, the monitoring base 6 rotates around its center, and the monitoring substrate 8 exposed to the through hole 12 is changed by the rotation of the shielding member 10 and the monitoring base 6.
The invention can reduce the accumulated tolerance of film thickness measurement and improve the measurement accuracy by replacing different monitoring substrates 8 or different blank areas to participate in evaporation coating.
The tool part 2 rotates around the center of the tool part, the sampling position can be changed, multi-point sampling is realized, and the film coating thickness measurement error is reduced through the multi-point sampling. The rotating speed of the tool part 2 can be adjusted, and the uniformity of the coating film can be improved by adjusting the rotating speed.
Further, a plurality of film forming bases 4 are arranged on the tool part 2, and the plurality of film forming bases 4 are arranged on a circumference with the center of the tool part 2 as a circle center. For example, the tool component 2 has a diameter of 600 mm and six stations (i.e., 6 film forming bases are provided), one film forming base 4 is the monitoring base 6, and the other five film forming bases 4 can clamp 1 piece of WMS-15 glass substrate with a diameter of 150 mm, and the distance from the center of each substrate to the axis of the tool component 2 is the same. The tool component 2 designed above enables one set of laser measurement module to correspondingly measure the thickness of multiple coating films on multiple film forming bases, and improves monitoring efficiency.
Further, a plurality of monitoring substrates 8 are disposed on the monitoring base 6, for example, six monitoring substrates 8 are disposed on the monitoring base 6, and the six monitoring substrates 8 are disposed on a circumference with the center of the monitoring base 6 as a circle center.
Further, the coating device further comprises an auxiliary positive plate 14, wherein the auxiliary positive plate 14 is arranged in the coating chamber 1, the evaporation source 7 is positioned right below the auxiliary positive plate 14, and part of the evaporation source is shielded by the auxiliary positive plate 14 so as to keep the uniformity of the thickness of the film.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (9)
1. The utility model provides a direct light-operated device of laser for coating machine, includes the frock part, its characterized in that: the tool component is provided with at least two film forming bases, and the two film forming bases are arranged on a circumference which takes the center of the tool component as the center of a circle; at least one film forming base is a monitoring base, and a plurality of monitoring substrates are arranged on the monitoring base;
the monitoring substrate is characterized by further comprising a shielding part, the shielding part is arranged on one side, close to the evaporation source, of the monitoring base, a through hole is formed in the thickness direction of the shielding part, and the shielding part and the monitoring base are in running fit, so that all the monitoring substrates can be exposed through the through hole, and only one of the monitoring substrates is exposed through the through hole at each time.
2. The laser direct light control device for coating machine of claim 1, characterized in that: the shielding part is fixed on one side of the monitoring base close to the evaporation source, and the monitoring base rotates around the center of the monitoring base.
3. The laser direct light control device for coating machine of claim 1, characterized in that: the monitoring base is fixed on the tool component, and the shielding component rotates around the center of the shielding component.
4. The laser direct light control device for the coating machine as claimed in any one of claims 1 to 3, characterized in that: still include light source and signal receiver, light source and signal receiver set up respectively the relative both sides of control base, the optical axis of the lens that signal receiver contains with control base looks vertically, the light source is located on the optical axis of the lens that signal receiver contains, just the light signal of light source can see through the through-hole throws extremely on the control substrate.
5. The laser direct light control device for coating machine of claim 1, characterized in that: the tooling component rotates around the center of the tooling component.
6. The laser direct light control device for coating machine of claim 5, characterized in that: the rotating speed of the tool part can be adjusted.
7. The laser direct light control device for coating machine of claim 1, characterized in that: the tool component is provided with six film forming bases, and the six film forming bases are arranged on a circumference which takes the center of the tool component as a circle center.
8. The laser direct light control device for coating machine of claim 1, characterized in that: the monitoring base is provided with six monitoring substrates, and the six monitoring substrates are arranged on a circumference which takes the center of the monitoring base as a circle center.
9. The laser direct light control device for coating machine of claim 1, characterized in that: the evaporation source device further comprises an auxiliary positive plate, and the auxiliary positive plate is used for shielding part of the evaporation source.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011354676.2A CN112176309B (en) | 2020-11-27 | 2020-11-27 | Laser direct light control device for film plating machine |
| PCT/CN2021/113748 WO2022110925A1 (en) | 2020-11-27 | 2021-08-20 | Laser-based direct optical control device for coating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011354676.2A CN112176309B (en) | 2020-11-27 | 2020-11-27 | Laser direct light control device for film plating machine |
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| Publication Number | Publication Date |
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| CN112176309A CN112176309A (en) | 2021-01-05 |
| CN112176309B true CN112176309B (en) | 2021-04-09 |
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| CN202011354676.2A Active CN112176309B (en) | 2020-11-27 | 2020-11-27 | Laser direct light control device for film plating machine |
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| CN (1) | CN112176309B (en) |
| WO (1) | WO2022110925A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112176309B (en) * | 2020-11-27 | 2021-04-09 | 江苏永鼎光电子技术有限公司 | Laser direct light control device for film plating machine |
| CN113403601B (en) * | 2021-06-21 | 2022-10-21 | 中国科学院光电技术研究所 | Optical control device and method for coating thickness |
| CN113776442B (en) * | 2021-09-15 | 2023-05-30 | 佛山市博顿光电科技有限公司 | Spectrum detection device, film thickness real-time monitoring method and system and vacuum coating machine |
Citations (1)
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| CN105316643A (en) * | 2014-08-04 | 2016-02-10 | 陕西银河景天电子有限责任公司 | Monitoring equipment used in film product preparation process |
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| US4676883A (en) * | 1986-03-03 | 1987-06-30 | Sierracin Corporation | Optical disk transmission monitor for deposited films |
| JPH0798993B2 (en) * | 1986-07-23 | 1995-10-25 | 日本板硝子株式会社 | Film thickness control method |
| DE69309505T2 (en) * | 1992-01-17 | 1997-07-24 | Matsushita Electric Ind Co Ltd | Method and device for producing multilayer films |
| JP4449293B2 (en) * | 2001-12-19 | 2010-04-14 | 株式会社ニコン | Film forming apparatus and optical member manufacturing method |
| DE102008056125A1 (en) * | 2008-11-06 | 2010-05-12 | Leybold Optics Gmbh | Test glass changing system for the selective coating and optical measurement of coating properties in a vacuum coating plant |
| DE102011101416B4 (en) * | 2011-05-13 | 2016-06-16 | MTU Aero Engines AG | Thickness measurement of a coating of a rotating component taking into account the thermal expansion |
| DE102012010794A1 (en) * | 2011-09-02 | 2013-03-07 | Leybold Optics Gmbh | Test glass changing |
| WO2013186879A1 (en) * | 2012-06-13 | 2013-12-19 | 株式会社シンクロン | Device for measuring film thickness and device for forming film |
| CN107385408A (en) * | 2017-07-24 | 2017-11-24 | 京东方科技集团股份有限公司 | Thickness test device and method, evaporated device |
| CN107916410B (en) * | 2017-11-23 | 2019-11-05 | 湖北东田光电材料科技有限公司 | A kind of reflective optic monitoring method detecting optical coating thickness |
| CN109321887B (en) * | 2018-11-19 | 2020-09-01 | 北方夜视技术股份有限公司 | Device and method for monitoring and preparing large-size uniform film by utilizing multipoint reflectivity |
| CN112176309B (en) * | 2020-11-27 | 2021-04-09 | 江苏永鼎光电子技术有限公司 | Laser direct light control device for film plating machine |
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- 2020-11-27 CN CN202011354676.2A patent/CN112176309B/en active Active
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- 2021-08-20 WO PCT/CN2021/113748 patent/WO2022110925A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105316643A (en) * | 2014-08-04 | 2016-02-10 | 陕西银河景天电子有限责任公司 | Monitoring equipment used in film product preparation process |
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| WO2022110925A1 (en) | 2022-06-02 |
| CN112176309A (en) | 2021-01-05 |
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