HK1172156A1 - 加工工藝、電壓、以及溫度傳感器 - Google Patents

加工工藝、電壓、以及溫度傳感器

Info

Publication number
HK1172156A1
HK1172156A1 HK12112941.1A HK12112941A HK1172156A1 HK 1172156 A1 HK1172156 A1 HK 1172156A1 HK 12112941 A HK12112941 A HK 12112941A HK 1172156 A1 HK1172156 A1 HK 1172156A1
Authority
HK
Hong Kong
Prior art keywords
voltage
temperature sensor
sensor
temperature
Prior art date
Application number
HK12112941.1A
Other languages
English (en)
Inventor
Jung Hee Lee
Original Assignee
天工方案公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 天工方案公司 filed Critical 天工方案公司
Publication of HK1172156A1 publication Critical patent/HK1172156A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/30—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03G—CONTROL OF AMPLIFICATION
    • H03G1/00—Details of arrangements for controlling amplification
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03G—CONTROL OF AMPLIFICATION
    • H03G1/00—Details of arrangements for controlling amplification
    • H03G1/0005—Circuits characterised by the type of controlling devices operated by a controlling current or voltage signal
    • H03G1/0088—Circuits characterised by the type of controlling devices operated by a controlling current or voltage signal using discontinuously variable devices, e.g. switch-operated
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/447—Indexing scheme relating to amplifiers the amplifier being protected to temperature influence

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Measurement Of Current Or Voltage (AREA)
  • Control Of Amplification And Gain Control (AREA)
  • Measuring Fluid Pressure (AREA)
HK12112941.1A 2009-07-28 2012-12-14 加工工藝、電壓、以及溫度傳感器 HK1172156A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22905609P 2009-07-28 2009-07-28
PCT/US2009/057823 WO2011014206A1 (en) 2009-07-28 2009-09-22 Process, voltage, and temperature sensor

Publications (1)

Publication Number Publication Date
HK1172156A1 true HK1172156A1 (zh) 2013-04-12

Family

ID=43529623

Family Applications (2)

Application Number Title Priority Date Filing Date
HK14112806.3A HK1199329A1 (zh) 2009-07-28 2012-12-14 半導體加工工藝傳感器及表徵半導體加工工藝的方法
HK12112941.1A HK1172156A1 (zh) 2009-07-28 2012-12-14 加工工藝、電壓、以及溫度傳感器

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK14112806.3A HK1199329A1 (zh) 2009-07-28 2012-12-14 半導體加工工藝傳感器及表徵半導體加工工藝的方法

Country Status (9)

Country Link
US (3) US8049527B2 (zh)
JP (3) JP5723879B2 (zh)
KR (1) KR101632095B1 (zh)
CN (2) CN102576686B (zh)
DE (1) DE112009005104B4 (zh)
GB (3) GB2506538B (zh)
HK (2) HK1199329A1 (zh)
TW (2) TWI494721B (zh)
WO (1) WO2011014206A1 (zh)

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Also Published As

Publication number Publication date
JP2014160831A (ja) 2014-09-04
CN104135236A (zh) 2014-11-05
US8717060B2 (en) 2014-05-06
GB201317983D0 (en) 2013-11-27
GB201201448D0 (en) 2012-03-14
US20120034713A1 (en) 2012-02-09
GB2506538B (en) 2014-07-02
CN102576686A (zh) 2012-07-11
US9372222B2 (en) 2016-06-21
JP5723879B2 (ja) 2015-05-27
TW201530272A (zh) 2015-08-01
DE112009005104B4 (de) 2022-03-03
GB2506538A (en) 2014-04-02
CN104135236B (zh) 2017-08-08
JP2015195393A (ja) 2015-11-05
JP2013500602A (ja) 2013-01-07
TWI494721B (zh) 2015-08-01
GB201321458D0 (en) 2014-01-22
US20140159767A1 (en) 2014-06-12
WO2011014206A1 (en) 2011-02-03
JP6067792B2 (ja) 2017-01-25
GB2484442A (en) 2012-04-11
JP5775946B2 (ja) 2015-09-09
KR20120055570A (ko) 2012-05-31
GB2503839A (en) 2014-01-08
GB2484442B (en) 2013-12-25
HK1199329A1 (zh) 2015-06-26
US8049527B2 (en) 2011-11-01
TW201118516A (en) 2011-06-01
KR101632095B1 (ko) 2016-06-20
GB2503839B (en) 2014-03-05
DE112009005104T5 (de) 2012-09-13
TWI600986B (zh) 2017-10-01
CN102576686B (zh) 2015-04-01
US20110029266A1 (en) 2011-02-03

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