HK1166288A1 - 液體定量排出方法以及裝置 - Google Patents

液體定量排出方法以及裝置

Info

Publication number
HK1166288A1
HK1166288A1 HK12107066A HK12107066A HK1166288A1 HK 1166288 A1 HK1166288 A1 HK 1166288A1 HK 12107066 A HK12107066 A HK 12107066A HK 12107066 A HK12107066 A HK 12107066A HK 1166288 A1 HK1166288 A1 HK 1166288A1
Authority
HK
Hong Kong
Prior art keywords
discharging
liquid
fixed amount
amount
fixed
Prior art date
Application number
HK12107066A
Other languages
English (en)
Inventor
生島和正
Original Assignee
武藏工業株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武藏工業株式會社 filed Critical 武藏工業株式會社
Publication of HK1166288A1 publication Critical patent/HK1166288A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01043—Technetium [Tc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/2931—Diverse fluid containing pressure systems
    • Y10T137/3115—Gas pressure storage over or displacement of liquid
    • Y10T137/3118—Surge suppression
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/2931—Diverse fluid containing pressure systems
    • Y10T137/3115—Gas pressure storage over or displacement of liquid
    • Y10T137/3127—With gas maintenance or application

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating Apparatus (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
  • Ink Jet (AREA)
  • Jet Pumps And Other Pumps (AREA)
HK12107066A 2009-06-03 2012-07-18 液體定量排出方法以及裝置 HK1166288A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009133587A JP5460132B2 (ja) 2009-06-03 2009-06-03 液体定量吐出方法および装置
PCT/JP2010/059315 WO2010140607A1 (ja) 2009-06-03 2010-06-02 液体定量吐出方法および装置

Publications (1)

Publication Number Publication Date
HK1166288A1 true HK1166288A1 (zh) 2012-10-26

Family

ID=43297740

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12107066A HK1166288A1 (zh) 2009-06-03 2012-07-18 液體定量排出方法以及裝置

Country Status (14)

Country Link
US (1) US8770439B2 (zh)
EP (1) EP2438998B1 (zh)
JP (1) JP5460132B2 (zh)
KR (1) KR101683660B1 (zh)
CN (1) CN102448620B (zh)
ES (1) ES2750244T3 (zh)
HK (1) HK1166288A1 (zh)
HU (1) HUE046783T2 (zh)
MY (1) MY166368A (zh)
PL (1) PL2438998T3 (zh)
RU (1) RU2519452C2 (zh)
SG (2) SG176287A1 (zh)
TW (1) TWI522178B (zh)
WO (1) WO2010140607A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6541489B2 (ja) 2015-07-24 2019-07-10 武蔵エンジニアリング株式会社 液体材料吐出装置
JP6778426B2 (ja) * 2016-09-20 2020-11-04 武蔵エンジニアリング株式会社 液体材料吐出装置
KR102283820B1 (ko) * 2019-10-08 2021-07-30 주식회사 지오테크놀로지 미세 정량 토출용 디스펜서
CN110976213B (zh) * 2019-12-19 2020-11-24 广东博智林机器人有限公司 打胶机器人的收胶控制方法及打胶机器人

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3504825A (en) * 1966-08-15 1970-04-07 Gen Motors Corp Pneumatic control of pressure pouring ladle
US3736291A (en) * 1971-10-14 1973-05-29 H Vogel Poly(arylene oxides)
SU957986A1 (ru) * 1981-02-03 1982-09-15 Институт механики металлополимерных систем АН БССР Устройство дл нанесени покрытий на издели
SU1085643A1 (ru) * 1982-10-25 1984-04-15 Институт механики металлополимерных систем АН БССР Устройство дл нанесени покрытий на издели
JPS59135170U (ja) * 1983-02-28 1984-09-10 武蔵エンジニアリング株式会社 超精密用デイスペンサ−
SU1219167A1 (ru) * 1983-11-28 1986-03-23 Shevchuk Mikhail S Устройство дл нанесени жидкого покрывающего состава на ленточный материал
JPH0215588A (ja) * 1988-07-01 1990-01-19 Sawanishi Shikimono Kk チューブマット式ホットカーペット用ロープの製造法
JPH0629184Y2 (ja) * 1988-07-15 1994-08-10 本田技研工業株式会社 自動２輪車のリヤトランク装置
JPH0427570Y2 (zh) * 1989-04-01 1992-07-02
JPH063176A (ja) * 1992-06-17 1994-01-11 Kenichi Fujiwara 定量吐出装置
JPH0966251A (ja) 1995-08-31 1997-03-11 Sanyo Electric Co Ltd 塗布装置
KR100644502B1 (ko) * 1999-05-21 2006-11-10 마츠시타 덴끼 산교 가부시키가이샤 점성재료 도포장치
JP2002361144A (ja) * 2001-06-05 2002-12-17 Tdk Corp 液体材料吐出装置
JP2002361146A (ja) * 2001-06-07 2002-12-17 Fuji Photo Film Co Ltd ビード型塗布装置及びビード型塗布方法
JP2004105968A (ja) * 2003-12-22 2004-04-08 Musashi Eng Co Ltd 液体吐出装置
JP4350105B2 (ja) * 2006-06-12 2009-10-21 武蔵エンジニアリング株式会社 液体定量吐出バルブおよび液体定量吐出装置
KR101386999B1 (ko) * 2006-11-15 2014-04-18 무사시 엔지니어링 가부시키가이샤 액체 재료의 토출 방법 및 장치
DE102006061370A1 (de) * 2006-12-22 2008-06-26 Amminex A/S Verfahren und Vorrichtung zur Ammoniakspeicherung und -zufuhr unter Verwendung von in-situ-Wiedersättigung einer Zufuhreinheit
NL1033915C2 (nl) * 2007-05-31 2008-12-02 Heineken Supply Chain Bv Inrichting en werkwijze voor het afgeven van drank.
NL1033913C2 (nl) * 2007-05-31 2008-12-02 Heineken Supply Chain Bv Besturingssysteem voor een drankafgifteinrichting.
US8464902B2 (en) * 2009-01-09 2013-06-18 Nordson Corporation Apparatus and method for pulsed dispensing of liquid

Also Published As

Publication number Publication date
HUE046783T2 (hu) 2020-03-30
CN102448620A (zh) 2012-05-09
SG176287A1 (en) 2012-01-30
MY166368A (en) 2018-06-25
RU2519452C2 (ru) 2014-06-10
KR20120028967A (ko) 2012-03-23
SG10201401512QA (en) 2014-06-27
KR101683660B1 (ko) 2016-12-07
US8770439B2 (en) 2014-07-08
RU2011154140A (ru) 2013-07-20
CN102448620B (zh) 2014-05-07
EP2438998B1 (en) 2019-09-18
TWI522178B (zh) 2016-02-21
JP5460132B2 (ja) 2014-04-02
EP2438998A1 (en) 2012-04-11
JP2010279867A (ja) 2010-12-16
TW201103639A (en) 2011-02-01
PL2438998T3 (pl) 2020-03-31
ES2750244T3 (es) 2020-03-25
WO2010140607A1 (ja) 2010-12-09
US20120132671A1 (en) 2012-05-31
EP2438998A4 (en) 2017-11-08

Similar Documents

Publication Publication Date Title
PL2519451T3 (pl) Przyrząd dozujący z pokrywą i czerpakiem oraz sposób dozowania
PL2282787T3 (pl) Sposób i urządzenie do rozdzielania komórek tkanki z cieczy
HK1166287A1 (zh) 高粘性材料的定量排出裝置以及方法
ZA201303117B (en) Device and method for dispensing liquids
HK1175537A1 (zh) 吐出裝置和液體分注裝置以及液體分注方法
PL2631613T3 (pl) Sposób i układ do kalibrowania układu dozowania płynu
EP2503432A4 (en) METHOD AND DEVICE FOR DOUBLE DIFFERENTIATED DETECTION
PL2398595T3 (pl) Urządzenie, wkład i sposób dozowania cieczy
EP2471606A4 (en) DROPLET DISCHARGE DEVICE AND DROPLET DISCHARGE METHOD
HU1000286D0 (en) Dispensing unit and method for dispensing a liquid under pressure
HK1171573A1 (zh) 液體材料的塗布方法以及塗布裝置
GB2474360B (en) Liquid dispensing apparatus
GB2474361C (en) Liquid dispensing apparatus
PL2408690T3 (pl) Urządzenie dozujące do substancji płynnych
HK1175363A1 (zh) 經皮給藥的分配裝置和方法
EP2627976A4 (en) METHOD AND APPARATUS FOR INDICATING A CRITICAL LEVEL OF A LIQUID FLOW
EP2469922A4 (en) METHOD AND DEVICE FOR STARTING A CELL MEASUREMENT
SG175199A1 (en) Apparatus and method for dispensing a liquid
PL2651562T3 (pl) Urządzenie do zwilżania ziarnek cieczą oraz sposób zwilżania ziarnek cieczą
GB0915006D0 (en) Device for storing and dispensing a material and method of making such a device
IL215951A0 (en) Device for reducing loss of liquid during fraction collection
HK1166288A1 (zh) 液體定量排出方法以及裝置
PL2475244T3 (pl) Sposób i urządzenie do wyznaczania ilości podczas przetłaczania cieczy
PL2403619T3 (pl) Urządzenie i sposób oczyszczania płynu
PL2465610T3 (pl) Urządzenie i sposób dezintegracji ścieków